JP5571902B2 - ロボット、及びオートゼロイング方法 - Google Patents
ロボット、及びオートゼロイング方法 Download PDFInfo
- Publication number
- JP5571902B2 JP5571902B2 JP2009064601A JP2009064601A JP5571902B2 JP 5571902 B2 JP5571902 B2 JP 5571902B2 JP 2009064601 A JP2009064601 A JP 2009064601A JP 2009064601 A JP2009064601 A JP 2009064601A JP 5571902 B2 JP5571902 B2 JP 5571902B2
- Authority
- JP
- Japan
- Prior art keywords
- posture
- origin
- zeroing
- robot
- connecting member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 59
- 230000008878 coupling Effects 0.000 claims description 37
- 238000010168 coupling process Methods 0.000 claims description 37
- 238000005859 coupling reaction Methods 0.000 claims description 37
- 238000001514 detection method Methods 0.000 claims description 36
- 238000006073 displacement reaction Methods 0.000 claims description 29
- 230000001373 regressive effect Effects 0.000 claims description 4
- 230000036544 posture Effects 0.000 description 229
- 238000012545 processing Methods 0.000 description 48
- 238000012546 transfer Methods 0.000 description 38
- 239000004065 semiconductor Substances 0.000 description 24
- 235000012431 wafers Nutrition 0.000 description 14
- 230000002829 reductive effect Effects 0.000 description 7
- 230000003749 cleanliness Effects 0.000 description 6
- 230000001276 controlling effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40601—Reference sensors
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/40—Robotics, robotics mapping to robotics vision
- G05B2219/40623—Track position of end effector by laser beam
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Numerical Control (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
23 基台
24 アーム
27 第1の連結部材
28 第2の連結部材
29 ロボットハンド
36 制御部
38 レーザセンサ
41 第1のリフレクタ
42 第2のリフレクタ
43 第3のリフレクタ
Claims (8)
- 相対変位可能に連結された複数の連結体を備え、前記連結体毎に対応付けられている調整可能な基準姿勢を基準として前記各連結体の変位を制御するロボットであって、
予め定められた方向にレーザ光を投光する投光手段と、
予め定められた原点姿勢からの変位量が所定の変位量である検出姿勢に前記各連結体が配置されると、前記レーザ光を受光する受光手段と、
前記連結体を夫々相対変位させて前記受光手段に前記レーザ光を受光させ、受光した時の前記連結体の姿勢、及び前記原点姿勢と前記検出姿勢との関係に基づいて前記基準姿勢を前記原点姿勢に調整するゼロイング手段と、
互いに連結された前記複数の連結体が相対変位可能に設けられた基台と、を備え、
前記ゼロイング手段は、前記各連結体の前記基準姿勢を個別に調整し、前記基台側の前記連結体から順に前記基準姿勢を調整する、
ことを特徴とするオートゼロイング機能付きのロボット。 - 前記ゼロイング手段は、一方向に前記連結体を相対変位させて前記受光手段に前記レーザ光を受光させた後、前記一方向と異なる他方向に前記連結体を相対変位させて前記受光手段に前記レーザ光を受光させ、前記一方向及び他方向で前記レーザ光を夫々受光したときの前記連結体の姿勢を示す数値の平均値を前記レーザ光を受光したときの姿勢を示す数値とする、請求項1に記載のオートゼロイング機能付きのロボット。
- 前記検出姿勢は、前記原点姿勢である、
ことを特徴とする請求項1又は2に記載のオートゼロイング機能付きのロボット。 - 前記複数の連結体に夫々設けられており、前記投光手段からの前記レーザ光を反射するリフレクタを備え、
前記投光手段及び受光手段は、前記基台に設けられる、
ことを特徴とする請求項1乃至3のいずれか1つに記載のオートゼロイング機能付きのロボット。 - 前記リフレクタは、回帰型のリフレクタであり、
前記投光手段及び前記受光手段は、一体化された同軸レーザセンサである、
ことを特徴とする請求項4に記載のオートゼロイング機能付きのロボット。 - 前記各連結体は、互いに相対回動可能に構成されており、
前記ゼロイング手段は、相対回動させる時の前記連結体にかかるトルクが予め定められたトルク値以上、及び前記連結体の相対角度と目標角度とのズレが予め定められた値以上の何れか1つの条件を満たすと、前記連結体を前記原点姿勢に移動する、
ことを特徴とする請求項1乃至5の何れか1つに記載のオートゼロイング機能付きのロボット。 - 相対変位可能に互いに連結され、且つ基体に相対変位可能に設けられている複数の連結体の変位を前記連結体毎に対応付けられた調整可能な基準姿勢を基準として制御するロボットの前記基準姿勢をゼロイング手段が調整するためのオートゼロイング方法であって、
前記連結体を相対変位させて予め定められた原点姿勢からの変位量が所定の変位量である検出姿勢に前記連結体を配置してレーザ光を受光させるレーザ光受光工程と、
