JP5547818B2 - プリント回路板 - Google Patents
プリント回路板 Download PDFInfo
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- JP5547818B2 JP5547818B2 JP2012548000A JP2012548000A JP5547818B2 JP 5547818 B2 JP5547818 B2 JP 5547818B2 JP 2012548000 A JP2012548000 A JP 2012548000A JP 2012548000 A JP2012548000 A JP 2012548000A JP 5547818 B2 JP5547818 B2 JP 5547818B2
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- MTCPZNVSDFCBBE-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl MTCPZNVSDFCBBE-UHFFFAOYSA-N 0.000 description 11
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- MPCDNZSLJWJDNW-UHFFFAOYSA-N 1,2,3-trichloro-4-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=C(Cl)C(Cl)=CC=2)Cl)=C1 MPCDNZSLJWJDNW-UHFFFAOYSA-N 0.000 description 3
- BQENMISTWGTJIJ-UHFFFAOYSA-N 2,3,3',4,5-pentachlorobiphenyl Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C(Cl)=C(Cl)C=2)Cl)=C1 BQENMISTWGTJIJ-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- 230000008094 contradictory effect Effects 0.000 description 1
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- 238000005549 size reduction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
- H04M1/0252—Details of the mechanical connection between the housing parts or relating to the method of assembly by means of a snap-on mechanism
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
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Description
Claims (17)
- プリント回路板であって、
前記プリント回路板の基体部と、
複数の配線を含む、前記プリント回路板の可撓性部と、
前記複数の配線とのインタフェースを含む、前記可撓性部の端部とを備え、
前記端部は筐体内の第1深さレベルにある第1平面におおよそ位置し、
前記基体部は前記筐体内の第2深さレベルにある第2平面におおよそ位置し、
前記複数の配線は、厚い又は太い配線と、薄い又は細い配線とを含み、
前記厚い又は太い配線は前記可撓性部の第1層内の第1領域に位置し、
前記薄い又は細い配線は前記可撓性部の第2層内の第2領域に位置し、
前記第1領域は前記第2領域よりも前記可撓性部の側縁に近く、
前記第2層は前記第1層よりも前記可撓性部の中央に近く、
前記第1領域は前記第2領域よりも高い応力を受けることを特徴とするプリント回路板。 - 前記基体部、前記可撓性部及び前記端部を備える第1プリント回路板と、
前記筐体内に固定された第2プリント回路板とを更に備え、
前記第2プリント回路板は、前記可撓性部上の前記複数の配線を介して前記第1プリント回路板と前記第2プリント回路板との間で電力及びデータが伝達されるように、前記可撓性部の前記端部の前記インタフェースに結合されることを特徴とする請求項1に記載のプリント回路板。 - 前記第2平面は、前記第1平面に対して回転して傾斜していることを特徴とする請求項2に記載のプリント回路板。
- 前記可撓性部は前記基体部から延びることを特徴とする請求項3に記載のプリント回路板。
- 前記可撓性部は、前記基体部から前記可撓性部が延びる部分に近接して前記可撓性部にわたって配置された第1留め具によって前記筐体に固定されるとともに、前記端部に近接して前記可撓性部にわたって配置された第2留め具によって固定されることを特徴とする請求項4に記載のプリント回路板。
- 前記第1留め具と前記第2留め具との少なくとも1つは、当該第1留め具又は当該第2留め具に近接する前記可撓性部の曲げ半径を増やすように構成された丸みを帯びた面を含むことを特徴とする請求項5に記載のプリント回路板。
- 前記第1留め具は前記可撓性部の第3領域に接触し、前記第2留め具は前記可撓性部の第4領域に接触し、
前記第1留め具及び前記第2留め具はそれぞれ、前記可撓性部の前記第3領域と前記第4領域との間にある前記可撓性部のエリアに曲げ応力を集中させるように構成されることを特徴とする請求項6に記載のプリント回路板。 - 計算デバイスに用いられる多平面プリント回路板であって、
剛性基体部と可撓性部とを有する一体形成された基体部であって、前記可撓性部の自由端は、そらされるとともに必要に応じて回転されるように配置され、前記多平面プリント回路板の前記剛性基体部とは異なる平面にずれた位置に固定される、基体部と、
前記可撓性部の前記自由端にあるインタフェースであって、可撓性ケーブルの代わりに別のプリント回路板に結合されるのに適したインタフェースと、
前記可撓性部上の複数の配線とを備え、
前記複数の配線は、厚い又は太い配線と、薄い又は細い配線とを含み、
前記厚い又は太い配線は前記可撓性部の第1層内の第1領域に位置し、
前記薄い又は細い配線は前記可撓性部の第2層内の第2領域に位置し、
前記第2層は前記第1層よりも前記可撓性部の中央に近く、
前記第1領域は前記第2領域よりも高い応力を受けることを特徴とする多平面プリント回路板。 - 前記複数の配線は、引張状態にある第1層の配線と圧縮状態にある第2層の配線を含む複数層に編成されることを特徴とする請求項8に記載の多平面プリント回路板。
