200948223 九、發明說明： 【發明所屬之技術領域】 本發明疋有關於一種軟性印刷電路板(f]exible printed circuit)與液日日顯不核組（Hquid crystal display module)，且特 別是有關於一種高度抗靜電之軟性印刷電路板與液晶顯示 模組。 【先前技術】 隨著現代視訊技術的進步，液晶顯示模組已被大量地使用 於手機、筆記型電腦、個人電腦及個人數位助理等消費性電子 產品的顯示螢幕上。液晶顯示模組通常包括電性相連接之液晶 顯示面板(liquid crystal display panel)與軟性印刷電路板，其 中軟性印刷電路板用於驅動液晶顯示面板之晶片外圍電 路，並可再連接至其他界面端(如手機或是筆記型電腦的主機 板)。 圖1A〜1C為習知之一種軟性印刷電路板於不同視角 的示意圖，其中軟性印刷電路板是與液晶顯示面板組裝成為 液晶顯示模組，且圖1B為軟性印刷電路板之側視剖面圖。 請參考圖1A〜1C，習知之軟性印刷電路板1〇〇之電路是採 用雙面板設計，然而軟性印刷電路板1〇〇的兩個外引脚接 合(Outer Lead Bonding, 〇LB)區域SI、S2卻是採用單面板 設計，其中外引腳接合區域S2是分別用於連接前述之 液晶顯示面板與其他界面端。 具體而言’軟性印刷電路板100包括一基板（base ίϊ1πι)110、一第一電路層（circuit ' 一第二電路層 200948223 130、一第一保護層（cover layer)14〇以及一第二保護層 150，其中第一電路層12〇與第一保護層14〇設於基板11〇 的一面’而第二電路層13〇與第二保護層150設於基板110 的另外一面，亦即第一電路層12〇與第二電路層13〇構成 雙面板設計。此外，依序之第一保護層140、第一電路層 120、基板110、第二電路層13〇與第二保護層15〇兩兩之 間更》又有黏著層（adhesive layer) 160以增強其結合強度。 ❹ Ο 承接上述，部分第一電路層12〇是裸露於第一保護層 卜而成為弟一引線端122，類似地，部分第二電路層 1 甘3〇是裸露於第二保護層BO外而成為-第二引線端132, 二人第引線端122與第二引線端132是分別位於外引腳 ^ "區域S2、S1。此外，軟性印刷電路板100之第二引線 曰挪132會與液晶顯示面板(未㈣)之接腳焊合以組裝成液 日日顯不模組。 的靜顯示面板或是軟性印刷電路板⑽遭遇到強大 則靜+物時’若靜電粒子無法即時導出液晶顯示模組， 液晶量累積在液晶顯示模組中。如此一來， 一 ϊ路:^之晶片與電路或是軟性印刷電路板1〇0的第 正常“，IS二電均會受到靜電影響而無法 粒子而損壞。 與電路層會因為大量的靜電 其二面圖， ::考;二此軟性_=^ 心括依序堆疊之-基板210、—電路層22〇、一保護 200948223 •層230以及一網銅層240。 承接上述，網銅層240之主要功能在於增加軟性印刷 電路板200的結構強度’以使軟性印刷電路板200之電路 層220在彎折的過程中不易碎裂。此外，網銅層240可吸 引累積在軟性印刷電路板20〇中的靜電粒子，因此而猶具 有抗靜電的效果。 然而，此網銅層24〇之結構必須要在另外進行成膜姓 刻製程始能製成，造成軟性印刷電路板200的製作成本大 〇 幅提升。 【發明内容】 有鑑於此’本發明之目的是提供一種具高度抗靜電之 軟性印刷電路板與液晶顯示模組。 為達上述或是其他目的’本發明提出一種軟性印刷電 路板，包括一基板、一弟一電路層、一第二電路層、一第 一保護層以及一第二保護層。基板具有相對之第一表面與 ❹ 第二表面，而第一電路層設於基板之第一表面，且第二電 路層設於基板之第二表面，又第一保護層與第二保護層分 別設於第一電路層與第二電路層異於基板之表面。第二^ 路層包括位於基板不同區域之一第一電路區與一第一裸露 區’而第-保護層是覆蓋第一電路區，並裸露出第一裸= 區。第二電路層包括位於基板不同區域之一第二電路區與 /第二引線端，而第二保護層是覆蓋第二電路區，並裸^ 出第一引線端。 為達上述或是其他目的，本發明另提出一種液晶顯示 8 200948223 模組，包括一液晶顯示面板以及前述之軟性印刷電路板。 液晶顯示面板具有對應第二引線端之接腳，且軟性印刷電 路板是藉由第二引線端與接腳電性連接而連接至液晶顯示 面板。 在本發明之一實施例中’上述之第一裸露區之結構可 為片狀銅層。此外’第一裸露區之結構亦可包括相連之片 狀銅層與網狀銅層’且網狀銅層所位於之區域適於彎折。 Ο 鬱 在本發明之一實施例中，上述之第一電路層更可包括 接地區’而接地區與第一抗靜電層電性連接。此外，第一 電路層亦可包括第一引線端，且第一引線端與第一抗靜電 層疋位於基板之相對兩側。 勺在本發明之一實施例中，上述之軟性印刷電路板更可 ^括補強板(stiffener)，而補強板是配置於第二保護層昱於 第=電路層之表面，且觀板與第二⑽端是位於基板之 相對兩侧。 在本發明之一實施例中，上述之第二電路層更可包括 2裸露區，且第二裸露區與第二引線端是位於基板之相 、A則’又该第二保護層裸露出該第二裸露區。此外，第 構可為片狀銅層。另外，第二裸露區之結構 之片狀銅層與崎銅層，且網狀銅層所位於 之&域適於彎折。 在本發明之一實施例中，上述 — 有鄰近接腳之晶片。 面板更可具 综上所述，當本發明之軟性 組遭遇強大的靜電粒子時，靜電粒4迅:被 200948223 以降低靜電粒子對於晶片 電性連接至接地區，以使 此可有效提升軟性印刷電 力以增加其使用品質。 峻的損害。此外， 时電麵早、* 棵路區可 路板C步迅速被導出，如 模組的抗靜電能 為讓本發明之上述和其他目 易懂，下文特舉較佳實施例，的、特徵和優點能更明顯 明如下。 、’配合所附圖式，作詳細說200948223 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a flexible printed circuit board (f)exible printed circuit and a Hquid crystal display module, and particularly relates to A highly antistatic soft printed circuit board and liquid crystal display module. [Prior Art] With the advancement of modern video technology, liquid crystal display modules have been widely used on the display screens of consumer electronic products such as mobile phones, notebook computers, personal computers, and personal digital assistants. The liquid crystal display module usually comprises an electrically connected liquid crystal display panel and a flexible printed circuit board, wherein the flexible printed circuit board is used for driving the peripheral circuit of the liquid crystal display panel, and can be connected to other interface ends. (such as the motherboard of a mobile phone or a notebook computer). 