JP5597536B2 - 搬送ロボットのティーチング方法 - Google Patents
搬送ロボットのティーチング方法 Download PDFInfo
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- JP5597536B2 JP5597536B2 JP2010522732A JP2010522732A JP5597536B2 JP 5597536 B2 JP5597536 B2 JP 5597536B2 JP 2010522732 A JP2010522732 A JP 2010522732A JP 2010522732 A JP2010522732 A JP 2010522732A JP 5597536 B2 JP5597536 B2 JP 5597536B2
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- transfer robot
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- 238000012546 transfer Methods 0.000 title claims description 88
- 238000000034 method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims description 54
- 238000012545 processing Methods 0.000 claims description 53
- 238000001514 detection method Methods 0.000 claims description 52
- 230000008602 contraction Effects 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000013461 design Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Numerical Control (AREA)
Description
12 ロボットハンド
16、17 貫通孔(指標部)
2 検知手段
2a、2b 検知位置
S 基板
A ロードロック室
B 搬送室
C 処理室
Cs 基板ステージ
Claims (3)
- 複数の処理室間で処理すべき基板をハンドに支持した状態で同一平面内を旋回及び伸縮動作させて前記基板を所定の位置に搬送する搬送ロボットに対しその搬送動作を教示する搬送ロボットのティーチング方法において、
前記処理室間で基板を搬送する際に基板を検知するように配置された少なくとも1個の検知手段を用い、
前記搬送ロボットを搬送動作させ、予め前記搬送ロボットの作動部分である前記ハンドに設けた指標部の少なくとも1つを前記検知手段にて検出し、この検知位置から、前記旋回及び伸縮動作の少なくとも一方の起点となる基準位置を教示するようにし、
前記起点の教示に先立って、前記ハンドに設けた指標部の少なくとも2個を前記検知手段にて夫々検知し、搬送ロボットの作動部分を組み付けたときの伸縮方向または旋回方向のずれと、伸縮方向に対する前記ハンドの傾きとを所定の比較値に基づき補正する、とともに、
前記検知手段が前記平面に対し垂直に投光するように配置した光学センサであり、前記指標部のそれぞれを前記ハンドに形成した1個の貫通孔から構成したこと、
を特徴とする搬送ロボットのティーチング方法。 - 前記貫通孔の周辺において搬送ロボットを走査移動させるようにしたことを特徴とする請求項1記載の搬送ロボットのティーチング方法。
- 前記搬送ロボットにて基板を支持し、前記作動部分に代えてまたは前記作動部分に加えて前記基板に指標部を形成することを特徴とする請求項1または2に記載の搬送ロボットのティーチング方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010522732A JP5597536B2 (ja) | 2008-08-01 | 2009-07-29 | 搬送ロボットのティーチング方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008200101 | 2008-08-01 | ||
JP2008200101 | 2008-08-01 | ||
PCT/JP2009/063468 WO2010013732A1 (ja) | 2008-08-01 | 2009-07-29 | 搬送ロボットのティーチング方法 |
JP2010522732A JP5597536B2 (ja) | 2008-08-01 | 2009-07-29 | 搬送ロボットのティーチング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010013732A1 JPWO2010013732A1 (ja) | 2012-01-12 |
JP5597536B2 true JP5597536B2 (ja) | 2014-10-01 |
Family
ID=41610431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010522732A Active JP5597536B2 (ja) | 2008-08-01 | 2009-07-29 | 搬送ロボットのティーチング方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8688276B2 (ja) |
JP (1) | JP5597536B2 (ja) |
KR (1) | KR101621814B1 (ja) |
CN (1) | CN102112274B (ja) |
DE (1) | DE112009001863A5 (ja) |
TW (1) | TWI488723B (ja) |
WO (1) | WO2010013732A1 (ja) |
Families Citing this family (22)
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JP5728204B2 (ja) * | 2010-11-17 | 2015-06-03 | 株式会社アルバック | 基板位置検出方法 |
JP6029250B2 (ja) | 2013-03-28 | 2016-11-24 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及びプログラム |
DE102013111165A1 (de) | 2013-10-09 | 2015-04-09 | Aixtron Se | Vorrichtung und Verfahren zur Bestimmung der Drehlage eines Suszeptors in einer Prozesskammer |
JP5949741B2 (ja) * | 2013-12-19 | 2016-07-13 | 株式会社安川電機 | ロボットシステム及び検出方法 |