- 前記可撓性部の前記自由端が上方に曲がっている場合に、前記多平面プリント回路板の前記可撓性部の下部に位置する前記可撓性部内の前記第1層の配線は引張状態にあることを特徴とする請求項9に記載の多平面プリント回路板。
- 前記可撓性部の前記自由端が上方に曲がっている場合に、前記多平面プリント回路板の前記可撓性部の上部に位置する前記可撓性部内の前記第2層の配線は圧縮状態にあることを特徴とする請求項10に記載の多平面プリント回路板。
- 前記上方に曲がった多平面プリント回路板の前記上部における圧縮力と前記上方に曲がった多平面プリント回路板の前記下部における引張力とは前記多平面プリント回路板の中立軸で均衡することを特徴とする請求項11に記載の多平面プリント回路板。
- 前記多平面プリント回路板の前記中立軸の位置は、前記第1層の配線及び前記第2層の配線の位置、本数及び厚さ又は太さに基づくことを特徴とする請求項12に記載の多平面プリント回路板。
- 前記多平面プリント回路板の高応力部にある前記複数の配線は厚い又は太い配線であることを特徴とする請求項13に記載の多平面プリント回路板。
- 前記多平面プリント回路板の低応力部にある前記複数の配線は薄い又は細い配線であることを特徴とする請求項13に記載の多平面プリント回路板。
- 前記多平面プリント回路板における応力の量を低減するように配置された応力分離部をさらに備えることを特徴とする請求項8に記載の多平面プリント回路板。
- 前記応力分離部は留め具として構成されることを特徴とする請求項16に記載の多平面プリント回路板。
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US29273910P | 2010-01-06 | 2010-01-06 | |
US61/292,739 | 2010-01-06 | ||
US12/694,166 | 2010-01-26 | ||
US12/694,166 US7995334B2 (en) | 2010-01-06 | 2010-01-26 | Printed circuit board |
PCT/US2010/047272 WO2011084187A1 (en) | 2010-01-06 | 2010-08-31 | Printed circuit board |
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JP2013217790A Division JP5439628B2 (ja) | 2010-01-06 | 2013-10-18 | プリント回路板 |
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JP2012548000A Active JP5547818B2 (ja) | 2010-01-06 | 2010-08-31 | プリント回路板 |
JP2013217790A Active JP5439628B2 (ja) | 2010-01-06 | 2013-10-18 | プリント回路板 |
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EP (2) | EP2775375B1 (ja) |
JP (2) | JP5547818B2 (ja) |
KR (2) | KR101449220B1 (ja) |
CN (2) | CN102118922B (ja) |
AU (1) | AU2010340306B2 (ja) |
BR (1) | BR112012016803B1 (ja) |
DE (1) | DE112010005092T5 (ja) |
GB (1) | GB2490072B (ja) |
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Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8238087B2 (en) | 2010-01-06 | 2012-08-07 | Apple Inc. | Display module |
US8432678B2 (en) | 2010-01-06 | 2013-04-30 | Apple Inc. | Component assembly |
US7995334B2 (en) * | 2010-01-06 | 2011-08-09 | Apple Inc. | Printed circuit board |
WO2013069200A1 (ja) * | 2011-11-11 | 2013-05-16 | パナソニック株式会社 | 電子機器 |
US9084357B2 (en) * | 2012-09-11 | 2015-07-14 | Apple Inc. | Systems and methods for routing cables in an electronic device |
TW201419061A (zh) * | 2012-11-06 | 2014-05-16 | Wintek China Technology Ltd | 觸控面板模組及其觸控裝置 |
US9600106B2 (en) * | 2014-12-12 | 2017-03-21 | Innolux Corporation | Electronic display module and apparatus using the same |
WO2019079636A1 (en) * | 2017-10-20 | 2019-04-25 | Elements of Genius, Inc. | APPARATUS AND DEVICE ANTENNA SYSTEM THAT CAN BE USED |
EP3553182A1 (en) | 2018-04-11 | 2019-10-16 | Université de Bourgogne | Detection method of somatic genetic anomalies, combination of capture probes and kit of detection |
JP7061690B2 (ja) * | 2018-11-21 | 2022-04-28 | 株式会社Fuji | 部品実装装置 |
CN110034389B (zh) * | 2019-04-19 | 2021-07-13 | 歌尔科技有限公司 | 一种电子设备及其天线 |
JP7226110B2 (ja) * | 2019-05-31 | 2023-02-21 | 株式会社オートネットワーク技術研究所 | 配線部材 |
