JP5655244B2 - 配線基板およびその製造方法、並びに半導体装置およびその製造方法 - Google Patents

配線基板およびその製造方法、並びに半導体装置およびその製造方法 Download PDF

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Publication number
JP5655244B2
JP5655244B2 JP2010245359A JP2010245359A JP5655244B2 JP 5655244 B2 JP5655244 B2 JP 5655244B2 JP 2010245359 A JP2010245359 A JP 2010245359A JP 2010245359 A JP2010245359 A JP 2010245359A JP 5655244 B2 JP5655244 B2 JP 5655244B2
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Japan
Prior art keywords
opening
wiring
layer
wiring board
hole
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JP2010245359A
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English (en)
Japanese (ja)
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JP2012099610A5 (enExample
JP2012099610A (ja
Inventor
芳樹 奥島
芳樹 奥島
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2010245359A priority Critical patent/JP5655244B2/ja
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Publication of JP2012099610A5 publication Critical patent/JP2012099610A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16265—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19103—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2010245359A 2010-11-01 2010-11-01 配線基板およびその製造方法、並びに半導体装置およびその製造方法 Active JP5655244B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010245359A JP5655244B2 (ja) 2010-11-01 2010-11-01 配線基板およびその製造方法、並びに半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010245359A JP5655244B2 (ja) 2010-11-01 2010-11-01 配線基板およびその製造方法、並びに半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2012099610A JP2012099610A (ja) 2012-05-24
JP2012099610A5 JP2012099610A5 (enExample) 2013-09-05
JP5655244B2 true JP5655244B2 (ja) 2015-01-21

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JP (1) JP5655244B2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10849232B2 (en) 2019-02-11 2020-11-24 Samsung Electro-Mechanics Co., Ltd. Printed circuit board
US11355426B2 (en) 2020-07-31 2022-06-07 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116548A (ja) 2012-12-12 2014-06-26 Ngk Spark Plug Co Ltd 多層配線基板およびその製造方法
JP5462404B1 (ja) * 2013-09-12 2014-04-02 太陽誘電株式会社 部品内蔵基板及び部品内蔵基板用コア基材
KR102306719B1 (ko) * 2015-04-22 2021-09-30 삼성전기주식회사 인쇄회로기판, 그 제조방법, 및 전자부품 모듈
KR101666757B1 (ko) * 2015-07-13 2016-10-24 앰코 테크놀로지 코리아 주식회사 반도체 패키지
JP2017123459A (ja) * 2016-01-08 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板
KR102767455B1 (ko) * 2020-01-20 2025-02-14 삼성전자주식회사 차단층을 포함하는 반도체 패키지
US11257742B2 (en) 2020-07-02 2022-02-22 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3894640B2 (ja) * 1997-12-25 2007-03-22 大日本印刷株式会社 配線基板の製造方法
JP2005197763A (ja) * 1999-03-30 2005-07-21 Ngk Spark Plug Co Ltd コンデンサ付属配線基板、配線基板、及びコンデンサ
JP3582645B2 (ja) * 2000-05-16 2004-10-27 日立エーアイシー株式会社 立体形配線板の製造方法
JP2004235222A (ja) * 2003-01-28 2004-08-19 Airex Inc プリント配線板の製造方法
JP4581768B2 (ja) * 2005-03-16 2010-11-17 ソニー株式会社 半導体装置の製造方法
JP4906903B2 (ja) * 2009-10-20 2012-03-28 新光電気工業株式会社 電子部品内蔵基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10849232B2 (en) 2019-02-11 2020-11-24 Samsung Electro-Mechanics Co., Ltd. Printed circuit board
US11355426B2 (en) 2020-07-31 2022-06-07 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same

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JP2012099610A (ja) 2012-05-24

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