JP5587935B2 - Ｓｎめっき材 - Google Patents

Ｓｎめっき材 Download PDF

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Publication number
JP5587935B2
JP5587935B2 JP2012083213A JP2012083213A JP5587935B2 JP 5587935 B2 JP5587935 B2 JP 5587935B2 JP 2012083213 A JP2012083213 A JP 2012083213A JP 2012083213 A JP2012083213 A JP 2012083213A JP 5587935 B2 JP5587935 B2 JP 5587935B2
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JP
Japan
Prior art keywords
layer
plating
alloy
reflow
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012083213A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013213249A (ja
Inventor
宏司 原田
慶太郎 金濱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2012083213A priority Critical patent/JP5587935B2/ja
Priority to TW102102404A priority patent/TWI479052B/zh
Priority to KR1020130029205A priority patent/KR101464074B1/ko
Priority to CN201310103617.1A priority patent/CN103361693B/zh
Publication of JP2013213249A publication Critical patent/JP2013213249A/ja
Application granted granted Critical
Publication of JP5587935B2 publication Critical patent/JP5587935B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2012083213A 2012-03-30 2012-03-30 Ｓｎめっき材 Active JP5587935B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012083213A JP5587935B2 (ja) 2012-03-30 2012-03-30 Ｓｎめっき材
TW102102404A TWI479052B (zh) 2012-03-30 2013-01-23 Tin plating materials
KR1020130029205A KR101464074B1 (ko) 2012-03-30 2013-03-19 Sn 도금재
CN201310103617.1A CN103361693B (zh) 2012-03-30 2013-03-28 镀Sn材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012083213A JP5587935B2 (ja) 2012-03-30 2012-03-30 Ｓｎめっき材

Publications (2)

Publication Number Publication Date
JP2013213249A JP2013213249A (ja) 2013-10-17
JP5587935B2 true JP5587935B2 (ja) 2014-09-10

Family

ID=49363918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012083213A Active JP5587935B2 (ja) 2012-03-30 2012-03-30 Ｓｎめっき材

Country Status (4)

Country Link
JP (1) JP5587935B2 (zh)
KR (1) KR101464074B1 (zh)
CN (1) CN103361693B (zh)
TW (1) TWI479052B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104604036A (zh) * 2012-08-31 2015-05-06 株式会社自动网络技术研究所 连接器用镀敷端子以及端子对
JP2015225704A (ja) * 2014-05-26 2015-12-14 矢崎総業株式会社 端子
JP6160582B2 (ja) 2014-09-11 2017-07-12 三菱マテリアル株式会社 錫めっき銅合金端子材及びその製造方法
JP5984980B2 (ja) * 2015-02-24 2016-09-06 Ｊｘ金属株式会社 電子部品用Ｓｎめっき材

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614328A (en) * 1995-01-19 1997-03-25 The Furukawa Electric Co. Ltd. Reflow-plated member and a manufacturing method therefor
JP4308931B2 (ja) * 1997-11-04 2009-08-05 三菱伸銅株式会社 ＳｎまたはＳｎ合金メッキ銅合金薄板およびその薄板で製造したコネクタ
JP2000169995A (ja) * 1998-09-28 2000-06-20 Nippon Mining & Metals Co Ltd 金属材料
DE19963385C1 (de) * 1999-12-28 2001-01-25 Federal Mogul Wiesbaden Gmbh Schichtverbundwerkstoff für Gleitlager
JP3874621B2 (ja) * 2001-03-30 2007-01-31 株式会社神戸製鋼所 嵌合型接続端子用Ｓｎめっき銅合金材料及び嵌合型接続端子
JP3880877B2 (ja) * 2002-03-29 2007-02-14 Ｄｏｗａホールディングス株式会社 めっきを施した銅または銅合金およびその製造方法
JP4024244B2 (ja) * 2004-12-27 2007-12-19 株式会社神戸製鋼所 接続部品用導電材料及びその製造方法
JP3926355B2 (ja) * 2004-09-10 2007-06-06 株式会社神戸製鋼所 接続部品用導電材料及びその製造方法
WO2006028189A1 (ja) * 2004-09-10 2006-03-16 Kabushiki Kaisha Kobe Seiko Sho 接続部品用導電材料及びその製造方法
JP2006283149A (ja) * 2005-04-01 2006-10-19 Nikko Kinzoku Kk 銅又は銅合金の表面処理方法、表面処理材及びこれを用いた電子部品
JP5319101B2 (ja) * 2007-10-31 2013-10-16 Ｊｘ日鉱日石金属株式会社 電子部品用Ｓｎめっき材
JP4611419B2 (ja) * 2008-12-26 2011-01-12 Ｊｘ日鉱日石金属株式会社 はんだ濡れ性、挿抜性に優れた銅合金すずめっき条
JP4987028B2 (ja) * 2009-03-31 2012-07-25 Ｊｘ日鉱日石金属株式会社 プリント基板端子用銅合金すずめっき材
JP5419594B2 (ja) * 2009-08-24 2014-02-19 株式会社神戸製鋼所 アルミニウム製導電部材との接続に用いられる接続部品用錫めっき付銅又は銅合金材料
JP5389097B2 (ja) * 2011-03-31 2014-01-15 Ｊｘ日鉱日石金属株式会社 Ｓｎめっき材
JP6103811B2 (ja) * 2012-03-30 2017-03-29 株式会社神戸製鋼所 接続部品用導電材料

Also Published As

Publication number Publication date
CN103361693A (zh) 2013-10-23
TWI479052B (zh) 2015-04-01
KR101464074B1 (ko) 2014-11-21
KR20130111316A (ko) 2013-10-10
CN103361693B (zh) 2016-02-17
TW201339374A (zh) 2013-10-01
JP2013213249A (ja) 2013-10-17

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