JP5603453B1 - 半導体ウェハ保護用粘着テープ - Google Patents

半導体ウェハ保護用粘着テープ Download PDF

Info

Publication number
JP5603453B1
JP5603453B1 JP2013093424A JP2013093424A JP5603453B1 JP 5603453 B1 JP5603453 B1 JP 5603453B1 JP 2013093424 A JP2013093424 A JP 2013093424A JP 2013093424 A JP2013093424 A JP 2013093424A JP 5603453 B1 JP5603453 B1 JP 5603453B1
Authority
JP
Japan
Prior art keywords
semiconductor wafer
adhesive tape
protecting
cast film
film layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013093424A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014216517A (ja
Inventor
雅人 大倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2013093424A priority Critical patent/JP5603453B1/ja
Priority to CN201480009464.7A priority patent/CN105103273B/zh
Priority to KR1020157016150A priority patent/KR101554458B1/ko
Priority to PCT/JP2014/061401 priority patent/WO2014175321A1/ja
Priority to TW103114978A priority patent/TWI494226B/zh
Application granted granted Critical
Publication of JP5603453B1 publication Critical patent/JP5603453B1/ja
Publication of JP2014216517A publication Critical patent/JP2014216517A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Engineering & Computer Science (AREA)
  • Dicing (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2013093424A 2013-04-26 2013-04-26 半導体ウェハ保護用粘着テープ Active JP5603453B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013093424A JP5603453B1 (ja) 2013-04-26 2013-04-26 半導体ウェハ保護用粘着テープ
CN201480009464.7A CN105103273B (zh) 2013-04-26 2014-04-23 半导体晶片保护用粘接带
KR1020157016150A KR101554458B1 (ko) 2013-04-26 2014-04-23 반도체 웨이퍼 보호용 점착 테이프
PCT/JP2014/061401 WO2014175321A1 (ja) 2013-04-26 2014-04-23 半導体ウェハ保護用粘着テープ
TW103114978A TWI494226B (zh) 2013-04-26 2014-04-25 Adhesive tape for semiconductor wafer protection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013093424A JP5603453B1 (ja) 2013-04-26 2013-04-26 半導体ウェハ保護用粘着テープ

Publications (2)

Publication Number Publication Date
JP5603453B1 true JP5603453B1 (ja) 2014-10-08
JP2014216517A JP2014216517A (ja) 2014-11-17

Family

ID=51791891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013093424A Active JP5603453B1 (ja) 2013-04-26 2013-04-26 半導体ウェハ保護用粘着テープ

Country Status (5)

Country Link
JP (1) JP5603453B1 (zh)
KR (1) KR101554458B1 (zh)
CN (1) CN105103273B (zh)
TW (1) TWI494226B (zh)
WO (1) WO2014175321A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY185983A (en) * 2015-11-04 2021-06-14 Lintec Corp Curable resin film and first protective film forming sheet
JP6575874B2 (ja) * 2016-03-09 2019-09-18 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
KR20180125977A (ko) * 2016-03-30 2018-11-26 린텍 가부시키가이샤 필름상 접착제, 반도체 가공용 시트 및 반도체 장치의 제조 방법
WO2017195711A1 (ja) * 2016-05-12 2017-11-16 住友ベークライト株式会社 半導体基板加工用粘着テープ
JP6651257B2 (ja) * 2016-06-03 2020-02-19 株式会社ディスコ 被加工物の検査方法、検査装置、レーザー加工装置、及び拡張装置
US11594441B2 (en) * 2021-04-09 2023-02-28 Applied Materials, Inc. Handling for high resistivity substrates

