KR101471794B1 - 솔더 레지스트의 형성 방법 - Google Patents

솔더 레지스트의 형성 방법 Download PDF

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Publication number
KR101471794B1
KR101471794B1 KR1020137003399A KR20137003399A KR101471794B1 KR 101471794 B1 KR101471794 B1 KR 101471794B1 KR 1020137003399 A KR1020137003399 A KR 1020137003399A KR 20137003399 A KR20137003399 A KR 20137003399A KR 101471794 B1 KR101471794 B1 KR 101471794B1
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KR
South Korea
Prior art keywords
curable resin
protective film
resin layer
via hole
solder resist
Prior art date
Application number
KR1020137003399A
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English (en)
Korean (ko)
Other versions
KR20130027048A (ko
Inventor
아라타 엔도
나오유키 고이케
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20130027048A publication Critical patent/KR20130027048A/ko
Application granted granted Critical
Publication of KR101471794B1 publication Critical patent/KR101471794B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laser Beam Processing (AREA)
KR1020137003399A 2010-09-27 2011-09-27 솔더 레지스트의 형성 방법 KR101471794B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-215524 2010-09-27
JP2010215524 2010-09-27
PCT/JP2011/005425 WO2012042846A1 (ja) 2010-09-27 2011-09-27 ソルダーレジストの形成方法

Publications (2)

Publication Number Publication Date
KR20130027048A KR20130027048A (ko) 2013-03-14
KR101471794B1 true KR101471794B1 (ko) 2014-12-10

Family

ID=45892336

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137003399A KR101471794B1 (ko) 2010-09-27 2011-09-27 솔더 레지스트의 형성 방법

Country Status (4)

Country Link
JP (1) JP5572714B2 (zh)
KR (1) KR101471794B1 (zh)
TW (1) TWI513389B (zh)
WO (1) WO2012042846A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052271B (zh) * 2012-12-17 2015-09-23 天津市德中技术发展有限公司 制作阻焊图案的同时对焊接区表面进行可焊性处理的方法
KR20170030654A (ko) * 2012-12-27 2017-03-17 우시오덴키 가부시키가이샤 디스미어 처리 방법 및 디스미어 처리 장치
JP5660117B2 (ja) * 2012-12-27 2015-01-28 ウシオ電機株式会社 デスミア処理方法
JP5660118B2 (ja) * 2012-12-27 2015-01-28 ウシオ電機株式会社 デスミア処理方法
JP2015041728A (ja) * 2013-08-23 2015-03-02 ウシオ電機株式会社 デスミア処理方法およびデスミア処理装置
JP5967147B2 (ja) * 2013-12-26 2016-08-10 ウシオ電機株式会社 デスミア処理装置
JP2016092307A (ja) * 2014-11-07 2016-05-23 株式会社アルバック 樹脂基板の加工方法
JP6431425B2 (ja) * 2015-03-31 2018-11-28 積水化学工業株式会社 積層構造体の製造方法及び積層構造体
US9741606B2 (en) 2015-08-07 2017-08-22 Intel Corporation Desmear with metalized protective film
EP3550943A4 (en) 2016-12-02 2020-07-22 ULVAC, Inc. PROCESS FOR PROCESSING A CONNECTION PANEL
CN107960017B (zh) * 2017-12-25 2020-12-18 广州兴森快捷电路科技有限公司 线路板阻焊层的加工方法
JP6627944B2 (ja) * 2018-10-09 2020-01-08 味の素株式会社 回路基板の製造方法
US20230319999A1 (en) * 2020-03-30 2023-10-05 Kyocera Corporation Printed wiring board and method for manufacturing printed wiring board
CN113141717A (zh) * 2021-04-21 2021-07-20 丰顺县和生电子有限公司 一种电路板母板的钻孔方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001192536A (ja) * 2000-01-11 2001-07-17 Mitsubishi Gas Chem Co Inc 高比誘電率ｂステージシート、それを用いたプリント配線板
JP2004186231A (ja) * 2002-11-29 2004-07-02 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2005347429A (ja) * 2004-06-02 2005-12-15 Ktech Research Corp プリント基板の製造方法
JP2010062478A (ja) * 2008-09-05 2010-03-18 Ajinomoto Co Inc 回路基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666332B2 (ja) * 2001-06-29 2011-04-06 イビデン株式会社 多層プリント配線板の製造方法
TW200503152A (en) * 2003-07-10 2005-01-16 Macronix Int Co Ltd Methods of fabricating shallow trench isolation and patterning
TW201031302A (en) * 2009-02-04 2010-08-16 Unimicron Technology Corp Fabrication method of circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001192536A (ja) * 2000-01-11 2001-07-17 Mitsubishi Gas Chem Co Inc 高比誘電率ｂステージシート、それを用いたプリント配線板
JP2004186231A (ja) * 2002-11-29 2004-07-02 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2005347429A (ja) * 2004-06-02 2005-12-15 Ktech Research Corp プリント基板の製造方法
JP2010062478A (ja) * 2008-09-05 2010-03-18 Ajinomoto Co Inc 回路基板の製造方法

Also Published As

Publication number Publication date
TWI513389B (zh) 2015-12-11
TW201233275A (en) 2012-08-01
JPWO2012042846A1 (ja) 2014-02-06
JP5572714B2 (ja) 2014-08-13
WO2012042846A1 (ja) 2012-04-05
KR20130027048A (ko) 2013-03-14

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