1A to 1C are schematic views of a conventional flexible printed circuit board at different viewing angles, wherein a flexible printed circuit board is assembled with a liquid crystal display panel as a liquid crystal display module, and Fig. 1B is a side cross-sectional view of the flexible printed circuit board. Referring to FIGS. 1A to 1C, the circuit of the conventional flexible printed circuit board is a double-panel design. However, the outer lead bonding (〇 LB) area SI of the flexible printed circuit board 1 、 S2 adopts a single-panel design, in which the outer pin bonding area S2 is used to connect the aforementioned liquid crystal display panel and other interface ends, respectively. Specifically, the flexible printed circuit board 100 includes a substrate (base ϊ1πι) 110, a first circuit layer (circuit 'a second circuit layer 200948223 130, a first cover layer 14 〇 and a second protection layer). The layer 150, wherein the first circuit layer 12 and the first protective layer 14 are disposed on one side of the substrate 11 and the second circuit layer 13 and the second protective layer 150 are disposed on the other side of the substrate 110, that is, the first layer The circuit layer 12 〇 and the second circuit layer 13 〇 form a double-panel design. Further, the first protective layer 140 , the first circuit layer 120 , the substrate 110 , the second circuit layer 13 〇 and the second protective layer 15 〇 There is an adhesive layer 160 to enhance the bonding strength. ❹ 承 According to the above, part of the first circuit layer 12 is exposed to the first protective layer and becomes a lead terminal 122, similarly a part of the second circuit layer 1 is exposed outside the second protective layer BO to become a second lead terminal 132, and the two lead terminals 122 and the second lead terminals 132 are respectively located at the outer pin ^ " S2, S1. In addition, the second lead of the flexible printed circuit board 100 Move 132 will be soldered to the liquid crystal display panel (not (4)) to assemble the liquid into the day. The static display panel or the flexible printed circuit board (10) encounters a strong static object when the 'static particles It is impossible to export the liquid crystal display module in real time, and the liquid crystal amount is accumulated in the liquid crystal display module. In this way, the first circuit of the chip and the circuit or the flexible printed circuit board 1〇0 is normal. It is affected by static electricity and cannot be damaged by particles. The circuit layer will be double-sided due to a large amount of static electricity, :: test; two soft _=^ hearts are sequentially stacked - substrate 210, - circuit layer 22 〇, a protection 200948223 • Layer 230 and a mesh copper layer 240. In view of the above, the main function of the mesh copper layer 240 is to increase the structural strength of the flexible printed circuit board 200 so that the circuit layer 220 of the flexible printed circuit board 200 is not easily bent during the process. In addition, the mesh copper layer 240 can attract electrostatic particles accumulated in the flexible printed circuit board 20, and thus has an antistatic effect. However, the structure of the