JP5603453B1 - 半導体ウェハ保護用粘着テープ - Google Patents
半導体ウェハ保護用粘着テープ Download PDFInfo
- Publication number
- JP5603453B1 JP5603453B1 JP2013093424A JP2013093424A JP5603453B1 JP 5603453 B1 JP5603453 B1 JP 5603453B1 JP 2013093424 A JP2013093424 A JP 2013093424A JP 2013093424 A JP2013093424 A JP 2013093424A JP 5603453 B1 JP5603453 B1 JP 5603453B1
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- adhesive tape
- protecting
- cast film
- film layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Engineering & Computer Science (AREA)
- Dicing (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013093424A JP5603453B1 (ja) | 2013-04-26 | 2013-04-26 | 半導体ウェハ保護用粘着テープ |
CN201480009464.7A CN105103273B (zh) | 2013-04-26 | 2014-04-23 | 半导体晶片保护用粘接带 |
KR1020157016150A KR101554458B1 (ko) | 2013-04-26 | 2014-04-23 | 반도체 웨이퍼 보호용 점착 테이프 |
PCT/JP2014/061401 WO2014175321A1 (ja) | 2013-04-26 | 2014-04-23 | 半導体ウェハ保護用粘着テープ |
TW103114978A TWI494226B (zh) | 2013-04-26 | 2014-04-25 | Adhesive tape for semiconductor wafer protection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013093424A JP5603453B1 (ja) | 2013-04-26 | 2013-04-26 | 半導体ウェハ保護用粘着テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5603453B1 true JP5603453B1 (ja) | 2014-10-08 |
JP2014216517A JP2014216517A (ja) | 2014-11-17 |
Family
ID=51791891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013093424A Active JP5603453B1 (ja) | 2013-04-26 | 2013-04-26 | 半導体ウェハ保護用粘着テープ |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5603453B1 (zh) |
KR (1) | KR101554458B1 (zh) |
CN (1) | CN105103273B (zh) |
TW (1) | TWI494226B (zh) |
WO (1) | WO2014175321A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY185983A (en) * | 2015-11-04 | 2021-06-14 | Lintec Corp | Curable resin film and first protective film forming sheet |
JP6575874B2 (ja) * | 2016-03-09 | 2019-09-18 | パナソニックIpマネジメント株式会社 | 素子チップの製造方法 |
KR20180125977A (ko) * | 2016-03-30 | 2018-11-26 | 린텍 가부시키가이샤 | 필름상 접착제, 반도체 가공용 시트 및 반도체 장치의 제조 방법 |
WO2017195711A1 (ja) * | 2016-05-12 | 2017-11-16 | 住友ベークライト株式会社 | 半導体基板加工用粘着テープ |
JP6651257B2 (ja) * | 2016-06-03 | 2020-02-19 | 株式会社ディスコ | 被加工物の検査方法、検査装置、レーザー加工装置、及び拡張装置 |
US11594441B2 (en) * | 2021-04-09 | 2023-02-28 | Applied Materials, Inc. | Handling for high resistivity substrates |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004065510A1 (ja) * | 2003-01-22 | 2004-08-05 | Lintec Corporation | 粘着シート、半導体ウエハの表面保護方法およびワークの加工方法 |
JP2005340796A (ja) * | 2004-04-28 | 2005-12-08 | Mitsui Chemicals Inc | 半導体ウエハ表面保護フィルム及び該保護フィルムを用いる半導体ウエハの保護方法 |
US20070241436A1 (en) * | 2004-05-18 | 2007-10-18 | Keisuke Ookubo | Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device |
JP2008218930A (ja) * | 2007-03-07 | 2008-09-18 | Furukawa Electric Co Ltd:The | エネルギー線硬化型チップ保護用フィルム |
JP2009231778A (ja) * | 2008-03-25 | 2009-10-08 | Lintec Corp | レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法 |
JP2010225643A (ja) * | 2009-03-19 | 2010-10-07 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
JP2010251722A (ja) * | 2009-03-23 | 2010-11-04 | Furukawa Electric Co Ltd:The | ダイシングテープ、ダイシングテープの硬化阻害防止方法、ダイシングテープ用紫外線硬化型粘着剤 |
JP2011139042A (ja) * | 2009-12-04 | 2011-07-14 | Lintec Corp | ステルスダイシング用粘着シート及び半導体装置の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI304835B (en) * | 2003-06-10 | 2009-01-01 | Hitachi Chemical Co Ltd | Film adhesive and manufacturing method thereof,adhesive sheet and semiconductor device |
JP5805367B2 (ja) * | 2009-01-30 | 2015-11-04 | 日東電工株式会社 | ダイシングテープ一体型ウエハ裏面保護フィルム |
TW201043674A (en) * | 2009-04-17 | 2010-12-16 | Furukawa Electric Co Ltd | Adhesive thin film and wafer processing tape |
WO2012105659A1 (ja) * | 2011-02-04 | 2012-08-09 | 日立化成工業株式会社 | 接着テープ |
TWI671799B (zh) * | 2011-03-30 | 2019-09-11 | Sumitomo Bakelite Co., Ltd. | 半導體晶圓等加工用黏著帶 |
-
2013
- 2013-04-26 JP JP2013093424A patent/JP5603453B1/ja active Active
-
2014
- 2014-04-23 CN CN201480009464.7A patent/CN105103273B/zh active Active
- 2014-04-23 KR KR1020157016150A patent/KR101554458B1/ko active IP Right Grant
- 2014-04-23 WO PCT/JP2014/061401 patent/WO2014175321A1/ja active Application Filing
- 2014-04-25 TW TW103114978A patent/TWI494226B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004065510A1 (ja) * | 2003-01-22 | 2004-08-05 | Lintec Corporation | 粘着シート、半導体ウエハの表面保護方法およびワークの加工方法 |
JP2005340796A (ja) * | 2004-04-28 | 2005-12-08 | Mitsui Chemicals Inc | 半導体ウエハ表面保護フィルム及び該保護フィルムを用いる半導体ウエハの保護方法 |
US20070241436A1 (en) * | 2004-05-18 | 2007-10-18 | Keisuke Ookubo | Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device |
JP2008218930A (ja) * | 2007-03-07 | 2008-09-18 | Furukawa Electric Co Ltd:The | エネルギー線硬化型チップ保護用フィルム |
JP2009231778A (ja) * | 2008-03-25 | 2009-10-08 | Lintec Corp | レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法 |
JP2010225643A (ja) * | 2009-03-19 | 2010-10-07 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ |
JP2010251722A (ja) * | 2009-03-23 | 2010-11-04 | Furukawa Electric Co Ltd:The | ダイシングテープ、ダイシングテープの硬化阻害防止方法、ダイシングテープ用紫外線硬化型粘着剤 |
JP2011139042A (ja) * | 2009-12-04 | 2011-07-14 | Lintec Corp | ステルスダイシング用粘着シート及び半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2014216517A (ja) | 2014-11-17 |
WO2014175321A1 (ja) | 2014-10-30 |
KR101554458B1 (ko) | 2015-09-18 |
CN105103273A (zh) | 2015-11-25 |
CN105103273B (zh) | 2017-04-05 |
TWI494226B (zh) | 2015-08-01 |
KR20150076263A (ko) | 2015-07-06 |
TW201500218A (zh) | 2015-01-01 |
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