JP5603453B1 - 半導体ウェハ保護用粘着テープ - Google Patents

半導体ウェハ保護用粘着テープ Download PDF

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Publication number
JP5603453B1
JP5603453B1 JP2013093424A JP2013093424A JP5603453B1 JP 5603453 B1 JP5603453 B1 JP 5603453B1 JP 2013093424 A JP2013093424 A JP 2013093424A JP 2013093424 A JP2013093424 A JP 2013093424A JP 5603453 B1 JP5603453 B1 JP 5603453B1
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Japan
Prior art keywords
semiconductor wafer
adhesive tape
protecting
cast film
film layer
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JP2013093424A
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English (en)
Japanese (ja)
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JP2014216517A (ja
Inventor
雅人 大倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
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THE FURUKAW ELECTRIC CO., LTD.
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Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2013093424A priority Critical patent/JP5603453B1/ja
Priority to CN201480009464.7A priority patent/CN105103273B/zh
Priority to KR1020157016150A priority patent/KR101554458B1/ko
Priority to PCT/JP2014/061401 priority patent/WO2014175321A1/ja
Priority to TW103114978A priority patent/TWI494226B/zh
Application granted granted Critical
Publication of JP5603453B1 publication Critical patent/JP5603453B1/ja
Publication of JP2014216517A publication Critical patent/JP2014216517A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Engineering & Computer Science (AREA)
  • Dicing (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2013093424A 2013-04-26 2013-04-26 半導体ウェハ保護用粘着テープ Active JP5603453B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013093424A JP5603453B1 (ja) 2013-04-26 2013-04-26 半導体ウェハ保護用粘着テープ
CN201480009464.7A CN105103273B (zh) 2013-04-26 2014-04-23 半导体晶片保护用粘接带
KR1020157016150A KR101554458B1 (ko) 2013-04-26 2014-04-23 반도체 웨이퍼 보호용 점착 테이프
PCT/JP2014/061401 WO2014175321A1 (ja) 2013-04-26 2014-04-23 半導体ウェハ保護用粘着テープ
TW103114978A TWI494226B (zh) 2013-04-26 2014-04-25 Adhesive tape for semiconductor wafer protection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013093424A JP5603453B1 (ja) 2013-04-26 2013-04-26 半導体ウェハ保護用粘着テープ

Publications (2)

Publication Number Publication Date
JP5603453B1 true JP5603453B1 (ja) 2014-10-08
JP2014216517A JP2014216517A (ja) 2014-11-17

Family

ID=51791891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013093424A Active JP5603453B1 (ja) 2013-04-26 2013-04-26 半導体ウェハ保護用粘着テープ

Country Status (5)

Country Link
JP (1) JP5603453B1 (zh)
KR (1) KR101554458B1 (zh)
CN (1) CN105103273B (zh)
TW (1) TWI494226B (zh)
WO (1) WO2014175321A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY185983A (en) * 2015-11-04 2021-06-14 Lintec Corp Curable resin film and first protective film forming sheet
JP6575874B2 (ja) * 2016-03-09 2019-09-18 パナソニックIpマネジメント株式会社 素子チップの製造方法
KR20180125977A (ko) * 2016-03-30 2018-11-26 린텍 가부시키가이샤 필름상 접착제, 반도체 가공용 시트 및 반도체 장치의 제조 방법
WO2017195711A1 (ja) * 2016-05-12 2017-11-16 住友ベークライト株式会社 半導体基板加工用粘着テープ
JP6651257B2 (ja) * 2016-06-03 2020-02-19 株式会社ディスコ 被加工物の検査方法、検査装置、レーザー加工装置、及び拡張装置
US11594441B2 (en) * 2021-04-09 2023-02-28 Applied Materials, Inc. Handling for high resistivity substrates

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004065510A1 (ja) * 2003-01-22 2004-08-05 Lintec Corporation 粘着シート、半導体ウエハの表面保護方法およびワークの加工方法
JP2005340796A (ja) * 2004-04-28 2005-12-08 Mitsui Chemicals Inc 半導体ウエハ表面保護フィルム及び該保護フィルムを用いる半導体ウエハの保護方法
US20070241436A1 (en) * 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
JP2008218930A (ja) * 2007-03-07 2008-09-18 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP2009231778A (ja) * 2008-03-25 2009-10-08 Lintec Corp レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法
JP2010225643A (ja) * 2009-03-19 2010-10-07 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2010251722A (ja) * 2009-03-23 2010-11-04 Furukawa Electric Co Ltd:The ダイシングテープ、ダイシングテープの硬化阻害防止方法、ダイシングテープ用紫外線硬化型粘着剤
JP2011139042A (ja) * 2009-12-04 2011-07-14 Lintec Corp ステルスダイシング用粘着シート及び半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI304835B (en) * 2003-06-10 2009-01-01 Hitachi Chemical Co Ltd Film adhesive and manufacturing method thereof,adhesive sheet and semiconductor device
JP5805367B2 (ja) * 2009-01-30 2015-11-04 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
TW201043674A (en) * 2009-04-17 2010-12-16 Furukawa Electric Co Ltd Adhesive thin film and wafer processing tape
WO2012105659A1 (ja) * 2011-02-04 2012-08-09 日立化成工業株式会社 接着テープ
TWI671799B (zh) * 2011-03-30 2019-09-11 Sumitomo Bakelite Co., Ltd. 半導體晶圓等加工用黏著帶

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004065510A1 (ja) * 2003-01-22 2004-08-05 Lintec Corporation 粘着シート、半導体ウエハの表面保護方法およびワークの加工方法
JP2005340796A (ja) * 2004-04-28 2005-12-08 Mitsui Chemicals Inc 半導体ウエハ表面保護フィルム及び該保護フィルムを用いる半導体ウエハの保護方法
US20070241436A1 (en) * 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
JP2008218930A (ja) * 2007-03-07 2008-09-18 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP2009231778A (ja) * 2008-03-25 2009-10-08 Lintec Corp レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法
JP2010225643A (ja) * 2009-03-19 2010-10-07 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2010251722A (ja) * 2009-03-23 2010-11-04 Furukawa Electric Co Ltd:The ダイシングテープ、ダイシングテープの硬化阻害防止方法、ダイシングテープ用紫外線硬化型粘着剤
JP2011139042A (ja) * 2009-12-04 2011-07-14 Lintec Corp ステルスダイシング用粘着シート及び半導体装置の製造方法

Also Published As

Publication number Publication date
JP2014216517A (ja) 2014-11-17
WO2014175321A1 (ja) 2014-10-30
KR101554458B1 (ko) 2015-09-18
CN105103273A (zh) 2015-11-25
CN105103273B (zh) 2017-04-05
TWI494226B (zh) 2015-08-01
KR20150076263A (ko) 2015-07-06
TW201500218A (zh) 2015-01-01

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