mesh copper layer 24 must be additionally formed into a film. Surname process The manufacturing cost of the flexible printed circuit board 200 is greatly increased. [Invention] In view of the above, an object of the present invention is to provide a flexible printed circuit board and a liquid crystal display module having high antistatic properties. Or other purposes, the present invention provides a flexible printed circuit board comprising a substrate, a first circuit layer, a second circuit layer, a first protective layer and a second protective layer. The substrate has a first surface opposite to a second surface, wherein the first circuit layer is disposed on the first surface of the substrate, and the second circuit layer is disposed on the second surface of the substrate, and the first protective layer and the second protective layer are respectively disposed on the first circuit layer and The two circuit layers are different from the surface of the substrate. The second layer includes a first circuit region and a first exposed region ′ in different regions of the substrate, and the first protective layer covers the first circuit region and exposes the first bare= region. The second circuit layer includes a second circuit region and/or a second lead end located in different regions of the substrate, and the second protective layer covers the second circuit region and the first lead end is bare. To achieve the above or other objects, the present invention further provides a liquid crystal display 8 200948223 module comprising a liquid crystal display panel and the aforementioned flexible printed circuit board. The liquid crystal display panel has a pin corresponding to the second lead end, and the flexible printed circuit board is connected to the liquid crystal display panel by electrically connecting the second lead end to the pin. In an embodiment of the invention, the structure of the first exposed region described above may be a sheet-like copper layer. Further, the structure of the first bare region may also include a connected sheet-like copper layer and a mesh copper layer, and the region in which the mesh copper layer is located is adapted to be bent. In one embodiment of the present invention, the first circuit layer may further include a connection region and the connection region is electrically connected to the first antistatic layer. In addition, the first circuit layer may further include a first lead end, and the first lead end and the first antistatic layer are located on opposite sides of the substrate. In one embodiment of the present invention, the flexible printed circuit board may further include a stiffener, and the reinforcing plate is disposed on the surface of the second protective layer on the second circuit layer, and the viewing plate and the first The two (10) ends are located on opposite sides of the substrate. In an embodiment of the present invention, the second circuit layer may further include 2 bare regions, and the second exposed region and the second lead end are located on the substrate, and the second protective layer is exposed. Second exposed area. Further, the first structure may be a sheet-like copper layer. Further, the sheet-like copper layer and the sacrificial copper layer of