前記レーザ光受光工程でレーザ光を受光したときの前記連結体の姿勢、及び前記原点姿勢と前記検出姿勢との関係に基づいて、前記ゼロイング手段が前記基準姿勢を前記原点姿勢に調整する基準姿勢調整工程とを有し、
前記レーザ光受光工程及び基準姿勢調整工程では、前記ゼロイング手段が前記各連結体の前記基準姿勢を個別に調整し、基台側の前記連結体から順に前記基準姿勢を調整する、
ことを特徴とするオートゼロイング方法。 - 前記レーザ光受光工程では、一方向に前記連結体を相対変位させて前記レーザ光を受光させた後、前記一方向と異なる他方向に前記連結体を相対変位させて前記レーザ光を受光させ、
前記基準姿勢調整工程では、前記一方向及び他方向で前記レーザ光を夫々受光したときの前記連結体の姿勢を示す数値の平均値を前記レーザ光を受光したときの姿勢を示す数値とする、
ことを特徴とする請求項7に記載のオートゼロイング方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009064601A JP5571902B2 (ja) | 2009-03-17 | 2009-03-17 | ロボット、及びオートゼロイング方法 |
US13/256,375 US8358422B2 (en) | 2009-03-17 | 2010-03-08 | Robot and auto-zeroing method |
PCT/JP2010/053763 WO2010106937A1 (ja) | 2009-03-17 | 2010-03-08 | ロボット及びオートゼロイング方法 |
TW099107626A TWI406748B (zh) | 2009-03-17 | 2010-03-16 | Automatic operation machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009064601A JP5571902B2 (ja) | 2009-03-17 | 2009-03-17 | ロボット、及びオートゼロイング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010214533A JP2010214533A (ja) | 2010-09-30 |
JP5571902B2 true JP5571902B2 (ja) | 2014-08-13 |
Family
ID=42739598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009064601A Active JP5571902B2 (ja) | 2009-03-17 | 2009-03-17 | ロボット、及びオートゼロイング方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8358422B2 (ja) |
JP (1) | JP5571902B2 (ja) |
TW (1) | TWI406748B (ja) |
WO (1) | WO2010106937A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012238762A (ja) * | 2011-05-12 | 2012-12-06 | Tokyo Electron Ltd | 基板搬送装置、これを備える塗布現像装置、及び基板搬送方法 |
SG2013025770A (en) | 2013-04-05 | 2014-11-27 | Sigenic Pte Ltd | Apparatus and method for detecting position drift in a machine operation using a robot arm |
JP6241077B2 (ja) * | 2013-05-31 | 2017-12-06 | シンフォニアテクノロジー株式会社 | 多関節ロボット及び多関節ロボットの原点調整方法 |
JP5850003B2 (ja) * | 2013-07-26 | 2016-02-03 | 株式会社安川電機 | ロボットシステム、ロボットシステムのロボット管理コンピュータ及びロボットシステムの管理方法 |
JP6462984B2 (ja) * | 2014-02-04 | 2019-01-30 | キヤノン株式会社 | ロボットアーム、及びロボットアームの制御方法 |
US10933532B2 (en) * | 2015-02-13 | 2021-03-02 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying robot and operation method therefor |
CN107921639B (zh) * | 2015-08-25 | 2021-09-21 | 川崎重工业株式会社 | 多个机器人系统间的信息共享系统及信息共享方法 |
CN106945034B (zh) * | 2016-01-07 | 2021-09-03 | 鸿富锦精密电子(郑州)有限公司 | 机器人点位调节方法与系统 |
US10861723B2 (en) | 2017-08-08 | 2020-12-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | EFEM robot auto teaching methodology |
US10020216B1 (en) * | 2017-09-08 | 2018-07-10 | Kawasaki Jukogyo Kabushiki Kaisha | Robot diagnosing method |
JP7129788B2 (ja) * | 2018-02-16 | 2022-09-02 | 日本電産サンキョー株式会社 | 産業用ロボットの補正値算出方法 |
CN110340880A (zh) * | 2018-04-02 | 2019-10-18 | 新世代机器人暨人工智慧股份有限公司 | 可变姿态机器人及其姿态调整方法 |
US20200070349A1 (en) * | 2018-08-31 | 2020-03-05 | Kawasaki Jukogyo Kabushiki Kaisha | Robot and method of adjusting original position of robot |
KR102528797B1 (ko) * | 2021-08-10 | 2023-05-03 | 세메스 주식회사 | 기판 이송 어셈블리 및 방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2706186B2 (ja) | 1991-06-25 | 1998-01-28 | キヤノン株式会社 | 多関節型ロボットのアーム原点の較正方法 |
JPH0569356A (ja) * | 1991-09-11 | 1993-03-23 | Mitsubishi Electric Corp | 産業用ロボツト装置 |