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004065510A1 (ja) * 2003-01-22 2004-08-05 Lintec Corporation 粘着シート、半導体ウエハの表面保護方法およびワークの加工方法
JP2005340796A (ja) * 2004-04-28 2005-12-08 Mitsui Chemicals Inc 半導体ウエハ表面保護フィルム及び該保護フィルムを用いる半導体ウエハの保護方法
US20070241436A1 (en) * 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
JP2008218930A (ja) * 2007-03-07 2008-09-18 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP2009231778A (ja) * 2008-03-25 2009-10-08 Lintec Corp レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法
JP2010225643A (ja) * 2009-03-19 2010-10-07 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2010251722A (ja) * 2009-03-23 2010-11-04 Furukawa Electric Co Ltd:The ダイシングテープ、ダイシングテープの硬化阻害防止方法、ダイシングテープ用紫外線硬化型粘着剤
JP2011139042A (ja) * 2009-12-04 2011-07-14 Lintec Corp ステルスダイシング用粘着シート及び半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI304835B (en) * 2003-06-10 2009-01-01 Hitachi Chemical Co Ltd Film adhesive and manufacturing method thereof,adhesive sheet and semiconductor device
JP5805367B2 (ja) * 2009-01-30 2015-11-04 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
TW201043674A (en) * 2009-04-17 2010-12-16 Furukawa Electric Co Ltd Adhesive thin film and wafer processing tape
WO2012105659A1 (ja) * 2011-02-04 2012-08-09 日立化成工業株式会社 接着テープ
TWI671799B (zh) * 2011-03-30 2019-09-11 Sumitomo Bakelite Co., Ltd. 半導體晶圓等加工用黏著帶

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004065510A1 (ja) * 2003-01-22 2004-08-05 Lintec Corporation 粘着シート、半導体ウエハの表面保護方法およびワークの加工方法
JP2005340796A (ja) * 2004-04-28 2005-12-08 Mitsui Chemicals Inc 半導体ウエハ表面保護フィルム及び該保護フィルムを用いる半導体ウエハの保護方法
US20070241436A1 (en) * 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
JP2008218930A (ja) * 2007-03-07 2008-09-18 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP2009231778A (ja) * 2008-03-25 2009-10-08 Lintec Corp レーザーダイシング・ダイボンド兼用シートおよびチップ複合体の製造方法
JP2010225643A (ja) * 2009-03-19 2010-10-07 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2010251722A (ja) * 2009-03-23 2010-11-04 Furukawa Electric Co Ltd:The ダイシングテープ、ダイシングテープの硬化阻害防止方法、ダイシングテープ用紫外線硬化型粘着剤
JP2011139042A (ja) * 2009-12-04 2011-07-14 Lintec Corp ステルスダイシング用粘着シート及び半導体装置の製造方法

Also Published As

Publication number Publication date
JP2014216517A (ja) 2014-11-17
WO2014175321A1 (ja) 2014-10-30
KR101554458B1 (ko) 2015-09-18
CN105103273A (zh) 2015-11-25
CN105103273B (zh) 2017-04-05
TWI494226B (zh) 2015-08-01
KR20150076263A (ko) 2015-07-06
TW201500218A (zh) 2015-01-01

Similar Documents

Publication Publication Date Title
JP2022058712A (ja) 半導体加工用シートおよび半導体装置の製造方法
WO2016148025A1 (ja) 半導体ウェハの処理方法、半導体チップおよび表面保護テープ
JP5603453B1 (ja) 半導体ウェハ保護用粘着テープ
US20110237050A1 (en) Method for processing wafer
JP2010100686A (ja) 自発巻回性粘着シート
KR20070027465A (ko) 점착 시트 및 이 점착 시트를 이용한 제품의 가공 방법
JP6306362B2 (ja) 伸長可能シートおよび積層チップの製造方法
US11056388B2 (en) Mask-integrated surface protective tape
JPWO2017082211A1 (ja) マスク一体型表面保護フィルム
WO2017082212A1 (ja) マスク一体型表面保護テープ
JP2019176021A (ja) 半導体チップの製造方法、表面保護テープ
US11282736B2 (en) Mask-integrated surface protective tape with release liner
US10971387B2 (en) Mask-integrated surface protective tape
JP4234630B2 (ja) 貫通構造を有する薄膜化回路基板の製造方法と保護用粘着テープ
CN109997218B (zh) 隐形切割用粘着片
JP6264865B2 (ja) ダイシングフィルム
WO2023281996A1 (ja) 粘着テープ
JP6190134B2 (ja) ダイシングシート用基材フィルム、ダイシングシート、ダイシングシート用基材フィルムの製造方法およびチップ状部材の製造方法
KR20220136091A (ko) 워크 가공용 시트
JP2019134091A (ja) マスク一体型表面保護テープおよびマスク一体型表面保護テープを用いる半導体チップの製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140707

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140729

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140821

R151 Written notification of patent or utility model registration

Ref document number: 5603453

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350