US11799219B2 (en) * | 2020-03-13 | 2023-10-24 | Steering Solutions Ip Holding Corporation | Combination circuit board retention and interconnect |
CN114449825B (zh) * | 2022-02-08 | 2023-06-02 | 伊斯特电子科技(东台)有限公司 | 一种具有减震支撑机构的角度可调式柔性电路板 |
Family Cites Families (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3212255A1 (de) | 1982-04-02 | 1983-10-06 | Kienzle Apparate Gmbh | Anordnung zum beschaedigungsfreien loesen einer zwischen zwei zusammengefuegten gehaeuseteilen wirksamen, an sich nicht loesbaren schnappverbindung |
US4490690A (en) * | 1982-04-22 | 1984-12-25 | Junkosha Company, Ltd. | Strip line cable |
JPS59117800A (ja) | 1982-12-25 | 1984-07-07 | Fujitsu Ltd | バツフア・ストレ−ジの1ビツトエラ−処理方式 |
GB8418828D0 (en) | 1984-07-24 | 1984-08-30 | Lab Ltd Ab Ag | Calf screening |
JP2570410B2 (ja) | 1988-12-22 | 1997-01-08 | 日本電気株式会社 | 電子回路パッケージ |
US5268746A (en) * | 1989-09-26 | 1993-12-07 | Ente Per Le Nuove Tecnologie, L'energia E L'ambiente (Enea) | Devices for measuring the optical absorption in thin layer materials by using the photothermal deflection spectroscopy |
JP2875076B2 (ja) | 1990-11-29 | 1999-03-24 | 三井化学株式会社 | フレキシブル配線基板 |
US5121297A (en) * | 1990-12-31 | 1992-06-09 | Compaq Computer Corporation | Flexible printed circuits |
US5248960A (en) * | 1992-05-28 | 1993-09-28 | John Hamma | Signal generating/position controlling system |
JP2509855B2 (ja) | 1992-09-25 | 1996-06-26 | ユピテル工業株式会社 | 回路基板の接続部材及びその接続部材を用いた接続構造 |
US6356313B1 (en) | 1997-06-26 | 2002-03-12 | Sony Corporation | System and method for overlay of a motion video signal on an analog video signal |
JP2000002882A (ja) * | 1998-06-16 | 2000-01-07 | Toshiba Electronic Engineering Corp | 液晶表示装置及びその製造方法 |
US6431882B1 (en) * | 1998-08-13 | 2002-08-13 | Molex Incorporated | Connector with two rows of terminals having tail portions with similar impedance |
TW420969B (en) | 2000-01-28 | 2001-02-01 | Metal Ind Redearch & Dev Ct | Method of producing thin metal case with joint element |
JP2001263316A (ja) * | 2000-03-22 | 2001-09-26 | Sumitomo Wiring Syst Ltd | 平板材料の保持固定具 |
JP2001284747A (ja) * | 2000-04-04 | 2001-10-12 | Matsushita Electric Ind Co Ltd | フレキシブル配線板 |
US6675755B2 (en) | 2000-04-06 | 2004-01-13 | Visteon Global Technologies, Inc. | Integrated powertrain control system for large engines |
US20020059712A1 (en) | 2000-04-28 | 2002-05-23 | Hong-Line Chern | Combination mobile computer shell and its fabrication method |
FI118073B (fi) | 2000-08-03 | 2007-06-15 | Nokia Corp | Kannettava, ainakin kaksi käyttöasentoa käsittävä taitettava elektroninen laite, sekä saranamekanismi sitä varten |
JP3924126B2 (ja) | 2001-01-16 | 2007-06-06 | アルプス電気株式会社 | プリント配線基板、及びその製造方法 |
US7348964B1 (en) | 2001-05-22 | 2008-03-25 | Palm, Inc. | Single-piece top surface display layer and integrated front cover for an electronic device |
US6900984B2 (en) * | 2001-04-24 | 2005-05-31 | Apple Computer, Inc. | Computer component protection |