the structure of the second bare region, and the mesh layer of the mesh copper layer are adapted to be bent. In one embodiment of the invention, the above - a wafer having adjacent pins. The panel can be further described. When the soft group of the present invention encounters strong electrostatic particles, the electrostatic particles 4 are: 200948223 to reduce the electrostatic particles to electrically connect the wafer to the connection area, so that this can effectively improve the soft printing. Electricity to increase the quality of its use. Serious damage. In addition, the time surface is early, and the road surface C step is quickly derived. For example, the antistatic energy of the module is to make the above and other aspects of the present invention easy to understand. And the advantages can be more clearly as follows. , 'together with the drawings, for details
【實施方式】 Ο 圖3A〜3C為本發明—實 同視角的示意圖，其中圖3B為私丨之軟性印刷電路板於不 圖。請參考圖3A〜3C，本發日^人眭印刷電路板之侧視剖面 一基板31 〇、一第一電路層32〇生印刷電路板 一保護層340以及一第二保讀 一1 基板310具有相對之第〜參 第一電路層320設於基板31〇 ^ f A1與第二表面A2，而 層330設於基板310之第二表第表面S1’且第二電絡 | 负 S2。 第一保護層340設於第一電拉思， 电路層320異於基板310之 300包栝 第二電路層330、一第 一面’且第一保護層340並未完全覆蓋住第一電路層32〇 ’ 以供第一電路層320裸露出之區域形成一第一裸露區 324,而第一保護層340覆蓋第一電路層320的區域即為第 一電路區322 ; 第二保護層35〇設於第二電路層33〇異於基板31〇之 一面，且未完全覆蓋住第二電路層330 ’以供第二電路層 330裸露出之區域形成一第二引線端334，而第二保護層 10 200948223 350覆蓋第二電路層330的區域即為第二電路區332。 在本實施例_，第二引線端334是位於軟性印刷電路 板300之外引腳接合區域S3,並用於與液晶顯示面板（未繪 示）之接腳（未纟會示）結合’以組裝成為液晶顯示模組，其中 第二引線端334與接腳以構接的方式電性連接，如：c〇G (Chip On Glass)、TAB(Tape Automatic Bonding)等方式結 合。[Embodiment] FIG. 3A to FIG. 3C are schematic views of the present invention as a true perspective, and FIG. 3B is a private printed circuit board. Referring to FIGS. 3A to 3C, a side view of a printed circuit board, a substrate 31, a first circuit layer 32, a printed circuit board, a protective layer 340, and a second read-on-one substrate 310 are shown. The first circuit layer 320 is disposed on the substrate 31A1 and the second surface A2, and the layer 330 is disposed on the second surface S1' of the substrate 310 and the second electrical system | negative S2. The first protective layer 340 is disposed on the first circuit board 320. The circuit layer 320 is different from the 300-packed second circuit layer 330 of the substrate 310, and the first surface ′′ and the first protective layer 340 does not completely cover the first circuit layer. 32〇', a region of the first circuit layer 320 is exposed to form a first exposed region 324, and a region where the first protective layer 340 covers the first circuit layer 320 is the first circuit region 322; the second protective layer 35〇 The second circuit layer 33 is disposed on a side of the substrate 31, and does not completely cover the second circuit layer 330' to expose a second circuit layer 330 to form a second lead end 334, and the second protection layer The layer 10 200948223 350 covers the area of the second circuit layer 330 as the second circuit area 332. In this embodiment, the second lead terminal 334 is located outside the flexible printed circuit board 300 in the pin bonding area S3, and is used in combination with a pin (not shown) of the liquid crystal display panel (not shown) to assemble As a liquid crystal display module, the second lead terminal 334 is electrically connected to the pin in a manner of bonding, such as c〇G (Chip On Glass) and TAB (Tape Automatic Bonding).
鬱 此外，第一裸露區324是與第二引線端334相對，並 由基板310而分隔開來。液晶顯示面板具有至少一晶片（未 繚示），而某些晶片是鄰近液晶顯示面板的接腳，亦即這些 晶片是鄰近軟性印刷電路板300之第一裸露區324叙第二 引線端334。再者，第一裸露區324可為片狀銅層的結構 藉以分散或傳導出大量靜電。 '° 當軟性印刷電路板300與液晶顯示模組遭遇強大的靜 電粒子時’靜電粒子會迅速被導到第一抗靜電層324，藉 此以降低靜電粒子對於電路的損害，尤其當靜電粒子產^ 於晶片附近時，大部分的靜電粒子會向第一抗靜電層 移動而遠離晶片，如此在工作中之晶片便可有效降^ 干擾而不易出現白屏等異常現象。 由於本發明是在製作第—電路層，的過程中妒 成第-裸露區324與第-電路區322,藉以達到抗靜 效果，因此树明無需奸叫他餘單作 ^ 構件(如圖2之網銅層24G)，進而可大幅降低製作電的 在圖从中，為搭配軟性印刷電路板雇^ 性，第-裸露區324亦可形成有 ^ = 200948223 別為一片狀銅層324a以及一網狀銅層324b，以供網狀銅 層324b所位在的區域適於彎折。 此外，為使組裝後之軟性印刷電路板300(液晶顯示模 組）能進一步連接至特定之装置（已下將以筆記型電腦舉例 §兒明，但本發明之液晶顯示模組亦可組裝至手機、個人電 腦及個人數位助理等等消費性電子產品），第一電路層32〇異 於第一裸露區324之一端形成有一裸露之第一弓丨線端 326,且第一引線端326即形成軟性印刷電路板3〇〇之外引 ❹ 腳接合區域S4。換句話說，第一電路區322便是位於第一 裸露區324與第一引線端326之間，而第一裸露區324與 第一引線端326是位於基板310之第一表面A1的相對兩 側。 在本實施例中，軟性印刷電路板300之兩個外引腳接 合區域S3、S4是位於基板310的相對兩侧，所以苐—引線 端326與第二引線端334即是位於基板31〇的相對兩侧； 不過本發明並不限定兩個外引腳接合區域S3、S4之相對位 置’舉例而言，兩個外引腳接合區域S3、S4亦可位於基板 310的相鄰兩侧。 藉由將第一引線端326連結至筆記型電腦（未繪示）之 主機板(Mother Board)接腳，軟性印刷電路板3〇〇便可用於 傳遞葦s己型電腦的影像祝號至液晶顯示面板，以顯示書 面。一般而言’主機板會設置接地端以將靜電導出，因此 本貫施例之軟性印刷電路板300之第一導線層320可裸露 形成至少一接地區328(圖中繪示多個僅為示意，本發明並 不限定接地端的數量），以供接地區328與第一裸露區324 12 200948223 電性連接。 ¥軟性印刷電路板300連接至主機板時，便可將接地 區328連接至主機板之接地端（因此接地區328的位置需與 主機板之接地端位置做搭配設計）’且當靜電粒子被導入第 一裸露區324後，可藉由接地區328之設計將靜電迅速導 入筆記型電腦之接地端，而能有效將靜電導出，進一步能 提升軟性印刷電路板300與液晶顯示模組之抗靜電能力。 請再參考圖3A〜3C’為強化第一電路層320與第一保 _ 護層340之間的結合強度，本實施例於第一電路層32〇與 第一保護層340之間配置一黏著層360，本發明並不限定 黏著層360的配置位置，且熟悉此項技藝者亦可依據實際 設計情形而配置多個黏著層360於第一電路層320、基板 310、第二電路層330與第二保護層350兩兩之間的位置。 此外，本實施例設有一補強板370以使第一引線端326 能更加容易與主機板之接腳定位結合，其中補強板370設 於第一保5蒦層350異於第二電路層332之表面，且補強板 Q 370與第二引線端334是位於基板310之兩端。 因此’為進一步提升軟性印刷電路板的抗靜電性，本 發明亦可將第二電路層比照第一電路層之設計，而於補強 板處改設置為第二裸露區，以下將再搭配圖示另述之，然 為求簡便，相同名稱的構件仍沿用相同的標號。 圖4A〜4C為本發明另一實施例之軟性印刷電路板於 不同視角的示意圖’其中圖4B為軟性印刷電路板之側視剖 面圖。請參考圖4A〜4C，本實施例之軟性印刷電路板400 與前述之軟性印刷電路板300(如圖3A〜3C所示）相似，其 ]3 200948223 差別僅在第二電路層330異於第二引線端334之一端更形 成有一裸露之第二裸露區430，亦即第二電路區332便是 位於第二裸露區436與第二引線螭334之間，而第二裸露 區436與第二引線端334是位於基板31〇之第二表面A2 的相對兩侧。 如此一來，當外引腳接合區域S4附近遭遇強大的靜電 粒子時’靜電粒子會迅速被導到第二裸露區436，藉此以 T低靜電粒子料晶片與電路的損害。附帶—提的是，儘 ©管本實施例之第二裸露區436為片狀銅層之結構，但是本 發明並不限定第二裸露區436之結構。 综上所述’本發明之軟性印刷電路板與液晶顯示模組 至 >、具有下列優點： 雷卩刷電路板與液晶顯示馳遭遇強大的韻 子對於晶片速被導到抗靜電層崎低編 Λ 之接灿被靜电層可電性連接至接地區與消費性電子產品 提升’以使靜絲子進—步被迅速導出，如此可有效 乂升軟性印刷電路板與液晶顯示模組的抗靜電能力。有β ，區中同時糊 發明無需以其他彭程單猫f丄達，靜電的效果。所以本 降低製作成本 獨製作抗靜電的構件，進而可大幅 限定Si發實施例揭露如上’然其並非用以 和祀圍内’當可作些許之更動與濁飾，因此本發 200948223 界定者為準。 範圍當視後附之申請專利範 【圖式簡單說明】 ㈡知一種軟性印刷電路板之俯視示意圖。 二一種軟性印刷電路板之剖視示意圖。 知-齡科，純讀視示意圖。 為===刷電路板之剖視示意圖。 ΟFurther, the first bare region 324 is opposed to the second lead terminal 334 and is separated by the substrate 310. The liquid crystal display panel has at least one wafer (not shown), and some of the wafers are adjacent to the pins of the liquid crystal display panel, that is, the wafers are adjacent to the first exposed portion 324 of the flexible printed circuit board 300. Furthermore, the first exposed region 324 can be a structure of a sheet-like copper layer to disperse or conduct a large amount of static electricity. '° When the flexible printed circuit board 300 and the liquid crystal display module encounter strong electrostatic particles, the electrostatic particles are quickly guided to the first antistatic layer 324, thereby reducing the damage of the electrostatic particles to the circuit, especially when