JP5587935B2 - Snめっき材 - Google Patents
Snめっき材 Download PDFInfo
- Publication number
- JP5587935B2 JP5587935B2 JP2012083213A JP2012083213A JP5587935B2 JP 5587935 B2 JP5587935 B2 JP 5587935B2 JP 2012083213 A JP2012083213 A JP 2012083213A JP 2012083213 A JP2012083213 A JP 2012083213A JP 5587935 B2 JP5587935 B2 JP 5587935B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plating
- alloy
- reflow
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007747 plating Methods 0.000 title claims description 116
- 239000000463 material Substances 0.000 title claims description 64
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 89
- 229910017755 Cu-Sn Inorganic materials 0.000 claims description 88
- 229910017927 Cu—Sn Inorganic materials 0.000 claims description 88
- 229910045601 alloy Inorganic materials 0.000 claims description 86
- 239000000956 alloy Substances 0.000 claims description 86
- 239000002245 particle Substances 0.000 claims description 60
- 239000010949 copper Substances 0.000 claims description 39
- 229910052802 copper Inorganic materials 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 14
- 239000010410 layer Substances 0.000 description 123
- 239000000843 powder Substances 0.000 description 27
- 238000001816 cooling Methods 0.000 description 24
- 229910000679 solder Inorganic materials 0.000 description 17
- 230000000694 effects Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012083213A JP5587935B2 (ja) | 2012-03-30 | 2012-03-30 | Snめっき材 |
TW102102404A TWI479052B (zh) | 2012-03-30 | 2013-01-23 | Tin plating materials |
KR1020130029205A KR101464074B1 (ko) | 2012-03-30 | 2013-03-19 | Sn 도금재 |
CN201310103617.1A CN103361693B (zh) | 2012-03-30 | 2013-03-28 | 镀Sn材料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012083213A JP5587935B2 (ja) | 2012-03-30 | 2012-03-30 | Snめっき材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013213249A JP2013213249A (ja) | 2013-10-17 |
JP5587935B2 true JP5587935B2 (ja) | 2014-09-10 |
Family
ID=49363918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012083213A Active JP5587935B2 (ja) | 2012-03-30 | 2012-03-30 | Snめっき材 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5587935B2 (ko) |
KR (1) | KR101464074B1 (ko) |
CN (1) | CN103361693B (ko) |
TW (1) | TWI479052B (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104604036A (zh) * | 2012-08-31 | 2015-05-06 | 株式会社自动网络技术研究所 | 连接器用镀敷端子以及端子对 |
JP2015225704A (ja) * | 2014-05-26 | 2015-12-14 | 矢崎総業株式会社 | 端子 |
JP6160582B2 (ja) * | 2014-09-11 | 2017-07-12 | 三菱マテリアル株式会社 | 錫めっき銅合金端子材及びその製造方法 |
JP5984980B2 (ja) * | 2015-02-24 | 2016-09-06 | Jx金属株式会社 | 電子部品用Snめっき材 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5614328A (en) * | 1995-01-19 | 1997-03-25 | The Furukawa Electric Co. Ltd. | Reflow-plated member and a manufacturing method therefor |
JP4308931B2 (ja) * | 1997-11-04 | 2009-08-05 | 三菱伸銅株式会社 | SnまたはSn合金メッキ銅合金薄板およびその薄板で製造したコネクタ |
JP2000169995A (ja) * | 1998-09-28 | 2000-06-20 | Nippon Mining & Metals Co Ltd | 金属材料 |
DE19963385C1 (de) * | 1999-12-28 | 2001-01-25 | Federal Mogul Wiesbaden Gmbh | Schichtverbundwerkstoff für Gleitlager |
JP3874621B2 (ja) * | 2001-03-30 | 2007-01-31 | 株式会社神戸製鋼所 | 嵌合型接続端子用Snめっき銅合金材料及び嵌合型接続端子 |
JP3880877B2 (ja) * | 2002-03-29 | 2007-02-14 | Dowaホールディングス株式会社 | めっきを施した銅または銅合金およびその製造方法 |
JP3926355B2 (ja) * | 2004-09-10 | 2007-06-06 | 株式会社神戸製鋼所 | 接続部品用導電材料及びその製造方法 |
JP4024244B2 (ja) * | 2004-12-27 | 2007-12-19 | 株式会社神戸製鋼所 | 接続部品用導電材料及びその製造方法 |
US7820303B2 (en) * | 2004-09-10 | 2010-10-26 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Conductive material for connecting part and method for manufacturing the conductive material |
JP2006283149A (ja) * | 2005-04-01 | 2006-10-19 | Nikko Kinzoku Kk | 銅又は銅合金の表面処理方法、表面処理材及びこれを用いた電子部品 |
JP5319101B2 (ja) * | 2007-10-31 | 2013-10-16 | Jx日鉱日石金属株式会社 | 電子部品用Snめっき材 |
JP4611419B2 (ja) * | 2008-12-26 | 2011-01-12 | Jx日鉱日石金属株式会社 | はんだ濡れ性、挿抜性に優れた銅合金すずめっき条 |
JP4987028B2 (ja) * | 2009-03-31 | 2012-07-25 | Jx日鉱日石金属株式会社 | プリント基板端子用銅合金すずめっき材 |
JP5419594B2 (ja) * | 2009-08-24 | 2014-02-19 | 株式会社神戸製鋼所 | アルミニウム製導電部材との接続に用いられる接続部品用錫めっき付銅又は銅合金材料 |
JP5389097B2 (ja) * | 2011-03-31 | 2014-01-15 | Jx日鉱日石金属株式会社 | Snめっき材 |
JP6103811B2 (ja) * | 2012-03-30 | 2017-03-29 | 株式会社神戸製鋼所 | 接続部品用導電材料 |
-
2012
- 2012-03-30 JP JP2012083213A patent/JP5587935B2/ja active Active
-
2013
- 2013-01-23 TW TW102102404A patent/TWI479052B/zh active
- 2013-03-19 KR KR1020130029205A patent/KR101464074B1/ko active IP Right Grant
- 2013-03-28 CN CN201310103617.1A patent/CN103361693B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TWI479052B (zh) | 2015-04-01 |
JP2013213249A (ja) | 2013-10-17 |
KR101464074B1 (ko) | 2014-11-21 |
CN103361693B (zh) | 2016-02-17 |
KR20130111316A (ko) | 2013-10-10 |
TW201339374A (zh) | 2013-10-01 |
CN103361693A (zh) | 2013-10-23 |
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