JP4265394B2 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
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- JP4265394B2 JP4265394B2 JP2003418862A JP2003418862A JP4265394B2 JP 4265394 B2 JP4265394 B2 JP 4265394B2 JP 2003418862 A JP2003418862 A JP 2003418862A JP 2003418862 A JP2003418862 A JP 2003418862A JP 4265394 B2 JP4265394 B2 JP 4265394B2
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Description
Alワイヤが用いられており、一般的に、ワイヤは超音波ボンディングにより接続されている。
23に厚さ約3μmの無電解ニッケル−リンめっきと厚さ約1μmの無電解金めっきを施した(図示せず)。
μmの銅と厚さ約25μmのポリイミドを積層した片面銅張りポリイミドフィルム(宇部興産社製:ユピセルN)を用意した。次に、エッチングで回路導体34を形成し、パッド部35a,35bが開口した厚さ約15μmのソルダーレジスト36(太陽インキ社製:PSR−9000)をフォトリソグラフ法により形成した。続いて、接合部32に径約
50μm,高さ約75μmの金属バンプ33を電解銅めっきにより形成した。さらに、金属バンプ33に厚さ約3μmの無電解ニッケル−リンめっきと厚さ約1μmの無電解金めっきを施した(図示せず)。
56とパワーモジュール53とをフレキシブルプリント配線板52を介して電気的に接続し、冷却フィン,平滑コンデンサ(図示せず)を接続し、電力変換装置を作製した。なお、本実施例では、帯状導体50と内部接続導体47との接続にはんだ44bを用いたが、主電極の接続と同様に、帯状導体50に金属バンプを形成し、金属バンプと内部接続導体47とを溶接してもよい。
Claims (8)
- 金属性ベースおよび前記金属性ベースに固着されると共に接続導体がインサート成形されたケースを有し、前記ケース内部にパワー半導体素子をベアチップ実装する電力変換装置において、
前記パワー半導体素子は一方の面に第1の主電極を、また反対面に第2の主電極を有し、
前記パワー半導体素子の第1の主電極は前記金属性ベースに電気的に絶縁された状態で対向し、前記パワー半導体素子の第2の主電極は前記金属性ベースとは反対の方向を向き、
前記ケースにインサート成形された前記接続導体は前記ケース内で前記金属性ベースとは反対の方向に電気的な接続面を有し、
金属性の帯状導体の一端の接続面が前記接続導体の接続面に固定され、前記帯状導体の他端の接続面には複数の金属バンプが形成され、
前記帯状導体の他端の接続面に形成された複数の金属バンプが溶接により前記パワー半導体素子の第2の主電極に固定されていることを特徴とする電力変換装置。 - 金属性ベースおよび前記金属性ベースに固着されると共に接続導体がインサート成形されたケースを有し、前記ケース内部にパワー半導体素子をベアチップ実装する電力変換装置において、
前記パワー半導体素子は一方の面に第1の主電極を、また反対面に第2の主電極を有し、
前記パワー半導体素子の第1の主電極は前記金属性ベースに電気的に絶縁された状態で対向し、前記パワー半導体素子の第2の主電極は前記金属性ベースとは反対の方向を向き、
前記ケースにインサート成形された前記接続導体は前記ケース内で前記金属性ベースとは反対の方向に電気的な接続面を有し、
金属性の帯状導体の一端の接続面が前記接続導体の接続面に固定され、前記帯状導体の他端の接続面には複数の金属バンプが形成され、
前記帯状導体の他端の接続面に形成された複数の金属バンプが溶接により前記パワー半導体素子の第2の主電極に固定され、
前記帯状導体は一端の接続面と他端の接続面との間に屈曲部を有していることを特徴とする電力変換装置。 - 金属性ベースおよび前記金属性ベースに固着されると共に接続導体がインサート成形されたケースを有し、前記ケース内部にパワー半導体素子をベアチップ実装する電力変換装置において、
前記パワー半導体素子は一方の面に第1の主電極を、また反対面に第2の主電極を有し、
前記パワー半導体素子の第1の主電極は前記金属性ベースに電気的に絶縁された状態で対向しており、
前記パワー半導体素子の第2の主電極は前記金属性ベースとは反対の方向を向くと共にアルミ材で形成されており、
前記ケースにインサート成形された前記接続導体は前記ケース内で前記金属性ベースとは反対の方向に電気的な接続面を有し、
前記接続導体の前記接続面と前記ベアチップ実装されたパワー半導体素子の第2の主電極とは屈曲部を有する帯状導体で電気的に接続し、
前記帯状導体の一端の接続面が前記接続導体の接続面に接続され、前記帯状導体の他端の接続面には複数の金属バンプが形成され、
前記帯状導体の他端の接続面に形成された複数の金属バンプが溶接により前記パワー半導体素子の第2の主電極に固定され、
前記複数の金属バンプがニッケル又はアルミで形成されていることを特徴とする電力変換装置。 - 請求項1乃至3のいずれか1項に記載の電力変換装置において、
前記ケース内にシリコンゲルが充填されていることを特徴とする電力変換装置。 - 請求項1乃至4のいずれか1項に記載の電力変換装置において、
前記帯状導体は、芯の部分と表面部とで材料が異なる構造で作られていることを特徴とする電力変換装置。 - 請求項1乃至5のいずれか1項に記載の電力変換装置において、
前記帯状導体の一端の接続面に複数の金属バンプが形成され、
前記帯状導体の一端の接続面に複数の金属バンプが前記接続導体の接続面に溶接により固定されていることを特徴とする電力変換装置。 - 請求項1乃至6のいずれか1項に記載の電力変換装置において、
前記ベアチップ実装されたパワー半導体素子の制御電極にはフレキシブルプリント基板が電気的に接続されており、前記フレキシブルプリント基板の前記制御電極との接続部には金属バンプが形成され、前記フレキシブルプリント基板の金属バンプが超音波溶接により前記制御電極に固定されていることを特徴とする電力変換装置。 - ケースと、
前記ケースにインサート成形された接続導体と、
前記ケースに接着された金属ベースと、
前記金属ベースに絶縁基板を介して電気的に絶縁されて設けられたパワー半導体素子と、
前記パワー半導体素子と前記絶縁基板との間に設けられた第一の主電極と、
前記第一の主電極に前記パワー半導体素子を介して設けられた第二の主電極と、
前記接続導体と前記第二の主電極とを電気的に接続する帯状導体と、
前記帯状導体の前記第二の主電極との接続面に複数の金属バンプを有する電力変換装置。
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JP2003418862A JP4265394B2 (ja) | 2003-12-17 | 2003-12-17 | 電力変換装置 |
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JP2003418862A JP4265394B2 (ja) | 2003-12-17 | 2003-12-17 | 電力変換装置 |
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JP4265394B2 true JP4265394B2 (ja) | 2009-05-20 |
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US7518236B2 (en) * | 2005-10-26 | 2009-04-14 | General Electric Company | Power circuit package and fabrication method |
JP4612550B2 (ja) * | 2006-01-17 | 2011-01-12 | 超音波工業株式会社 | パワーデバイス用ボンディングリボンおよびこれを用いたボンディング方法 |
JP4722757B2 (ja) * | 2006-04-19 | 2011-07-13 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP4474431B2 (ja) | 2007-03-26 | 2010-06-02 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 半導体パッケージおよび該製造方法 |
JP2009038139A (ja) * | 2007-07-31 | 2009-02-19 | Panasonic Corp | 半導体装置およびその製造方法 |
US7977804B2 (en) * | 2008-05-16 | 2011-07-12 | Tektronix, Inc. | Ball-bump bonded ribbon-wire interconnect |
DE102009024385B4 (de) * | 2009-06-09 | 2011-03-17 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung eines Leistungshalbleitermoduls und Leistungshalbleitermodul mit einer Verbindungseinrichtung |
JP5842489B2 (ja) * | 2011-09-14 | 2016-01-13 | 三菱電機株式会社 | 半導体装置 |
JP5660076B2 (ja) | 2012-04-26 | 2015-01-28 | 三菱電機株式会社 | 半導体装置とその製造方法 |
JP6092644B2 (ja) * | 2013-02-07 | 2017-03-08 | 株式会社ダイワ工業 | 半導体モジュール |
WO2015079600A1 (ja) | 2013-11-26 | 2015-06-04 | 三菱電機株式会社 | パワーモジュール、及びパワーモジュールの製造方法 |
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