JP5617418B2 - 半導体基板の積層方法、半導体基板の積層装置およびデバイスの製造方法 - Google Patents

半導体基板の積層方法、半導体基板の積層装置およびデバイスの製造方法 Download PDF

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JP5617418B2
JP5617418B2 JP2010176468A JP2010176468A JP5617418B2 JP 5617418 B2 JP5617418 B2 JP 5617418B2 JP 2010176468 A JP2010176468 A JP 2010176468A JP 2010176468 A JP2010176468 A JP 2010176468A JP 5617418 B2 JP5617418 B2 JP 5617418B2
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substrate
substrates
semiconductor
stacking
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JP2012038860A5 (cg-RX-API-DMAC7.html
JP2012038860A (ja
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菅谷　功
功 菅谷
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Nikon Corp
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JP2010176468A 2010-08-05 2010-08-05 半導体基板の積層方法、半導体基板の積層装置およびデバイスの製造方法 Active JP5617418B2 (ja)

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JP2012038860A5 JP2012038860A5 (cg-RX-API-DMAC7.html) 2013-10-10
JP5617418B2 true JP5617418B2 (ja) 2014-11-05

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Publication number Priority date Publication date Assignee Title
JP5850412B2 (ja) * 2012-10-02 2016-02-03 株式会社デンソー 半導体装置の製造システム及び半導体装置の製造方法
JP6264831B2 (ja) * 2012-11-06 2018-01-24 株式会社ニコン アライメント装置、位置合わせ方法、及び、積層半導体装置の製造方法
JP6600838B2 (ja) * 2016-03-08 2019-11-06 ボンドテック株式会社 アライメント装置およびアライメント方法
KR102651753B1 (ko) * 2016-07-12 2024-03-28 가부시키가이샤 니콘 적층 기판 제조 방법, 적층 기판 제조 장치, 적층 기판 제조 시스템, 및 기판 처리 장치
JP7147778B2 (ja) * 2017-11-02 2022-10-05 株式会社ニコン 積層基板の製造方法、および製造装置
TWI850225B (zh) 2018-04-12 2024-08-01 日商尼康股份有限公司 位置對準方法及位置對準裝置
US11335607B2 (en) * 2020-07-09 2022-05-17 Tokyo Electron Limited Apparatus and methods for wafer to wafer bonding

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JP4543935B2 (ja) * 2005-01-17 2010-09-15 パナソニック株式会社 電子部品実装装置及び実装方法
WO2008153086A1 (ja) * 2007-06-12 2008-12-18 Nikon Corporation 基板検出装置、基板位置決め装置、これらを有する基板貼り合わせ装置、ウェハ外形検出装置、ウェハ位置決め装置、及び、ウェハ外形検出装置及びウェハ外形検出装置を有するウェハ貼り合せ装置
WO2010023935A1 (ja) * 2008-08-29 2010-03-04 株式会社ニコン 基板位置合わせ装置、基板位置合わせ方法および積層型半導体の製造方法

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