JP5603314B2 - 搬送装置及び基板処理システム - Google Patents

搬送装置及び基板処理システム Download PDF

Info

Publication number
JP5603314B2
JP5603314B2 JP2011264099A JP2011264099A JP5603314B2 JP 5603314 B2 JP5603314 B2 JP 5603314B2 JP 2011264099 A JP2011264099 A JP 2011264099A JP 2011264099 A JP2011264099 A JP 2011264099A JP 5603314 B2 JP5603314 B2 JP 5603314B2
Authority
JP
Japan
Prior art keywords
housing
end effector
drive mechanism
air blowing
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011264099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013118229A5 (enExample
JP2013118229A (ja
Inventor
勤 廣木
郁夫 沢田
和愛 松崎
芳樹 福原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011264099A priority Critical patent/JP5603314B2/ja
Priority to KR1020147014689A priority patent/KR101552805B1/ko
Priority to PCT/JP2012/080766 priority patent/WO2013081013A1/ja
Priority to US14/361,869 priority patent/US9165810B2/en
Priority to TW101144902A priority patent/TWI518829B/zh
Publication of JP2013118229A publication Critical patent/JP2013118229A/ja
Publication of JP2013118229A5 publication Critical patent/JP2013118229A5/ja
Application granted granted Critical
Publication of JP5603314B2 publication Critical patent/JP5603314B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2011264099A 2011-12-01 2011-12-01 搬送装置及び基板処理システム Expired - Fee Related JP5603314B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011264099A JP5603314B2 (ja) 2011-12-01 2011-12-01 搬送装置及び基板処理システム
KR1020147014689A KR101552805B1 (ko) 2011-12-01 2012-11-28 반송 장치 및 기판 처리 시스템
PCT/JP2012/080766 WO2013081013A1 (ja) 2011-12-01 2012-11-28 搬送装置及び基板処理システム
US14/361,869 US9165810B2 (en) 2011-12-01 2012-11-28 Conveyance device and substrate processing system
TW101144902A TWI518829B (zh) 2011-12-01 2012-11-30 Conveying device and substrate processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011264099A JP5603314B2 (ja) 2011-12-01 2011-12-01 搬送装置及び基板処理システム

Publications (3)

Publication Number Publication Date
JP2013118229A JP2013118229A (ja) 2013-06-13
JP2013118229A5 JP2013118229A5 (enExample) 2014-07-31
JP5603314B2 true JP5603314B2 (ja) 2014-10-08

Family

ID=48535464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011264099A Expired - Fee Related JP5603314B2 (ja) 2011-12-01 2011-12-01 搬送装置及び基板処理システム

Country Status (5)

Country Link
US (1) US9165810B2 (enExample)
JP (1) JP5603314B2 (enExample)
KR (1) KR101552805B1 (enExample)
TW (1) TWI518829B (enExample)
WO (1) WO2013081013A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9857124B2 (en) * 2015-03-20 2018-01-02 Tokyo Electron Limited Clamp apparatus, substrate carry-in/out apparatus using the same, and substrate processing apparatus

