JP5607889B2 - 金含有部分めっき用めっき液 - Google Patents

金含有部分めっき用めっき液 Download PDF

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Publication number
JP5607889B2
JP5607889B2 JP2009072107A JP2009072107A JP5607889B2 JP 5607889 B2 JP5607889 B2 JP 5607889B2 JP 2009072107 A JP2009072107 A JP 2009072107A JP 2009072107 A JP2009072107 A JP 2009072107A JP 5607889 B2 JP5607889 B2 JP 5607889B2
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JP
Japan
Prior art keywords
plating
gold
plating solution
cobalt
partial
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Expired - Fee Related
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JP2009072107A
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Japanese (ja)
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JP2009263776A (ja
Inventor
憲一 濱村
文雄 古賀
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METALOR TECHNOLOGIES (JAPAN) CORPORATION
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METALOR TECHNOLOGIES (JAPAN) CORPORATION
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Priority to JP2009072107A priority Critical patent/JP5607889B2/ja
Publication of JP2009263776A publication Critical patent/JP2009263776A/ja
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Publication of JP5607889B2 publication Critical patent/JP5607889B2/ja
Expired - Fee Related legal-status Critical Current
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  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2009072107A 2008-03-31 2009-03-24 金含有部分めっき用めっき液 Expired - Fee Related JP5607889B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009072107A JP5607889B2 (ja) 2008-03-31 2009-03-24 金含有部分めっき用めっき液

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008093800 2008-03-31
JP2008093800 2008-03-31
JP2009072107A JP5607889B2 (ja) 2008-03-31 2009-03-24 金含有部分めっき用めっき液

Publications (2)

Publication Number Publication Date
JP2009263776A JP2009263776A (ja) 2009-11-12
JP5607889B2 true JP5607889B2 (ja) 2014-10-15

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ID=41155052

Family Applications (1)

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JP2009072107A Expired - Fee Related JP5607889B2 (ja) 2008-03-31 2009-03-24 金含有部分めっき用めっき液

Country Status (3)

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JP (1) JP5607889B2 (zh)
CN (1) CN101550571A (zh)
TW (1) TWI434964B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011122192A (ja) * 2009-12-09 2011-06-23 Ne Chemcat Corp 電解硬質金めっき液及びこれを用いるめっき方法
CN103741180B (zh) * 2014-01-10 2015-11-25 哈尔滨工业大学 无氰光亮电镀金添加剂及其应用
CN104726909A (zh) * 2015-03-25 2015-06-24 佛山科学技术学院 一种无氰镀金镍合金电镀液
JP2017186627A (ja) * 2016-04-07 2017-10-12 小島化学薬品株式会社 硬質金めっき溶液

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3551305A (en) * 1967-08-01 1970-12-29 Ian Michael Dalton Gold electroplating electrolytes
JPS4911978B1 (zh) * 1968-11-15 1974-03-20
JPS6415391A (en) * 1987-07-07 1989-01-19 Toppan Printing Co Ltd Plating method for plate object
JPH10287994A (ja) * 1997-04-14 1998-10-27 World Metal:Kk ボンディング部のメッキ構造
JP5317433B2 (ja) * 2007-06-06 2013-10-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 酸性金合金めっき液

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Publication number Publication date
CN101550571A (zh) 2009-10-07
TWI434964B (zh) 2014-04-21
TW201002870A (en) 2010-01-16
JP2009263776A (ja) 2009-11-12

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