JP5619149B2 - 表面改質六方晶窒化ホウ素粒子 - Google Patents

表面改質六方晶窒化ホウ素粒子 Download PDF

Info

Publication number
JP5619149B2
JP5619149B2 JP2012510961A JP2012510961A JP5619149B2 JP 5619149 B2 JP5619149 B2 JP 5619149B2 JP 2012510961 A JP2012510961 A JP 2012510961A JP 2012510961 A JP2012510961 A JP 2012510961A JP 5619149 B2 JP5619149 B2 JP 5619149B2
Authority
JP
Japan
Prior art keywords
polymer
film
substituted
smhbn
alkyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012510961A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012526830A5 (https=
JP2012526830A (ja
Inventor
ゴヴィンダザミー・パラマジヴァン・ラジェンラン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2012526830A publication Critical patent/JP2012526830A/ja
Publication of JP2012526830A5 publication Critical patent/JP2012526830A5/ja
Application granted granted Critical
Publication of JP5619149B2 publication Critical patent/JP5619149B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C211/00—Compounds containing amino groups bound to a carbon skeleton
    • C07C211/43—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton
    • C07C211/44—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton having amino groups bound to only one six-membered aromatic ring
    • C07C211/45—Monoamines
    • C07C211/46—Aniline
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/77—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by unit-cell parameters, atom positions or structure diagrams
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/88—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by thermal analysis data, e.g. TGA, DTA, DSC
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07B—GENERAL METHODS OF ORGANIC CHEMISTRY; APPARATUS THEREFOR
    • C07B2200/00—Indexing scheme relating to specific properties of organic compounds
    • C07B2200/11—Compounds covalently bound to a solid support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP2012510961A 2009-05-13 2010-05-12 表面改質六方晶窒化ホウ素粒子 Expired - Fee Related JP5619149B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/465,042 2009-05-13
US12/465,042 US8258346B2 (en) 2009-05-13 2009-05-13 Surface modified hexagonal boron nitride particles
PCT/US2010/034462 WO2010132512A2 (en) 2009-05-13 2010-05-12 Surface modified hexagonal boron nitride particles

Publications (3)

Publication Number Publication Date
JP2012526830A JP2012526830A (ja) 2012-11-01
JP2012526830A5 JP2012526830A5 (https=) 2013-06-20
JP5619149B2 true JP5619149B2 (ja) 2014-11-05

Family

ID=43069051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012510961A Expired - Fee Related JP5619149B2 (ja) 2009-05-13 2010-05-12 表面改質六方晶窒化ホウ素粒子

Country Status (6)

Country Link
US (1) US8258346B2 (https=)
EP (1) EP2429943A4 (https=)
JP (1) JP5619149B2 (https=)
KR (1) KR20120024756A (https=)
CN (1) CN102421701B (https=)
WO (1) WO2010132512A2 (https=)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8288466B2 (en) * 2009-05-13 2012-10-16 E I Du Pont De Nemours And Company Composite of a polymer and surface modified hexagonal boron nitride particles
US8258346B2 (en) 2009-05-13 2012-09-04 E I Du Pont De Nemours And Company Surface modified hexagonal boron nitride particles
US8440292B2 (en) * 2009-05-13 2013-05-14 E I Du Pont De Nemours And Company Multi-layer article for flexible printed circuits
US8784980B2 (en) * 2009-05-13 2014-07-22 E I Du Pont De Nemours And Company Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
CN104011124A (zh) 2011-12-16 2014-08-27 提克纳有限责任公司 用于聚芳硫醚组合物的成核体系
CN103998506B (zh) 2011-12-16 2016-08-24 提克纳有限责任公司 用于聚苯硫醚的含硼成核剂
US8852487B2 (en) 2011-12-16 2014-10-07 Ticona Llc Injection molding of polyarylene sulfide compositions
US8796392B2 (en) 2011-12-16 2014-08-05 Ticona Llc Low temperature injection molding of polyarylene sulfide compositions
BR112016000401A2 (pt) * 2013-07-10 2018-03-20 Boron Nitride Power Llc materiais de nitreto de boro funcionalizado como espécies eletroativas em dispositivos de armazenagem de energia eletroquímica
US9745499B2 (en) * 2013-09-06 2017-08-29 Korea Advanced Institute Of Science And Technology Hexagonal boron nitride nanosheet/ceramic nanocomposite powder and producing method of the same, and hexagonal boron nitride nanosheet/ceramic nanocomposite materials and producing method of the same
US9583358B2 (en) 2014-05-30 2017-02-28 Samsung Electronics Co., Ltd. Hardmask composition and method of forming pattern by using the hardmask composition
KR102287343B1 (ko) 2014-07-04 2021-08-06 삼성전자주식회사 하드마스크 조성물 및 이를 이용한 패턴의 형성방법
KR102287344B1 (ko) 2014-07-25 2021-08-06 삼성전자주식회사 하드마스크 조성물 및 이를 이용한 패턴의 형성방법
KR102235501B1 (ko) * 2014-09-12 2021-04-05 엘지이노텍 주식회사 무기충전재 및 이를 포함하는 에폭시 수지 조성물
KR102384226B1 (ko) 2015-03-24 2022-04-07 삼성전자주식회사 하드마스크 조성물 및 이를 이용한 패턴 형성방법
KR102463893B1 (ko) 2015-04-03 2022-11-04 삼성전자주식회사 하드마스크 조성물 및 이를 이용한 패턴의 형성방법
TWI708805B (zh) * 2015-12-30 2020-11-01 美商聖高拜陶器塑膠公司 改質氮化物顆粒、寡聚物官能化氮化物顆粒、基於聚合物之複合材料及其形成方法
JP6632636B2 (ja) * 2016-01-26 2020-01-22 富士フイルム株式会社 表面修飾無機物およびその製造方法、樹脂組成物、熱伝導材料、ならびにデバイス
WO2017158919A1 (ja) * 2016-03-14 2017-09-21 ナミックス株式会社 窒化ホウ素フィラ―、樹脂組成物、フィルム、窒化ホウ素フィラ―の製造方法
CN109134271A (zh) * 2017-06-15 2019-01-04 中国科学院化学研究所 一种对六方氮化硼进行表面改性的方法
US11034847B2 (en) 2017-07-14 2021-06-15 Samsung Electronics Co., Ltd. Hardmask composition, method of forming pattern using hardmask composition, and hardmask formed from hardmask composition
KR102293461B1 (ko) * 2017-07-14 2021-08-25 후지필름 가부시키가이샤 표면 수식 무기 질화물, 조성물, 열전도 재료, 열전도층 부착 디바이스
KR102433666B1 (ko) 2017-07-27 2022-08-18 삼성전자주식회사 하드마스크 조성물, 이를 이용한 패턴의 형성방법 및 상기 하드마스크 조성물을 이용하여 형성된 하드마스크
KR102486388B1 (ko) 2017-07-28 2023-01-09 삼성전자주식회사 그래핀 양자점의 제조방법, 상기 제조방법에 따라 얻어진 그래핀 양자점을 포함한 하드마스크 조성물, 이를 이용한 패턴의 형성방법 및 상기 하드마스크 조성물을 이용하여 형성된 하드마스크
CN109401360B (zh) * 2017-08-18 2020-08-21 中国科学院化学研究所 一种对高温结构陶瓷材料进行表面改性的方法
CN107827770A (zh) * 2017-11-14 2018-03-23 西北工业大学 一种脂肪链接枝的六方氮化硼纳米复合材料及其制备方法
EP3916773A4 (en) 2019-01-23 2022-03-23 FUJIFILM Corporation COMPOSITION, THERMAL FILM AND THERMAL COATING DEVICE
JP7191988B2 (ja) 2019-02-01 2022-12-19 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料
KR102122019B1 (ko) 2019-04-26 2020-06-11 서울대학교산학협력단 질화붕소를 포함하는 폴리올레핀 나노복합재료 및 그 제조방법
KR102291752B1 (ko) * 2020-12-18 2021-08-24 한국기초과학지원연구원 산기 치환 표면 개질 질화붕소, 이의 제조방법 및 이를 함유한 방열성 조성물
CN116694106A (zh) * 2023-06-07 2023-09-05 安徽建筑大学 一种功能化氮化硼及基于其的阻燃导热硅橡胶