the electrostatic particles are produced. ^ When the wafer is in the vicinity of the wafer, most of the electrostatic particles move toward the first antistatic layer away from the wafer, so that the wafer in operation can effectively reduce the interference and is not prone to abnormal phenomena such as white screen. Since the present invention is formed into the first-naked area 324 and the first-circuit area 322 in the process of fabricating the first circuit layer, the anti-static effect is achieved, so that the tree does not need to be smuggled to make it a component (see FIG. 2). The net copper layer 24G) can greatly reduce the manufacturing power. In order to match the flexible printed circuit board, the first exposed area 324 can also be formed with ^ = 200948223, which is a piece of copper layer 324a and a The mesh copper layer 324b is adapted to be bent in a region where the mesh copper layer 324b is located. In addition, in order to enable the assembled flexible printed circuit board 300 (liquid crystal display module) to be further connected to a specific device (the notebook computer will be exemplified below, but the liquid crystal display module of the present invention can also be assembled to The first circuit layer 32 is formed at one end of the first exposed area 324 to form a bare first bow end 326, and the first lead end 326 is formed by the first circuit layer 32, and the first circuit end 32 is formed by the mobile phone, the personal computer and the personal digital assistant. The foot bonding region S4 is formed outside the flexible printed circuit board 3 . In other words, the first circuit region 322 is located between the first bare region 324 and the first lead terminal 326, and the first bare region 324 and the first lead terminal 326 are opposite to each other on the first surface A1 of the substrate 310. side. In this embodiment, the two outer pin bonding regions S3, S4 of the flexible printed circuit board 300 are located on opposite sides of the substrate 310, so that the lead terminal 326 and the second lead terminal 334 are located on the substrate 31. Relative to both sides; however, the present invention does not limit the relative positions of the two outer pin bonding regions S3, S4. For example, the two outer pin bonding regions S3, S4 may also be located on adjacent sides of the substrate 310. By connecting the first lead terminal 326 to the Motherboard pin of a notebook computer (not shown), the flexible printed circuit board 3 can be used to transmit the image of the computer to the LCD. Display panel to display the written. Generally, the motherboard will be provided with a grounding terminal to discharge the static electricity. Therefore, the first conductive layer 320 of the flexible printed circuit board 300 of the present embodiment can be exposed to form at least one connection region 328 (the multiple figures shown in the figure are only schematic The present invention does not limit the number of ground terminals, so that the connection region 328 is electrically connected to the first bare region 324 12 200948223. When the flexible printed circuit board 300 is connected to the motherboard, the connection area 328 can be connected to the ground end of the motherboard (so the location of the connection area 328 needs to be matched with the ground end position of the motherboard)" and when the electrostatic particles are After the first exposed area 324 is introduced, the static electricity can be quickly introduced into the grounding end of the notebook computer by the design of the connection area 328, and the static electricity can be effectively led out, thereby further improving the antistatic of the flexible printed circuit board 300 and the liquid crystal display module. ability. Referring to FIG. 3A to FIG. 3C respectively, in order to strengthen the bonding strength between the first circuit layer 320 and the first protective layer 340, in this embodiment, an adhesive is disposed between the first circuit layer 32A and the first protective layer 340. The layer 360, the present invention does not limit the arrangement position of the adhesive layer 360, and those skilled in the art can also configure a plurality of adhesive layers 360 on the first circuit layer 320, the substrate 310, and the second circuit layer 330 according to actual design conditions. The position of the second protective layer 350 between the two. In addition, the present embodiment is provided with a reinforcing plate 370 to make the first lead end 326 more easily combined with the pin positioning of the motherboard. The reinforcing plate 370 is disposed on the first protective layer 350 and different from the second circuit layer 332. The surface, and the reinforcing plate Q 370 and the second lead end 334 are located at both ends of the substrate 310. Therefore, in order to further improve the antistatic property of the flexible printed circuit board, the second circuit layer can also be compared with the design of the first circuit layer, and the reinforcing plate is set to the second bare region, and the following will be further illustrated. In addition, for the sake of brevity, members of the same name still use the same reference numerals. 4A to 4C are schematic views of a flexible printed circuit board according to another embodiment of the present invention, wherein FIG. 4B is a side cross-sectional view of the flexible printed circuit board. Referring to FIGS. 4A to 4C, the flexible printed circuit board 400 of the present embodiment is similar to the aforementioned flexible printed circuit board 300 (shown in FIGS. 3A to 3C), and the difference of 3 200948223 is only different in the second circuit layer 330. One end of the two lead terminals 334 is further formed with a bare second exposed region 430, that is, the second circuit region 332 is located between the second bare region 436 and the second lead pad 334, and the second bare region 436 and the second portion The lead ends 334 are located on opposite sides of the second surface A2 of the substrate 31A. As a result, when strong electrostatic particles are encountered in the vicinity of the outer pin bonding region S4, the electrostatic particles are quickly guided to the second bare region 436, thereby damaging the low electrostatic particle wafer and the circuit. Incidentally, the second bare region 436 of the present embodiment is a structure of a sheet-like copper layer, but the present invention does not limit the structure of the second bare region 436. In