CN104772754B (zh) * | 2015-03-26 | 2016-05-11 | 北京欣奕华科技有限公司 | 一种机器人示教器及示教方法 |
US9796086B2 (en) * | 2015-05-01 | 2017-10-24 | Kawasaki Jukogyo Kabushiki Kaisha | Method of teaching robot and robot |
US9824908B2 (en) * | 2015-05-05 | 2017-11-21 | Kawasaki Jukogyo Kabushiki Kaisha | Conveying system, conveying robot and teaching method of the same |
JP6979012B2 (ja) * | 2016-03-04 | 2021-12-08 | 川崎重工業株式会社 | 基板搬送装置及び基板搬送ロボットの教示方法 |
KR101909181B1 (ko) * | 2016-03-04 | 2018-10-17 | 세메스 주식회사 | 기판 이송 어셈블리, 이를 포함하는 기판 처리 장치 및 위치 보정 방법 |
JP6533199B2 (ja) * | 2016-09-14 | 2019-06-19 | Dmg森精機株式会社 | ワーク処理システム |
TWI617995B (zh) * | 2016-11-04 | 2018-03-11 | 廣明光電股份有限公司 | 機器人視覺定位的驗證方法 |
JP6999443B2 (ja) * | 2018-02-16 | 2022-01-18 | 日本電産サンキョー株式会社 | 産業用ロボットの補正値算出方法 |
JP7074494B2 (ja) * | 2018-02-16 | 2022-05-24 | 日本電産サンキョー株式会社 | 産業用ロボットの補正値算出方法 |
KR101971824B1 (ko) * | 2018-03-05 | 2019-04-23 | 캐논 톡키 가부시키가이샤 | 로봇, 로봇 시스템, 디바이스 제조 장치, 디바이스 제조 방법 및 티칭 위치 조정 방법 |
JP7097722B2 (ja) * | 2018-03-20 | 2022-07-08 | 日本電産サンキョー株式会社 | ロボットの位置情報復元方法 |
KR102615555B1 (ko) * | 2018-03-29 | 2023-12-19 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 및 표시 장치의 제조 방법 |
JP7165514B2 (ja) * | 2018-06-14 | 2022-11-04 | 日本電産サンキョー株式会社 | 教示データ作成システムおよび教示データ作成方法 |
CN108908409B (zh) * | 2018-08-27 | 2019-06-04 | 东北大学 | 一种并联机械手重复定位精度可靠性试验装置及方法 |
CN112894795B (zh) * | 2019-12-04 | 2023-01-10 | 合肥欣奕华智能机器股份有限公司 | 一种搬运机器人及其搬运控制方法、装置、设备及介质 |
JP7482689B2 (ja) * | 2020-06-03 | 2024-05-14 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP2022060712A (ja) * | 2020-10-05 | 2022-04-15 | キオクシア株式会社 | 半導体製造装置 |
KR20230103796A (ko) | 2021-12-30 | 2023-07-07 | 세메스 주식회사 | 기판 처리장치 및 처리방법 |
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JPH09252039A (ja) * | 1996-03-14 | 1997-09-22 | Fujitsu Ltd | 搬送装置におけるティーチング位置設定方法及びティーチング位置設定装置 |
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JP2001068530A (ja) * | 1999-08-26 | 2001-03-16 | Anelva Corp | 基板処理装置 |
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2009
- 2009-07-29 WO PCT/JP2009/063468 patent/WO2010013732A1/ja active Application Filing
- 2009-07-29 DE DE112009001863T patent/DE112009001863A5/de not_active Ceased
- 2009-07-29 CN CN200980130641.6A patent/CN102112274B/zh active Active
- 2009-07-29 US US13/054,824 patent/US8688276B2/en active Active
- 2009-07-29 JP JP2010522732A patent/JP5597536B2/ja active Active
- 2009-07-29 KR KR1020117004863A patent/KR101621814B1/ko active IP Right Grant
- 2009-07-31 TW TW098125901A patent/TWI488723B/zh active
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Also Published As
Publication number | Publication date |
---|---|
DE112009001863T5 (de) | 2012-01-26 |
JPWO2010013732A1 (ja) | 2012-01-12 |
CN102112274B (zh) | 2014-11-19 |
KR101621814B1 (ko) | 2016-05-17 |
CN102112274A (zh) | 2011-06-29 |
TWI488723B (zh) | 2015-06-21 |
KR20110052675A (ko) | 2011-05-18 |
US8688276B2 (en) | 2014-04-01 |
US20110125325A1 (en) | 2011-05-26 |
TW201012608A (en) | 2010-04-01 |
DE112009001863A5 (de) | 2011-11-24 |
WO2010013732A1 (ja) | 2010-02-04 |
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