JP5637916B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP5637916B2 JP5637916B2 JP2011080794A JP2011080794A JP5637916B2 JP 5637916 B2 JP5637916 B2 JP 5637916B2 JP 2011080794 A JP2011080794 A JP 2011080794A JP 2011080794 A JP2011080794 A JP 2011080794A JP 5637916 B2 JP5637916 B2 JP 5637916B2
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- 239000004065 semiconductor Substances 0.000 title claims description 155
- 238000004519 manufacturing process Methods 0.000 title claims description 38
- 210000000746 body region Anatomy 0.000 claims description 82
- 239000000758 substrate Substances 0.000 claims description 52
- 239000013078 crystal Substances 0.000 claims description 37
- 230000003647 oxidation Effects 0.000 claims description 18
- 238000007254 oxidation reaction Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 100
- 238000000034 method Methods 0.000 description 34
- 238000005530 etching Methods 0.000 description 20
- 229910010271 silicon carbide Inorganic materials 0.000 description 20
- 230000005684 electric field Effects 0.000 description 19
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 16
- 238000000151 deposition Methods 0.000 description 10
- 230000015556 catabolic process Effects 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 229920005591 polysilicon Polymers 0.000 description 5
- 238000001259 photo etching Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
Description
(特徴1)セルエリアに形成されている半導体構造はMOSFET構造である。
(特徴2)セルエリアに形成されている半導体構造はIGBT構造である。
111:ドレイン領域
112:ドリフト領域
113:トレンチ
122:ゲート電極
141:ボディ領域
171:酸化膜
172:ゲート酸化膜
B1:境界面
P1:第1位置
P2:第2位置
Claims (2)
- 少なくとも1つのトレンチが形成されているSiCの半導体基板を備えており、
半導体基板は、第2導電型のドリフト領域の表面に第1導電型のボディ領域が積層されており、
トレンチは、半導体基板の表面からボディ領域を貫通してドリフト領域に達しており、
トレンチの第1の側壁と第2の側壁とが、トレンチの底部において互いに90°の角度を有して接合しており、
トレンチの底部および側壁は絶縁層で被覆されており、
トレンチの底部を被覆している絶縁層の上面は、ドリフト領域とボディ領域との境界面よりも下方側に位置しており、
第1の側壁と第2の側壁の結晶面は、(11−20)と(1−100)の組合せ、(11−20)と(000−1)の組合せ、(1−100)と(000−1)の組合せ、の何れかとされていることを特徴とする半導体装置。 - 少なくとも1つのトレンチを備えており、
半導体基板の材料はSiCであり、
半導体基板は、第2導電型のドリフト領域の表面に第1導電型のボディ領域が積層されており、
トレンチは、半導体基板の表面からボディ領域を貫通してドリフト領域に達しており、
トレンチの第1の側壁と第2の側壁とが、トレンチの底部において互いに90°の角度を有して接合しており、
トレンチの底部および側壁は絶縁層で被覆されており、
トレンチの底部を被覆している絶縁層の上面は、ドリフト領域とボディ領域との境界面よりも下方側に位置している半導体装置を製造する方法であって、
第2導電型のドリフト領域の表面に第1導電型のボディ領域が積層されている半導体基板の表面からボディ領域を貫通してドリフト領域に達している少なくとも1つのトレンチを形成するトレンチ形成工程と、
トレンチの底部および側壁に絶縁層を形成する熱酸化工程と、
を備え、
第1の側壁と第2の側壁の結晶面は、(11−20)と(1−100)の組合せ、(11−20)と(000−1)の組合せ、(1−100)と(000−1)の組合せ、の何れかとされていることを特徴とする半導体装置の製造方法。
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JP2011080794A JP5637916B2 (ja) | 2011-03-31 | 2011-03-31 | 半導体装置及びその製造方法 |
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JP2011080794A JP5637916B2 (ja) | 2011-03-31 | 2011-03-31 | 半導体装置及びその製造方法 |
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JP2012216675A JP2012216675A (ja) | 2012-11-08 |