KR100806806B1 (ko) | 2001-05-29 | 2008-02-22 | 엘지.필립스 엘시디 주식회사 | 평판형 표시장치의 결합장치 |
US6771490B2 (en) | 2001-06-07 | 2004-08-03 | Liquidmetal Technologies | Metal frame for electronic hardware and flat panel displays |
JP4667652B2 (ja) * | 2001-06-12 | 2011-04-13 | ローム株式会社 | 電池パック、およびその製造方法 |
US7010121B2 (en) | 2001-08-06 | 2006-03-07 | Siemens Communications, Inc. | Mobile telephone and method for its manufacture |
US7439449B1 (en) * | 2002-02-14 | 2008-10-21 | Finisar Corporation | Flexible circuit for establishing electrical connectivity with optical subassembly |
US6950312B2 (en) * | 2001-10-02 | 2005-09-27 | International Business Machines Corporation | Electronic units and method for packaging and assembly of said electronic units |
JP2003273476A (ja) * | 2002-03-12 | 2003-09-26 | Seiko Epson Corp | 実装構造体及びその製造方法、電気光学装置、並びに電子機器 |
CN1448834A (zh) | 2002-03-28 | 2003-10-15 | 广达电脑股份有限公司 | 笔记本电脑的液晶显示器组件 |
KR100465796B1 (ko) | 2002-07-16 | 2005-01-13 | 삼성전자주식회사 | 디스플레이장치 |
JP4258295B2 (ja) * | 2003-07-07 | 2009-04-30 | 富士通株式会社 | 折り畳み型携帯端末 |
US7531752B2 (en) * | 2003-07-24 | 2009-05-12 | Nec Corporation | Flexible substrate and electronic device |
WO2005083548A1 (en) | 2004-02-23 | 2005-09-09 | Lapon, L.L.C. D/B/A Laplooks, L.L.C. | Impression creating device and method for a laptop computer |
US7456355B2 (en) | 2004-03-10 | 2008-11-25 | G4S Justice Services (Canada) Inc. | Permanently closed enclosure apparatus and method for accessing an internal portion thereof |
JP4205618B2 (ja) | 2004-03-25 | 2009-01-07 | Nec液晶テクノロジー株式会社 | 液晶モジュール及びそれに用いるバックライト |
US20070132733A1 (en) * | 2004-06-08 | 2007-06-14 | Pranil Ram | Computer Apparatus with added functionality |
JP3850847B2 (ja) | 2004-06-28 | 2006-11-29 | 株式会社東芝 | 電子機器の液晶表示装置保護構造 |
US7515431B1 (en) * | 2004-07-02 | 2009-04-07 | Apple Inc. | Handheld computing device |
KR101221428B1 (ko) | 2004-07-20 | 2013-01-11 | 김시환 | 휴대용 표시장치 |
US20060042827A1 (en) * | 2004-09-02 | 2006-03-02 | Chou Wai P | SD/MMC cards |
US7148428B2 (en) | 2004-09-27 | 2006-12-12 | Intel Corporation | Flexible cable for high-speed interconnect |
US7095476B2 (en) * | 2004-10-15 | 2006-08-22 | Wintek Corporation | Liquid crystal module |
JP2006128429A (ja) * | 2004-10-29 | 2006-05-18 | Seiko Epson Corp | 回路基板および半導体装置 |
DE102005012404B4 (de) * | 2005-03-17 | 2007-05-03 | Siemens Ag | Leiterplatte |
KR100713536B1 (ko) * | 2005-06-07 | 2007-04-30 | 삼성전자주식회사 | 전자기기의 연성회로 |
JP2007067244A (ja) * | 2005-08-31 | 2007-03-15 | Sony Corp | 回路基板 |
JP2007067243A (ja) * | 2005-08-31 | 2007-03-15 | Sony Corp | 回路基板及び電子機器 |
US20070111598A1 (en) * | 2005-11-14 | 2007-05-17 | Quilici James E | Electrical connector assemblies and methods of fabrication |
DE102005056147A1 (de) | 2005-11-23 | 2007-05-31 | Panta Gmbh | Elektrischer Verbinder |
TW200720795A (en) | 2005-11-25 | 2007-06-01 | Innolux Display Corp | Liquid crystal display |