summary, the flexible printed circuit board and the liquid crystal display module of the present invention have the following advantages: The Thunder brush circuit board and the liquid crystal display are subjected to a strong rhyme, and the wafer speed is led to an antistatic layer. The 接 Λ 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被Static capacity. There are β, the same paste in the area. The invention does not need to use other Pengcheng single cats to achieve the effect of static electricity. Therefore, the present invention can reduce the manufacturing cost of the antistatic member alone, and the invention can be substantially limited as disclosed above. However, it is not intended to be used in the context of the ' 当 当 当 当 当 当 当 当 当 当 当 当 当 当 当 , , , , , , , , , 2009 2009 2009 482 2009 482 482 482 482 quasi. Scope of the application of the patent application model [Simplified description of the diagram] (b) Know a schematic view of a flexible printed circuit board. A schematic cross-sectional view of two flexible printed circuit boards. Know-age department, pure reading view. A schematic cross-sectional view of the === brush board. Ο
立闰 貫施例之軟性印刷電路板之俯視示 思圖。 圖3B為本發明一實施例之軟性印刷電路板之剖視示 意圖。 圖3C為本發明-實施例之軟性印刷電路板之仰視示 意圖。 圖4A為本發明另-實施例之軟性印刷電路板之俯視 示意圖。 圖4B為本發明另-實施例之軟性印刷電路板之刻視 示意圖。 圖4C為本發明另一實施例之軟性印刷電路板之仰視 示意圖。 【主要元件符號說明】 100、200 :軟性印刷電路板 110、210 :基板 120 :第一電路層 122 :第一引線端 15 200948223 130 :第二電路層 132 :第二引線端 140 :第一保護層 150 :第二保護層 160 :黏著層 220 :電路層 230 :保護層 240 :網銅層 ❹ 300、400 :軟性印刷電路板 310 :基板 320 :第一電路層 322 :第一電路區 324 :第一裸露區 324a :片狀銅層 324b :網狀銅層 326 :第一引線端 Q 328 :接地區 330 :第二電路層 332 :第二電路區 334 :第二引線端 340 :第一保護層 350 :第二保護層 360 :黏著層 370 :補強板 436:第一裸露區 16 200948223 A1 :第一表面 A2 :第二表面 SI、S2、S3、S4 :外引腳接合區域A top-down view of a flexible printed circuit board. Fig. 3B is a cross-sectional view showing a flexible printed circuit board according to an embodiment of the present invention. Figure 3C is a bottom plan view of a flexible printed circuit board of the present invention. 4A is a top plan view of a flexible printed circuit board in accordance with another embodiment of the present invention. Fig. 4B is a schematic plan view showing a flexible printed circuit board according to another embodiment of the present invention. 4C is a bottom plan view of a flexible printed circuit board according to another embodiment of the present invention. [Main component symbol description] 100, 200: flexible printed circuit board 110, 210: substrate 120: first circuit layer 122: first lead terminal 15 200948223 130: second circuit layer 132: second lead terminal 140: first protection Layer 150: second protective layer 160: adhesive layer 220: circuit layer 230: protective layer 240: mesh copper layer 300, 400: flexible printed circuit board 310: substrate 320: first circuit layer 322: first circuit region 324: The first bare region 324a: the flake copper layer 324b: the mesh copper layer 326: the first lead terminal Q 328: the connection region 330: the second circuit layer 332: the second circuit region 334: the second lead terminal 340: the first protection Layer 350: second protective layer 360: adhesive layer 370: reinforcing plate 436: first bare region 16 200948223 A1: first surface A2: second surface SI, S2, S3, S4: outer pin bonding region
1717