JP5637916B2 true JP5637916B2 (ja) | 2014-12-10 |
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Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014148294A1 (ja) | 2013-03-19 | 2014-09-25 | 三菱電機株式会社 | 炭化珪素半導体装置の製造方法および通電検査装置 |
CN105074933B (zh) * | 2013-03-19 | 2018-01-23 | 住友电气工业株式会社 | 碳化硅半导体器件及其制造方法 |
JP2014207403A (ja) * | 2013-04-16 | 2014-10-30 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
JP6131689B2 (ja) | 2013-04-16 | 2017-05-24 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
JP2015072944A (ja) * | 2013-10-01 | 2015-04-16 | 住友電気工業株式会社 | 炭化珪素半導体装置およびその製造方法 |
US20150108568A1 (en) * | 2013-10-21 | 2015-04-23 | Vishay-Siliconix | Semiconductor structure with high energy dopant implantation |
CN107078161A (zh) | 2014-08-19 | 2017-08-18 | 维西埃-硅化物公司 | 电子电路 |
JP6453634B2 (ja) * | 2014-12-10 | 2019-01-16 | トヨタ自動車株式会社 | 半導体装置 |
WO2016136230A1 (ja) * | 2015-02-25 | 2016-09-01 | 株式会社デンソー | 半導体装置 |
JP6720569B2 (ja) * | 2015-02-25 | 2020-07-08 | 株式会社デンソー | 半導体装置 |
JP2016164906A (ja) * | 2015-03-06 | 2016-09-08 | 豊田合成株式会社 | 半導体装置およびその製造方法ならびに電力変換装置 |
JP6666671B2 (ja) * | 2015-08-24 | 2020-03-18 | ローム株式会社 | 半導体装置 |
CN111370473A (zh) * | 2020-03-24 | 2020-07-03 | 成都森未科技有限公司 | 一种沟槽型器件及其制备方法 |
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JPH1098188A (ja) * | 1996-08-01 | 1998-04-14 | Kansai Electric Power Co Inc:The | 絶縁ゲート半導体装置 |
JP3719323B2 (ja) * | 1997-03-05 | 2005-11-24 | 株式会社デンソー | 炭化珪素半導体装置 |
US6194741B1 (en) * | 1998-11-03 | 2001-02-27 | International Rectifier Corp. | MOSgated trench type power semiconductor with silicon carbide substrate and increased gate breakdown voltage and reduced on-resistance |
US6191447B1 (en) * | 1999-05-28 | 2001-02-20 | Micro-Ohm Corporation | Power semiconductor devices that utilize tapered trench-based insulating regions to improve electric field profiles in highly doped drift region mesas and methods of forming same |
JP4073176B2 (ja) * | 2001-04-02 | 2008-04-09 | 新電元工業株式会社 | 半導体装置およびその製造方法 |
US6674124B2 (en) * | 2001-11-15 | 2004-01-06 | General Semiconductor, Inc. | Trench MOSFET having low gate charge |
JP4414863B2 (ja) * | 2004-10-29 | 2010-02-10 | トヨタ自動車株式会社 | 絶縁ゲート型半導体装置およびその製造方法 |
US7382019B2 (en) * | 2005-04-26 | 2008-06-03 | Fairchild Semiconductor Corporation | Trench gate FETs with reduced gate to drain charge |
JP4929621B2 (ja) * | 2005-06-15 | 2012-05-09 | 富士電機株式会社 | Mosゲート型炭化珪素半導体装置 |
JP5017855B2 (ja) * | 2005-12-14 | 2012-09-05 | 富士電機株式会社 | 半導体装置の製造方法 |
JP4735414B2 (ja) * | 2006-05-24 | 2011-07-27 | トヨタ自動車株式会社 | 絶縁ゲート型半導体装置 |
JP4798119B2 (ja) * | 2007-11-06 | 2011-10-19 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
JP5612268B2 (ja) * | 2008-03-28 | 2014-10-22 | 株式会社東芝 | 半導体装置及びdc−dcコンバータ |
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