JP2007299784A (ja) * | 2006-04-27 | 2007-11-15 | Toshiba Corp | 実装構造および実装構造を備えた電子機器 |
KR100778483B1 (ko) | 2006-07-27 | 2007-11-21 | 엘지전자 주식회사 | 휴대 단말기 |
TW200813690A (en) | 2006-09-01 | 2008-03-16 | Asustek Comp Inc | Portable computer |
WO2008050408A1 (fr) | 2006-10-24 | 2008-05-02 | Panasonic Corporation | Dispositif électronique et téléphone mobile munis d'un dispositif d'affichage |
US7912501B2 (en) * | 2007-01-05 | 2011-03-22 | Apple Inc. | Audio I/O headset plug and plug detection circuitry |
US7688574B2 (en) | 2007-01-05 | 2010-03-30 | Apple Inc. | Cold worked metal housing for a portable electronic device |
US8472203B2 (en) | 2007-09-04 | 2013-06-25 | Apple Inc. | Assembly of a handheld electronic device |
CN101437373B (zh) | 2007-11-16 | 2012-09-26 | 鸿富锦精密工业(深圳)有限公司 | 金属壳体成型方法 |
EP2071377B1 (en) | 2007-12-12 | 2012-04-18 | JDS Uniphase Corporation | Packaging a reconfigurable optical add-drop module |
US7733639B2 (en) | 2008-01-31 | 2010-06-08 | Imation Corp. | Tamper evident portable memory housing and device |
US8537543B2 (en) | 2008-04-11 | 2013-09-17 | Apple Inc. | Portable electronic device housing structures |
US7697281B2 (en) | 2008-09-05 | 2010-04-13 | Apple Inc. | Handheld computing device |
US20100157522A1 (en) * | 2008-12-19 | 2010-06-24 | Gamal Refai-Ahmed | Alternative Form Factor Computing Device with Cycling Air Flow |
US8199468B2 (en) | 2009-10-16 | 2012-06-12 | Apple Inc. | Computer housing |
US7995334B2 (en) * | 2010-01-06 | 2011-08-09 | Apple Inc. | Printed circuit board |
-
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- 2010-08-31 JP JP2012548000A patent/JP5547818B2/ja active Active
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- 2010-08-31 EP EP10749586.3A patent/EP2522206B1/en active Active
- 2010-08-31 KR KR1020137010013A patent/KR101283066B1/ko active IP Right Grant
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KR101283066B1 (ko) | 2013-07-05 |
US20120195008A1 (en) | 2012-08-02 |
EP2775375A1 (en) | 2014-09-10 |
JP5439628B2 (ja) | 2014-03-12 |
DE112010005092T5 (de) | 2012-10-25 |
KR20130045424A (ko) | 2013-05-03 |
JP2013516786A (ja) | 2013-05-13 |
KR101449220B1 (ko) | 2014-10-08 |
EP2522206B1 (en) | 2014-07-30 |
CN201903812U (zh) | 2011-07-20 |
BR112012016803A2 (pt) | 2016-04-19 |
US8659906B2 (en) | 2014-02-25 |
AU2010340306B2 (en) | 2015-04-16 |
EP2775375B1 (en) | 2015-09-30 |
CN102118922A (zh) | 2011-07-06 |
WO2011084187A1 (en) | 2011-07-14 |
JP2014042331A (ja) | 2014-03-06 |
CN102118922B (zh) | 2013-09-18 |
BR112012016803B1 (pt) | 2020-02-04 |
GB2490072B (en) | 2014-08-27 |
US20110225817A1 (en) | 2011-09-22 |
GB2490072A (en) | 2012-10-17 |
US20110164371A1 (en) | 2011-07-07 |
HK1159946A1 (en) | 2012-08-03 |
KR20120115354A (ko) | 2012-10-17 |
AU2010340306A1 (en) | 2012-08-23 |
US7995334B2 (en) | 2011-08-09 |
EP2522206A1 (en) | 2012-11-14 |
US8171623B2 (en) | 2012-05-08 |
GB201213882D0 (en) | 2012-09-19 |
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