JP3396545B2 (ja) * | 1994-09-28 | 2003-04-14 | 株式会社リコー | ロボット装置の原点較正装置及び双腕型ロボット装置 |
CN1067932C (zh) * | 1997-01-29 | 2001-07-04 | 株式会社安川电机 | 机器人的校准装置及方法 |
JPH1190883A (ja) * | 1997-09-25 | 1999-04-06 | Shinko Electric Co Ltd | 多軸ロボットの軸ズレ検知装置 |
DE19854011A1 (de) * | 1998-11-12 | 2000-05-25 | Knoll Alois | Einrichtung und Verfahren zum Vermessen von Mechanismen und ihrer Stellung |
JP2003039354A (ja) * | 2001-07-30 | 2003-02-13 | Matsushita Electric Ind Co Ltd | ロボットの制御方法、制御装置および治具 |
JP4047182B2 (ja) | 2003-02-04 | 2008-02-13 | 東京エレクトロン株式会社 | 基板の搬送装置 |
US7222431B1 (en) * | 2006-02-03 | 2007-05-29 | Gilson, Inc. | Alignment correction system and methods of use thereof |
-
2009
- 2009-03-17 JP JP2009064601A patent/JP5571902B2/ja active Active
-
2010
- 2010-03-08 WO PCT/JP2010/053763 patent/WO2010106937A1/ja active Application Filing
- 2010-03-08 US US13/256,375 patent/US8358422B2/en active Active
- 2010-03-16 TW TW099107626A patent/TWI406748B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2010106937A1 (ja) | 2010-09-23 |
JP2010214533A (ja) | 2010-09-30 |
TW201102236A (en) | 2011-01-16 |
US20120002216A1 (en) | 2012-01-05 |
TWI406748B (zh) | 2013-09-01 |
US8358422B2 (en) | 2013-01-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5571902B2 (ja) | ロボット、及びオートゼロイング方法 | |
US8121732B2 (en) | Target position detection apparatus for robot | |
JP5597536B2 (ja) | 搬送ロボットのティーチング方法 | |
TWI513968B (zh) | 具有多重連接裝置機器人之系統,及校正多重連接裝置機器人中位置及旋轉對準的方法 | |
JP4305652B2 (ja) | ウェハ位置教示方法 | |
JP4930853B2 (ja) | ウェハ搬送装置 | |
US10020216B1 (en) | Robot diagnosing method | |
TW201347937A (zh) | 傳送系統 | |
WO2016125752A1 (ja) | 基板搬送ロボットおよび基板搬送方法 | |
KR20220042197A (ko) | 로봇 장착 비젼 장치 | |
US20200206933A1 (en) | Method of correcting position of robot and robot | |
US20180207804A1 (en) | Process system including robot that transfers workpiece to process machine | |
JP5491731B2 (ja) | ロボット、及びロボットの教示位置の直進開始位置の較正方法 | |
CN110153994B (zh) | 工业用机器人的修正值计算方法 | |
CN110153995B (zh) | 工业用机器人的修正值计算方法 | |
CN116918054A (zh) | 机器人系统以及滑动判定方法 | |
KR20230031346A (ko) | 로봇 시스템용 자동 교습 장치 및 그 방법 | |
WO2022137917A1 (ja) | 基板搬送ロボットの制御装置及び関節モータの制御方法 | |
JP2003110004A (ja) | ウェハ搬送における位置補正方法 | |
KR20190099138A (ko) | 산업용 로봇의 보정값 산출 방법 | |
JP2009016604A (ja) | ウェーハ搬送装置 | |
KR102341754B1 (ko) | 로봇의 진단 방법 | |
CN110153991B (zh) | 工业用机器人的调节方法 | |
CN110153990B (zh) | 工业用机器人的修正值计算方法 | |
WO2022259948A1 (ja) | 搬送システム及び判定方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120312 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130507 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130613 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131105 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131226 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140401 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140515 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140603 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140627 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5571902 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |