JP5583894B2 - 電気錫めっき液および電気錫めっき方法 - Google Patents

電気錫めっき液および電気錫めっき方法 Download PDF

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Publication number
JP5583894B2
JP5583894B2 JP2008154461A JP2008154461A JP5583894B2 JP 5583894 B2 JP5583894 B2 JP 5583894B2 JP 2008154461 A JP2008154461 A JP 2008154461A JP 2008154461 A JP2008154461 A JP 2008154461A JP 5583894 B2 JP5583894 B2 JP 5583894B2
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Japan
Prior art keywords
plating
group
acid
chip
plating solution
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Japanese (ja)
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JP2009299123A (ja
Inventor
眞明 今成
ティン・ファイ・ラン
元矢 嶋津
康夫 太田
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Rohm and Haas Electronic Materials LLC
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Rohm and Haas Electronic Materials LLC
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Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Priority to JP2008154461A priority Critical patent/JP5583894B2/ja
Priority to EP09155197.8A priority patent/EP2141261B1/de
Priority to TW98119007A priority patent/TWI468554B/zh
Priority to US12/456,077 priority patent/US20100000873A1/en
Priority to KR1020090051978A priority patent/KR101593475B1/ko
Priority to CN2009101462026A priority patent/CN101619470B/zh
Publication of JP2009299123A publication Critical patent/JP2009299123A/ja
Application granted granted Critical
Publication of JP5583894B2 publication Critical patent/JP5583894B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2008154461A 2008-06-12 2008-06-12 電気錫めっき液および電気錫めっき方法 Active JP5583894B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008154461A JP5583894B2 (ja) 2008-06-12 2008-06-12 電気錫めっき液および電気錫めっき方法
EP09155197.8A EP2141261B1 (de) 2008-06-12 2009-03-16 Elektrolytische Zinnbeschichtungslösung und elektrolytisches Zinnbeschichtungsverfahren
TW98119007A TWI468554B (zh) 2008-06-12 2009-06-08 電解錫電鍍溶液及電解錫電鍍方法
US12/456,077 US20100000873A1 (en) 2008-06-12 2009-06-11 Electrolytic tin plating solution and electrolytic tin plating method
KR1020090051978A KR101593475B1 (ko) 2008-06-12 2009-06-11 전해 주석 도금액 및 전해 주석 도금 방법
CN2009101462026A CN101619470B (zh) 2008-06-12 2009-06-12 电解锡镀液及电解锡电镀法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008154461A JP5583894B2 (ja) 2008-06-12 2008-06-12 電気錫めっき液および電気錫めっき方法

Publications (2)

Publication Number Publication Date
JP2009299123A JP2009299123A (ja) 2009-12-24
JP5583894B2 true JP5583894B2 (ja) 2014-09-03

Family

ID=41334608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008154461A Active JP5583894B2 (ja) 2008-06-12 2008-06-12 電気錫めっき液および電気錫めっき方法

Country Status (6)

Country Link
US (1) US20100000873A1 (de)
EP (1) EP2141261B1 (de)
JP (1) JP5583894B2 (de)
KR (1) KR101593475B1 (de)
CN (1) CN101619470B (de)
TW (1) TWI468554B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011013252A1 (ja) 2009-07-31 2011-02-03 株式会社Ｍテック・ジャパン スズ含有合金メッキ浴、これを用いた電解メッキ方法および該電解メッキが堆積された基体
WO2010089882A1 (ja) 2009-02-06 2010-08-12 Dewaki Kenji 銀含有合金メッキ浴、およびこれを用いた電解メッキ方法
JP2012021224A (ja) * 2010-06-15 2012-02-02 Mitsubishi Shindoh Co Ltd 錫めっき液中のスラッジ発生防止方法
US8888984B2 (en) * 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method
EP2740820A1 (de) 2012-12-04 2014-06-11 Dr.Ing. Max Schlötter GmbH & Co. KG Elektrolyt und Verfahren zur Abscheidung von lötbaren Schichten
JP6133056B2 (ja) 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液
US20150122662A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method
KR20160094385A (ko) * 2013-12-05 2016-08-09 허니웰 인터내셔날 인코포레이티드 조절된 pH를 갖는 주석(II) 메탄술포네이트 용액
CN105755513A (zh) * 2016-04-28 2016-07-13 四川昊吉科技有限公司 一种镀锡防腐剂
JP6818520B2 (ja) 2016-11-11 2021-01-20 ローム・アンド・ハース電子材料株式会社 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法
JP6620858B2 (ja) * 2017-10-24 2019-12-18 三菱マテリアル株式会社 錫又は錫合金めっき堆積層の形成方法
US11268203B2 (en) * 2017-10-24 2022-03-08 Mitsubishi Materials Corporation Tin or tin alloy plating solution
JP2021508359A (ja) 2017-12-20 2021-03-04 ビーエイエスエフ・ソシエタス・エウロパエアＢａｓｆ Ｓｅ 抑制剤を含むスズまたはスズ合金電気めっき用組成物
SG11202009106XA (en) 2018-04-20 2020-11-27 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
CN109518233B (zh) * 2018-11-27 2020-07-14 东莞美坚化工原料有限公司 一种防止微型电子元器件粘片的导电溶液及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE553400A (de) * 1956-01-16
US3616306A (en) * 1969-11-19 1971-10-26 Conversion Chem Corp Tin plating bath and method
US4000047A (en) * 1972-11-17 1976-12-28 Lea-Ronal, Inc. Electrodeposition of tin, lead and tin-lead alloys
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
JP2856857B2 (ja) * 1990-07-27 1999-02-10 石原薬品株式会社 錫、鉛または錫―鉛合金めっき浴
JP2001040498A (ja) * 1999-07-27 2001-02-13 Ne Chemcat Corp 錫−銅合金めっき皮膜で被覆された電子部品
JP2001234387A (ja) * 2000-02-17 2001-08-31 Yuken Industry Co Ltd 錫系電気めっきのウィスカー発生防止剤および防止方法
EP1260614B1 (de) * 2001-05-24 2008-04-23 Shipley Co. L.L.C. Zinn Platierung
JP3910028B2 (ja) 2001-09-13 2007-04-25 株式会社村田製作所 チップ型セラミックス電子部品の電極形成法
JP4812365B2 (ja) * 2005-08-19 2011-11-09 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 錫電気めっき液および錫電気めっき方法
EP1948852B1 (de) * 2005-11-18 2018-08-29 Luxembourg Institute of Science and Technology (LIST) Master-elektrode und herstellungsverfahren dafür

Also Published As

Publication number Publication date
CN101619470B (zh) 2012-03-28
KR101593475B1 (ko) 2016-02-12
KR20090129373A (ko) 2009-12-16
EP2141261A2 (de) 2010-01-06
TWI468554B (zh) 2015-01-11
EP2141261B1 (de) 2017-03-01
TW201006966A (en) 2010-02-16
JP2009299123A (ja) 2009-12-24
EP2141261A3 (de) 2010-07-28
US20100000873A1 (en) 2010-01-07
CN101619470A (zh) 2010-01-06

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