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6468848B2 (ja) * 2015-01-13 2019-02-13 株式会社ディスコ 搬送装置
JP6553388B2 (ja) 2015-03-31 2019-07-31 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置、基板処理装置および基板搬送方法
JP6564642B2 (ja) * 2015-07-23 2019-08-21 東京エレクトロン株式会社 基板搬送室、基板処理システム、及び基板搬送室内のガス置換方法
CN105292980B (zh) * 2015-10-30 2018-01-02 中汽昌兴（洛阳）机电设备工程有限公司 一种输送系统及其吊具、输送装置
US11373891B2 (en) * 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
JP7316104B2 (ja) * 2019-06-14 2023-07-27 株式会社日立ハイテク ウエハ搬送装置
JP7401219B2 (ja) 2019-07-31 2023-12-19 ニデックインスツルメンツ株式会社 産業用ロボット
JP7741818B2 (ja) * 2020-05-29 2025-09-18 エルピーイー ソシエタ ペル アチオニ オーバーヘッドスクリーンを有する基板を取り扱うためのツール、並びに関連する取り扱い方法及びエピタキシャル反応器
US11666951B2 (en) * 2020-07-10 2023-06-06 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer handler cleaning tool
JP7555210B2 (ja) * 2020-07-29 2024-09-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
WO2025205177A1 (ja) * 2024-03-29 2025-10-02 東京エレクトロン株式会社 搬送装置及び排気方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2503732Y2 (ja) * 1994-04-22 1996-07-03 大日本スクリーン製造株式会社 半導体製造装置
JPH1131730A (ja) * 1997-07-14 1999-02-02 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100742026B1 (ko) * 2000-12-08 2007-07-23 동경 엘렉트론 주식회사 반도체 처리 시스템 및 피처리체 반송 방법
JP2003007799A (ja) * 2001-06-21 2003-01-10 Tokyo Electron Ltd 処理システム
KR100483428B1 (ko) * 2003-01-24 2005-04-14 삼성전자주식회사 기판 가공 장치
KR100583730B1 (ko) * 2004-06-29 2006-05-26 삼성전자주식회사 기판 이송 시스템 및 상기 시스템의 프레임 내 압력을조절하는 방법
US20070233313A1 (en) * 2006-03-28 2007-10-04 Tokyo Electron Limited Transfer pick, transfer device, substrate processing apparatus and transfer pick cleaning method
JP4896899B2 (ja) * 2007-01-31 2012-03-14 東京エレクトロン株式会社 基板処理装置およびパーティクル付着防止方法
JP4959457B2 (ja) * 2007-07-26 2012-06-20 東京エレクトロン株式会社 基板搬送モジュール及び基板処理システム
JP4359640B2 (ja) * 2007-09-25 2009-11-04 東京エレクトロン株式会社 基板搬送装置及びダウンフロー制御方法
US8757026B2 (en) * 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP5131094B2 (ja) * 2008-08-29 2013-01-30 東京エレクトロン株式会社 熱処理装置及び熱処理方法並びに記憶媒体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9857124B2 (en) * 2015-03-20 2018-01-02 Tokyo Electron Limited Clamp apparatus, substrate carry-in/out apparatus using the same, and substrate processing apparatus

Also Published As

Publication number Publication date
KR20140100484A (ko) 2014-08-14
TW201339073A (zh) 2013-10-01
WO2013081013A1 (ja) 2013-06-06
US9165810B2 (en) 2015-10-20
KR101552805B1 (ko) 2015-09-11
JP2013118229A (ja) 2013-06-13
TWI518829B (zh) 2016-01-21
US20150125238A1 (en) 2015-05-07

Similar Documents

Publication Publication Date Title
JP5603314B2 (ja) 搬送装置及び基板処理システム
JP6968131B2 (ja) ファクトリインターフェースの環境制御を伴う基板処理のシステム、装置、及び方法
KR101290980B1 (ko) 기판 처리 장치 및 반도체 장치의 제조 방법
JP2022058860A (ja) 統合バッファを備えたウエハ搬送アセンブリ
CN109560021B (zh) 基板处理装置、基板处理方法以及计算机存储介质
CN102064123B (zh) 半导体被处理基板的真空处理系统及半导体被处理基板的真空处理方法
JP2017538291A (ja) 基板キャリア及びパージチャンバの環境制御を伴う基板処理のシステム、装置、及び方法
KR20140123479A (ko) 기판 수용 용기의 퍼지 장치 및 퍼지 방법
US20150228520A1 (en) Substrate Transfer Robot and Substrate Processing Apparatus Using The Same
JP2022104056A (ja) 搬送装置
JP6016931B2 (ja) 基板処理装置、基板処理方法、及び半導体装置の製造方法
JP6120621B2 (ja) 真空処理装置及びその運転方法
TW202230584A (zh) 基板處理裝置
JP2016066689A (ja) 容器清掃装置及び容器清掃方法
JP5710194B2 (ja) 真空処理装置
JP5923197B2 (ja) 基板処理装置および半導体装置の製造方法
JP2012169534A (ja) 基板処理装置及び半導体装置の製造方法
KR102046279B1 (ko) 진공로봇을 이용한 이송장치
CN107689336B (zh) 盖体和使用了该盖体的基板处理装置
WO2019039316A1 (ja) 基板処理装置及び基板搬送方法
JP2008028035A (ja) 半導体製造装置
KR102205383B1 (ko) 기판 처리 장치 및 기판 처리 방법
TWI790731B (zh) 基板搬送裝置
KR20140107646A (ko) 로드록 장치 및 이를 구비한 진공처리장치
JP2025042988A (ja) 半導体製造装置および半導体装置の製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140618

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140618

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20140618

TRDD Decision of grant or rejection written
A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20140805

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140812

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140821

R150 Certificate of patent or registration of utility model

Ref document number: 5603314

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees