JP5572714B2 - ソルダーレジストの形成方法 - Google Patents

ソルダーレジストの形成方法 Download PDF

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Publication number
JP5572714B2
JP5572714B2 JP2012536202A JP2012536202A JP5572714B2 JP 5572714 B2 JP5572714 B2 JP 5572714B2 JP 2012536202 A JP2012536202 A JP 2012536202A JP 2012536202 A JP2012536202 A JP 2012536202A JP 5572714 B2 JP5572714 B2 JP 5572714B2
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JP
Japan
Prior art keywords
curable resin
protective film
via hole
resin layer
solder resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012536202A
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English (en)
Japanese (ja)
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JPWO2012042846A1 (ja
Inventor
新 遠藤
直之 小池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Priority to JP2012536202A priority Critical patent/JP5572714B2/ja
Publication of JPWO2012042846A1 publication Critical patent/JPWO2012042846A1/ja
Application granted granted Critical
Publication of JP5572714B2 publication Critical patent/JP5572714B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laser Beam Processing (AREA)
JP2012536202A 2010-09-27 2011-09-27 ソルダーレジストの形成方法 Active JP5572714B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012536202A JP5572714B2 (ja) 2010-09-27 2011-09-27 ソルダーレジストの形成方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010215524 2010-09-27
JP2010215524 2010-09-27
PCT/JP2011/005425 WO2012042846A1 (ja) 2010-09-27 2011-09-27 ソルダーレジストの形成方法
JP2012536202A JP5572714B2 (ja) 2010-09-27 2011-09-27 ソルダーレジストの形成方法

Publications (2)

Publication Number Publication Date
JPWO2012042846A1 JPWO2012042846A1 (ja) 2014-02-06
JP5572714B2 true JP5572714B2 (ja) 2014-08-13

Family

ID=45892336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012536202A Active JP5572714B2 (ja) 2010-09-27 2011-09-27 ソルダーレジストの形成方法

Country Status (4)

Country Link
JP (1) JP5572714B2 (zh)
KR (1) KR101471794B1 (zh)
TW (1) TWI513389B (zh)
WO (1) WO2012042846A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052271B (zh) * 2012-12-17 2015-09-23 天津市德中技术发展有限公司 制作阻焊图案的同时对焊接区表面进行可焊性处理的方法
KR20170030654A (ko) * 2012-12-27 2017-03-17 우시오덴키 가부시키가이샤 디스미어 처리 방법 및 디스미어 처리 장치
JP5660117B2 (ja) * 2012-12-27 2015-01-28 ウシオ電機株式会社 デスミア処理方法
JP5660118B2 (ja) * 2012-12-27 2015-01-28 ウシオ電機株式会社 デスミア処理方法
JP2015041728A (ja) * 2013-08-23 2015-03-02 ウシオ電機株式会社 デスミア処理方法およびデスミア処理装置
JP5967147B2 (ja) * 2013-12-26 2016-08-10 ウシオ電機株式会社 デスミア処理装置
JP2016092307A (ja) * 2014-11-07 2016-05-23 株式会社アルバック 樹脂基板の加工方法
JP6431425B2 (ja) * 2015-03-31 2018-11-28 積水化学工業株式会社 積層構造体の製造方法及び積層構造体
US9741606B2 (en) 2015-08-07 2017-08-22 Intel Corporation Desmear with metalized protective film
EP3550943A4 (en) 2016-12-02 2020-07-22 ULVAC, Inc. PROCESS FOR PROCESSING A CONNECTION PANEL
CN107960017B (zh) * 2017-12-25 2020-12-18 广州兴森快捷电路科技有限公司 线路板阻焊层的加工方法
JP6627944B2 (ja) * 2018-10-09 2020-01-08 味の素株式会社 回路基板の製造方法
US20230319999A1 (en) * 2020-03-30 2023-10-05 Kyocera Corporation Printed wiring board and method for manufacturing printed wiring board
CN113141717A (zh) * 2021-04-21 2021-07-20 丰顺县和生电子有限公司 一种电路板母板的钻孔方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001192536A (ja) * 2000-01-11 2001-07-17 Mitsubishi Gas Chem Co Inc 高比誘電率ｂステージシート、それを用いたプリント配線板
JP2003017849A (ja) * 2001-06-29 2003-01-17 Ibiden Co Ltd 多層プリント配線板の製造方法
JP2004186231A (ja) * 2002-11-29 2004-07-02 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2010062478A (ja) * 2008-09-05 2010-03-18 Ajinomoto Co Inc 回路基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200503152A (en) * 2003-07-10 2005-01-16 Macronix Int Co Ltd Methods of fabricating shallow trench isolation and patterning
JP2005347429A (ja) * 2004-06-02 2005-12-15 Ktech Research Corp プリント基板の製造方法
TW201031302A (en) * 2009-02-04 2010-08-16 Unimicron Technology Corp Fabrication method of circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001192536A (ja) * 2000-01-11 2001-07-17 Mitsubishi Gas Chem Co Inc 高比誘電率ｂステージシート、それを用いたプリント配線板
JP2003017849A (ja) * 2001-06-29 2003-01-17 Ibiden Co Ltd 多層プリント配線板の製造方法
JP2004186231A (ja) * 2002-11-29 2004-07-02 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2010062478A (ja) * 2008-09-05 2010-03-18 Ajinomoto Co Inc 回路基板の製造方法

Also Published As

Publication number Publication date
TWI513389B (zh) 2015-12-11
TW201233275A (en) 2012-08-01
JPWO2012042846A1 (ja) 2014-02-06
KR101471794B1 (ko) 2014-12-10
WO2012042846A1 (ja) 2012-04-05
KR20130027048A (ko) 2013-03-14

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