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2555515C2 (de) 1975-12-10 1990-04-19 Hoechst Ag, 6230 Frankfurt Verfahren zur Herstellung von einheitlichen 4-Aminobenzoldiazoniumsalzen
US4670325A (en) 1983-04-29 1987-06-02 Ibm Corporation Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure
DE69115171T2 (de) 1990-08-27 1996-05-15 Du Pont Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
JPH07215705A (ja) 1994-02-07 1995-08-15 Shin Etsu Chem Co Ltd シリコーンゴム添加用窒化ほう素粉末およびシリコーンゴム製品
US5554739A (en) * 1994-12-15 1996-09-10 Cabot Corporation Process for preparing carbon materials with diazonium salts and resultant carbon products
JP3794507B2 (ja) * 1995-06-28 2006-07-05 信越化学工業株式会社 高撥水・撥油性ｂｎ粉末
JP2732822B2 (ja) 1995-12-28 1998-03-30 デュポン帝人アドバンスドペーパー株式会社 複合体シートおよびその製造方法
US5681883A (en) 1996-03-05 1997-10-28 Advanced Ceramics Corporation Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
CA2292369A1 (en) * 1998-10-01 2001-06-16 Edison Polymer Innovation Corporation Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method
US6160042A (en) 1997-05-01 2000-12-12 Edison Polymer Innovation Corporation Surface treated boron nitride for forming a low viscosity high thermal conductivity polymer based boron nitride composition and method
JP3948642B2 (ja) 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
US20030148024A1 (en) 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
US6162849A (en) 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
JP4070345B2 (ja) * 1999-02-15 2008-04-02 信越化学工業株式会社 熱伝導性窒化ほう素微粉末、該微粉末を含有する熱伝導性シリコーン組成物、及び絶縁放熱シート
US6623791B2 (en) 1999-07-30 2003-09-23 Ppg Industries Ohio, Inc. Coating compositions having improved adhesion, coated substrates and methods related thereto
US7445797B2 (en) 2005-03-14 2008-11-04 Momentive Performance Materials Inc. Enhanced boron nitride composition and polymer-based compositions made therewith
US7976941B2 (en) 1999-08-31 2011-07-12 Momentive Performance Materials Inc. Boron nitride particles of spherical geometry and process for making thereof
US20070241303A1 (en) 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
JP2001192500A (ja) * 2000-01-12 2001-07-17 Edison Polymer Innovation Corp 低粘度高熱伝導性ポリマー系窒化ホウ素組成物形成用表面処理窒化ホウ素及び該組成物の形成方法
US6764975B1 (en) 2000-11-28 2004-07-20 Saint-Gobain Ceramics & Plastics, Inc. Method for making high thermal diffusivity boron nitride powders
US6652822B2 (en) 2001-05-17 2003-11-25 The Regents Of The University Of California Spherical boron nitride particles and method for preparing them
US7026436B2 (en) 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
US7470990B2 (en) 2004-03-31 2008-12-30 Endicott Interconnect Technologies, Inc. Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
US20060127686A1 (en) 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high thermal conductivity useful in an electronic device
US7524560B2 (en) 2005-08-19 2009-04-28 Momentive Performance Materials Inc. Enhanced boron nitride composition and compositions made therewith
US20070205706A1 (en) 2006-03-01 2007-09-06 General Electric Company Optical Substrate Comprising Boron Nitride Particles
US7658988B2 (en) 2006-04-03 2010-02-09 E. I. Du Pont De Nemours And Company Printed circuits prepared from filled epoxy compositions
US7829188B2 (en) 2006-04-03 2010-11-09 E.I. Du Pont De Nemours And Company Filled epoxy compositions
US20070259211A1 (en) 2006-05-06 2007-11-08 Ning Wang Heat spread sheet with anisotropic thermal conductivity
US7527859B2 (en) * 2006-10-08 2009-05-05 Momentive Performance Materials Inc. Enhanced boron nitride composition and compositions made therewith
JP5491031B2 (ja) 2006-10-11 2014-05-14 住友電気工業株式会社 ポリイミドチューブ、その製造方法、ポリイミドワニスの製造方法、及び定着ベルト
JP2010510168A (ja) 2006-11-22 2010-04-02 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 官能化窒化ホウ素ナノチューブ
JP4858470B2 (ja) * 2008-03-14 2012-01-18 新神戸電機株式会社 無機窒化物粒子およびこれを混合した樹脂組成物
US20090305043A1 (en) 2008-06-06 2009-12-10 E. I. Du Point De Nemours And Company Boron nitride encapsulated in turbostratic carbon and process for making same
US20090304922A1 (en) 2008-06-06 2009-12-10 E.I. Du Pont De Nemours And Company Polymers containing hexagonal boron nitride particles coated with turbostratic carbon and process for preparing the same
US8277936B2 (en) 2008-12-22 2012-10-02 E I Du Pont De Nemours And Company Hexagonal boron nitride compositions characterized by interstitial ferromagnetic layers, process for preparing, and composites thereof with organic polymers
US8258346B2 (en) 2009-05-13 2012-09-04 E I Du Pont De Nemours And Company Surface modified hexagonal boron nitride particles
US8784980B2 (en) 2009-05-13 2014-07-22 E I Du Pont De Nemours And Company Film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
US8440292B2 (en) * 2009-05-13 2013-05-14 E I Du Pont De Nemours And Company Multi-layer article for flexible printed circuits
US8288466B2 (en) * 2009-05-13 2012-10-16 E I Du Pont De Nemours And Company Composite of a polymer and surface modified hexagonal boron nitride particles

