WO2010013732A1 - 搬送ロボットのティーチング方法 - Google Patents

搬送ロボットのティーチング方法 Download PDF

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Publication number
WO2010013732A1
WO2010013732A1 PCT/JP2009/063468 JP2009063468W WO2010013732A1 WO 2010013732 A1 WO2010013732 A1 WO 2010013732A1 JP 2009063468 W JP2009063468 W JP 2009063468W WO 2010013732 A1 WO2010013732 A1 WO 2010013732A1
Authority
WO
WIPO (PCT)
Prior art keywords
conveying robot
teaching
substrate
conveying
detection
Prior art date
Application number
PCT/JP2009/063468
Other languages
English (en)
French (fr)
Inventor
藤井 佳詞
Original Assignee
株式会社アルバック
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2008200101 priority Critical
Priority to JP2008-200101 priority
Application filed by 株式会社アルバック filed Critical 株式会社アルバック
Publication of WO2010013732A1 publication Critical patent/WO2010013732A1/ja

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/16Programme controls
    • B25J9/1679Programme controls characterised by the tasks executed
    • B25J9/1692Calibration of manipulator
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45031Manufacturing semiconductor wafers

Abstract

高い信頼性を持って迅速にティーチングができるようにした低コストの搬送ロボットのティーチング方法を提供する。 複数の室(B、C)間で処理すべき基板(S)を支持した状態で同一平面内を旋回及び伸縮動作させて前記基板(S)を所定の位置に搬送する搬送ロボットに対しその搬送動作を教示する。このとき、室(B、C)間で基板(S)を搬送する際に基板(S)を検知するように配置された少なくとも1個の検知手段(2)を用い、搬送ロボットを搬送動作させ、予め前記搬送ロボットの作動部分(11、12)に設けた少なくとも1つの指標(16、17)部を前記検知手段(2)にて検出し、この検知位置(2a、2b)から、前記旋回及び伸縮動作の少なくとも一方の起点となる基準位置を教示する。
PCT/JP2009/063468 2008-08-01 2009-07-29 搬送ロボットのティーチング方法 WO2010013732A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008200101 2008-08-01
JP2008-200101 2008-08-01

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010522732A JP5597536B2 (ja) 2008-08-01 2009-07-29 搬送ロボットのティーチング方法
DE200911001863 DE112009001863A5 (de) 2008-08-01 2009-07-29 Einlernverfahren für einen Überführungsroboter
US13/054,824 US8688276B2 (en) 2008-08-01 2009-07-29 Teaching method for transfer robot
CN200980130641.6A CN102112274B (zh) 2008-08-01 2009-07-29 搬运机器人的示教方法

Publications (1)

Publication Number Publication Date
WO2010013732A1 true WO2010013732A1 (ja) 2010-02-04

Family

ID=41610431

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/063468 WO2010013732A1 (ja) 2008-08-01 2009-07-29 搬送ロボットのティーチング方法

Country Status (7)

Country Link
US (1) US8688276B2 (ja)
JP (1) JP5597536B2 (ja)
KR (1) KR101621814B1 (ja)
CN (1) CN102112274B (ja)
DE (1) DE112009001863A5 (ja)
TW (1) TWI488723B (ja)
WO (1) WO2010013732A1 (ja)

Cited By (2)

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JP2012106313A (ja) * 2010-11-17 2012-06-07 Ulvac Japan Ltd 基板位置検出方法
WO2014157358A1 (ja) * 2013-03-28 2014-10-02 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び記録媒体

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DE102013111165A1 (de) 2013-10-09 2015-04-09 Aixtron Se Vorrichtung und Verfahren zur Bestimmung der Drehlage eines Suszeptors in einer Prozesskammer
JP5949741B2 (ja) * 2013-12-19 2016-07-13 株式会社安川電機 ロボットシステム及び検出方法
CN104772754B (zh) * 2015-03-26 2016-05-11 北京欣奕华科技有限公司 一种机器人示教器及示教方法
US9796086B2 (en) * 2015-05-01 2017-10-24 Kawasaki Jukogyo Kabushiki Kaisha Method of teaching robot and robot
US9824908B2 (en) * 2015-05-05 2017-11-21 Kawasaki Jukogyo Kabushiki Kaisha Conveying system, conveying robot and teaching method of the same
KR101909181B1 (ko) * 2016-03-04 2018-10-17 세메스 주식회사 기판 이송 어셈블리, 이를 포함하는 기판 처리 장치 및 위치 보정 방법
TWI617995B (zh) * 2016-11-04 2018-03-11 廣明光電股份有限公司 機器人視覺定位的驗證方法
CN108908409B (zh) * 2018-08-27 2019-06-04 东北大学 一种并联机械手重复定位精度可靠性试验装置及方法

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WO2014157358A1 (ja) * 2013-03-28 2014-10-02 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び記録媒体
US9842754B2 (en) 2013-03-28 2017-12-12 Hitachi Kokusai Electric, Inc. Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

Also Published As

Publication number Publication date
JP5597536B2 (ja) 2014-10-01
US20110125325A1 (en) 2011-05-26
CN102112274B (zh) 2014-11-19
DE112009001863A5 (de) 2011-11-24
JPWO2010013732A1 (ja) 2012-01-12
US8688276B2 (en) 2014-04-01
KR20110052675A (ko) 2011-05-18
DE112009001863T5 (de) 2012-01-26
CN102112274A (zh) 2011-06-29
TWI488723B (zh) 2015-06-21
KR101621814B1 (ko) 2016-05-17
TW201012608A (en) 2010-04-01

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