Also Published As

Publication number Publication date
US8258346B2 (en) 2012-09-04
HK1169366A1 (en) 2013-01-25
WO2010132512A3 (en) 2011-03-03
EP2429943A4 (en) 2015-03-11
EP2429943A2 (en) 2012-03-21
US20100292508A1 (en) 2010-11-18
KR20120024756A (ko) 2012-03-14
WO2010132512A2 (en) 2010-11-18
CN102421701B (zh) 2014-07-16
JP2012526830A (ja) 2012-11-01
CN102421701A (zh) 2012-04-18

Similar Documents

Publication Publication Date Title
JP5619149B2 (ja) 表面改質六方晶窒化ホウ素粒子
JP5597699B2 (ja) ポリマーおよび表面改質六方晶窒化ホウ素粒子の複合体
JP5597700B2 (ja) ポリマーおよび表面改質六方晶窒化ホウ素粒子を含む流延組成物から製造されるフィルム
JP2012526688A (ja) フレキシブルプリント回路用の多層品
JP6116856B2 (ja) 基板絶縁層組成物、これを用いたプリプレグ及び基板
TWI890808B (zh) 印刷配線板
TW201840716A (zh) 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷配線板
JP2016069401A (ja) プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置
JP2008251900A (ja) フレキシブル基板用積層体及びその製造方法
HK1169366B (en) Surface modified hexagonal boron nitride particles
HK1169430A (en) Composite of a polymer and surface modified hexagonal boron nitride particles
HK1169430B (en) Composite of a polymer and surface modified hexagonal boron nitride particles
HK1169429B (en) A film prepared from a casting composition comprising a polymer and surface modified hexagonal boron nitride particles
HK1169355A (en) Multi-layer article for flexible printed circuits
JP7621112B2 (ja) 金属張積層板及びその製造方法
JP2024022280A (ja) 樹脂フィルム、金属張積層板及び回路基板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130426

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130426

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140224

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140311

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140527

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140819

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140916

R150 Certificate of patent or registration of utility model

Ref document number: 5619149

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees