200530723 九、發明說明： 【發明所屬之技術領域】 本發明係有關於液晶顯示裝置，尤其係有關於將裝載了 液晶顯示面板之驅動用LSI之軟性電路板經由非等向性導電 膜組裝於在設置了顯示用像素電極之透明絕緣基板之外周 部所形成之連接端子列的。 【先前技術】 一般TFT液晶模組之驅動電路由以下之構件構成，帶狀 之軟性電路板，裝載用以驅動TFT之驅動用lsi;及印刷電 路板(PCB: Printed Circuit B〇ard) ’供給該軟性電路板電 源或影像信號。以往，在對液晶單元組裝軟性電路板時常使200530723 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a liquid crystal display device, and more particularly, to assembling a flexible circuit board having a driving LSI with a liquid crystal display panel mounted thereon via an anisotropic conductive film. A row of connection terminals formed on the outer periphery of a transparent insulating substrate provided with pixel electrodes for display. [Prior technology] The driving circuit of a general TFT liquid crystal module is composed of the following components, a strip-shaped flexible circuit board, and a driving lsi for driving the TFT; and a printed circuit board (PCB: Printed Circuit B〇ard) 'Supply The flexible circuit board power or image signal. In the past, when assembling a flexible circuit board to a liquid crystal cell,
Anisotropic Conductive Film)〇 非等向性導電膜係導電性粒子分散於具有絕緣性之黏接樹 脂中，在厚度方向（連接方向）具有導電性的。 在液晶顯示裝置之製造之模組化製程，在—對透明絕緣 基板之間夹持液晶之液晶單元之—方之基板，例如m陣列 基板之外周㈣形成之連接端子列㈣料向性導電膜，將 軟性電路板和其對準後逐片暫時塵接。然:後，藉著使用加熱 工具對軟性電路板加熱m料向性導電膜之黏接樹脂 熱硬化而且分散於樹脂中之導電性粒子被夾在軟性電路板 之導線端子和TFT陣列基板之連接端子列之間，同時得到機 械式接合和電氣性導通。 在裝載驅動用LSI之軟性電路板，有⑽…⑽㈣打 5 2181-6647-PF；Ahddub 200530723Anisotropic Conductive Film) 〇 Anisotropic conductive film is a kind of conductive particles dispersed in an adhesive resin with insulation properties, and has conductivity in the thickness direction (connection direction). In the module manufacturing process of the liquid crystal display device, the substrate of the liquid crystal cell is sandwiched between a pair of transparent insulating substrates, such as an array of connection terminals formed outside the m-array substrate, and a material-oriented conductive film. , Align the flexible circuit board with it temporarily, one by one, after being aligned. Then: by using a heating tool to heat the flexible circuit board, the adhesive resin of the directional conductive film is thermally hardened and the conductive particles dispersed in the resin are sandwiched between the wire terminals of the flexible circuit board and the TFT array substrate. The terminal rows are simultaneously mechanically connected and electrically connected. On the flexible circuit board of the driver LSI, there are ⑽ ... ⑽㈣ 5 2181-6647-PF; Ahddub 200530723
Package)或C0F(Chip 0n Fllm)等，任一種電路板是都以聚 酿亞氨薄膜為基材，在其上形成銅箱後，利用照相製版技術 形成電路圖案的。又，在其電路圖案形成面塗抹目的在於： 持電路之絕緣及保護免於異物之稱為抗焊劑之樹脂。但，'以' 往之抗焊劑之塗抹區域係軟性電路板之輸入用及輸出用導 線端子部分除外之電路圖案部分。 【發明内容】 發明要解決之課題 在以往之軟性電路板，在將基材向TFT陣列基板之背面 側（下側）彎曲時，應力易集中於TFT陣列基板端邊部及抗焊 劑端部，發生電路圖案之損傷或斷線。在將軟性電路板彎曲 時或模組組立時發生這些損傷或斷線，但是係模組完成後也 因振動或撞擊而發生。此外，軟性電路板之電路圖案之損傷 或斷線尤其在彎曲所引起之應力易集中之兩端部之導線端 子常發生。 為解決這種問題點，本發明提議一種液晶顯示裝置，在 液晶顯示面板之一方之基板（TFT陣列基板）之外周側經由膠 狀或薄膜狀之黏接劑（非等向性導電膜）配設配線基板之液 曰曰顯不裝置，藉著將非等向性導電膜塗抹成自TFT陣列基板 之外周端邊向外方溢出，在TCp組裝之彎曲構造，利用非等 向性導電膜之彈性，配線基板之配線也不會在TFT陣列基板 之外周端部損傷或斷線。 [專利文獻1 ]特開20 0 3-9 1 0 1 5號公報（第3頁、圖 2181-6G47-PF/Ahddub 6 200530723 可是，在依據專利文獻丨之構造，非等向性導電膜之溢 出部分自TFT陣列基板之外周端邊過度擴大而到達基板之裡 面時，在後製程可能發生基板裂開等不良。因而，記載需要 將非等向性導電膜向外側溢出之範圍設為不太大之自基板 端邊約0.1mm〜l.〇mm，但是這麼微小之溢出尺寸無法充分覆 蓋基板端部，或有無法期待充分之彈性之可能性。 本發明係為解決如上述之課題的，其目的在於得到一種 液晶顯示裝置，在TFT陣列基板之外周部所形成之連接端子 列經由非等向性導電膜組裝軟性電路板之液晶顯示裝置，可 防止因將軟性電路板彎曲時之應力而發生之軟性電路板之 電路圖案之扣傷或斷線。 解決課題之手段 本發明之液晶顯示裝置，在設置了顯示用像素電極之透 明絕緣基板之外周部所形成之連接端子列上經由非等向性 導電膜配設軟性電路板，其特徵在於··該軟性電路板在其電 路圖案之形成面塗抹電路保護用之抗焊劑，又在和該透明絕 緣基板重疊之部分，具有包含和該連接端子列在電氣上連接 之導線端子列及被抗焊劑覆蓋之部分。 【實施方式】 以下 3。首先， 板之構造 ，說明係本發明之最佳實施例之實施例丨〜實施例 使用圖1簡單的說明在這些實施例之液晶顯示面 圖1係表示本發明之實施例卜3之液晶顯示面板 2181-6647-PF;Ahddub 7 200530723 之平面圖。液晶顯示面板10藉著如定向膜彼此相向般重叠 在透明絕緣基板上依次形成了薄膜電晶體、顯示用像素； 極、薄膜電晶體之保護膜以及定向膜等之m陣列基板\'和 在透明絕緣基板上依次形成了黑陣列、彩色滤光器、彩色遽口 光器之保護膜、共用透明像素電極以及定向膜等之相向電極 基板2 1密封材料黏接這些基板之周邊部，將液晶密封於 兩基板間而形成。 在液晶顯示面板1 0之兩基板之外側各自黏貼偏光板 1 2。還在TFT陣列基板i之外周所形成之連接端子列丨1連 接係裝載了液晶驅動用之驅動用LS〗3之具有彎曲性之軟性 電路板之TCP4之輸出用導線端子。又，在Tcp4之輸入用導 線端子連接印刷電路板（PCB)13，供給Tcp4輸入信號。具有 彎曲性之TCP4在向液晶顯示面板丨〇之下部基板（tft陣列基 板1)侧彎曲之狀態緊密的收藏於機架内。 土 實施例1 圖2係表示本發明之實施例丨之液晶顯示裝置之軟性電 路板（TCP)組裝部之平面圖，圖3係圖2中以m 一诅表示之 部分之剖面圖，圖4係表示在本實施例之液晶顯示裝置使用 之TCP之平面圖。此外，對於圖中相同或相當之部分賦與相 同之符號。 構成在本實施例之液晶顯示裝置之液晶顯示面板和圖^ 所不之液晶顯示面板i 〇 一樣，在TFT陣列基板i上所設置 之閘極配線或源極配線等面板配線之端部在基板外周部形 成連接端子列11。在本連接端子列丨丨經由非等向性導電膜 2181-6647-pp;Ahddub 8 ^ 200530723 8組裝係軟性電路板之TCP4。 I先，簡早說明液晶顯示裝置之製造之模組化製程。在 TFT陣列基板1之外周部所形成之連接端子列u黏貼非等向 性導電m TCP4之輸出用導線端子列42(圖4)和其對準 後k片暫％壓接。然後，藉著使用加熱卫具對了⑻加熱及 加壓，料向性導電膜8之黏接樹脂熱硬化而且樹脂中^導 電！·生粒子被夹在TCP4之輸出用導線端子列^和丁FT陣列基 板1之連接端子列u之間，同時得到機械式接合和電氣性 連接（導通）。 人，使用圖4詳細說明在本實施例之Tcp4。在本實施 4之TCP4係在係基材之聚醯亞氨薄膜5上形成由銅箔構成 之電路圖案6的’在電路圖案6上組裝液晶驅動用之驅動用 又在TCP4之相向之端面4a、4b附近形成相平行的 配，了複數個導電端子之輸人用導線端子列41和輸出用導 線翊：列42。輸入用導線端子列41各印刷電路板工％圖工） 在電乱上連接’輸出用導線端子列42和Μ陣列基板1之 連接端子列11在電氣上連接。 在TCP4之電路圖案6形成面塗抹由絕緣性樹脂構 成之電路保護用之抗焊劑7。此外，在本實施例，在则之 輸出用導線端子列42兩端部，將抗焊齊"塗抹成具有和m 陣列基板1重疊之部分。此外’在圖4’虛線1A表示TFT陣 列基板i之端邊部la(圖3)之位置，位於比虛線u上方之 抗焊劑7和TFT陣列基板i重疊。 即，在本實施例之TCP4在和m陣列基板1重疊之部 2181-6647-PF；Ahddub 9 200530723 刀（圖4中比虛線丄A上方)具有包含和陣列基板丄之連 接端子列11在電亂上連接之輸出用導線端子列42之接合部 分及被抗焊劑7覆蓋之部分。 、於是’藉著TCP4在和m陣列基板（重疊之部分具有 被抗焊劑7覆蓋之部分，換言之.m陣列基板i和抗焊劑7 重疊之部分’可增加包含和TFT陣列基板】之端邊部“接 觸之。P刀之TCP4之彎曲部之剛性（強度），其附近之電路圖 案難彎曲。因而，可防止因將Tcp4彎曲持之應力而產生之 TCP4之扣傷或斷線。又，如圖3所示，在tft陣列基板丄和 抗焊劑7重疊之部分，目m陣列基板i之端邊部u未直 接接觸TCP4之電路㈣6(輸出用導線端子列42)，電路圖 案6也不會被基板端邊部i a弄傷。 此外，在本實施例，在TCP4和TFT陣列基板i重疊之 部7刀，使抗焊劑7局部覆蓋輸出用導線端子列42之至少包 含兩端之導線端子42a、42b(圖4)之端側複數個導線端子。 但，被抗谭劑7局部覆蓋之導線端子不必係複數支，只覆蓋 兩端之各1支之導線端子42a、42b也可。因而，因應力未 集中於KP4之電路圖案6之中最易發生斷線之兩端之導線 端子42a、42b，可有效的防止斷線。 又，在本實施例，在TCP4和TFT陣列基板！重疊之部 分，抗焊劑7和TFT陣列基板！側之非等向性導電膜8接觸， 但是和連接端子列11未接觸。但，被抗焊劑7局部覆蓋之 複數支導線端子，在將TCP4和TFT陣列基板i壓接時非等 向性導電膜8之流動被抗焊劑7堵住，因非等向性導電膜8 2181-6647 - PF ； Aliddub 10 200530723 在導線端子間易發生 之導電性粒子在抗焊劑7之端部凝聚 經由導電性粒子之短路。 Λ 在這種短路對策上 兩端之導線端子42a、 位之配線或變成假端子 線和假端子也可。此外 可防止端子間之短路。 /、要使包含被抗焊劑7局部覆蓋之 42b之複數支導線端子全部變成同電 即可。或者，組合的配置同電位之配 藉著使導線端子間之距離變寬，也 如以上所示，本實施例之液晶顯示裝置，在TCP4之和 m陣列基板i重疊之部分’具有包含和m陣列基板工之 連接端子列u在電氣上連接之輸出用導線端子列42之接人 部分及被抗焊齊"覆蓋之部分，尤其在本實施例，使抗焊劑 7局部覆蓋輸出用導線端子列42之至少包含兩端之導線端子 428、42b之複數支導線端子:因而」—可防止應力集中於在 TCP4之電路圖案6最易發生斷線之兩端之導線端子42a、 42b，可防止因將TCP4彎曲時之應力而發生之Tcp4之電路 圖案6之損傷或斷線。因而，若依據本實施例，改善液晶顯 示裝置之良率，提高品質及可靠性。 實施例2 圖5係表示本發明之實施例2之液晶顯示裝置之軟性電 路板（TCP)組裝部之平面圖。對於圖中相同或相當之部分賦 與相同之符號。關於本實施例2之液晶顯示裝置之構造，因 除了在TCP4之電路圖案6形成面塗抹之抗焊劑7之塗抹區 域之形狀以外和上述之實施例1 一樣，省略說明。 本實施例2之TCP4和上述之實施例1 一樣，在和丁打 2181-6647-PF；Ahddub 11 200530723 陣列基板1重疊之部分，且 具有包含和TFT陣列基板}之連接 端子列11在電氣上連接之於， 輸出用導線端子列4 2之接合部分Package) or COF (Chip 0n Fllm), etc., any circuit board is based on a polymer imide film, and after forming a copper box on it, the circuit pattern is formed using photoengraving technology. In addition, the purpose of painting on the circuit pattern forming surface is: a resin called a solder resist that holds the insulation of the circuit and protects it from foreign matter. However, the area to which the solder resist is applied is the circuit pattern portion except for the input and output lead terminals of the flexible circuit board. [Summary of the Invention] The problem to be solved by the invention is that in the conventional flexible circuit board, when the substrate is bent toward the back side (lower side) of the TFT array substrate, stress tends to be concentrated on the end portion of the TFT array substrate and the end of the solder resist. Damage or disconnection of the circuit pattern occurs. These damages or disconnections occur when the flexible circuit board is bent or the modules are assembled, but they also occur due to vibration or impact after the module is completed. In addition, damage or disconnection of the circuit pattern of the flexible circuit board often occurs at the wire terminals at both ends, where stress caused by bending is likely to concentrate. In order to solve this problem, the present invention proposes a liquid crystal display device, which is disposed on the outer peripheral side of one of the substrates (TFT array substrates) of the liquid crystal display panel via a gel-like or film-like adhesive (non-isotropic conductive film). The liquid of the wiring substrate is set as a display device. By applying the anisotropic conductive film to overflow from the outer peripheral edge of the TFT array substrate, the curved structure assembled in the TCp utilizes the anisotropic conductive film. It is flexible, and the wiring of the wiring substrate will not be damaged or disconnected at the outer peripheral portion of the TFT array substrate. [Patent Document 1] JP 20 0 3-9 1 0 1 5 (Page 3, Figure 2181-6G47-PF / Ahddub 6 200530723) However, in the structure according to Patent Document 丨, the When the overflow portion is excessively enlarged from the outer peripheral edge of the TFT array substrate and reaches the inside of the substrate, defects such as substrate cracking may occur in the later process. Therefore, it is described that the range of the non-isotropic conductive film that overflows to the outside is not too large. It is about 0.1 mm to 1.0 mm from the edge of the substrate, but such a small overflow size may not sufficiently cover the edge of the substrate or may not be able to expect sufficient elasticity. The present invention is to solve the problem as described above, The purpose is to obtain a liquid crystal display device. A liquid crystal display device in which a flexible circuit board is assembled through a non-isotropic conductive film at a connection terminal row formed on the outer periphery of a TFT array substrate can prevent the stress caused when the flexible circuit board is bent. Occurrence of buckling or disconnection of the circuit pattern of the flexible circuit board that has occurred. Means for Solving the Problem The liquid crystal display device of the present invention is provided on the outer periphery of a transparent insulating substrate provided with a pixel electrode for display. A flexible circuit board is arranged on the connection terminal row formed by the part through an anisotropic conductive film, which is characterized in that the flexible circuit board is coated with a soldering flux for circuit protection on the formation surface of the circuit pattern, and is transparent with the The part of the insulating substrate that overlaps includes a wire terminal row electrically connected to the connection terminal row and a portion covered with a solder resist. [Embodiment] The following 3. First, the structure of the board illustrates the best practice of the present invention. Examples Example 1 ~ Example The liquid crystal display surfaces of these examples are briefly explained with reference to FIG. 1. FIG. 1 is a plan view of a liquid crystal display panel 2181-6647-PF; Ahddub 7 200530723 showing the embodiment 3 of the present invention. The display panel 10 forms a thin film transistor and a display pixel in this order by overlapping the orientation films facing each other on a transparent insulating substrate; an m-array substrate such as a pole, a protective film of the thin film transistor, and an orientation film, and the transparent insulation On the substrate, a black film, a color filter, a protective film for a color filter, a common transparent pixel electrode, and an opposing film such as an alignment film are formed in this order. The substrate 2 1 is formed by bonding the peripheral parts of these substrates and sealing the liquid crystal between the two substrates. The polarizing plates 12 are adhered to the outer sides of the two substrates of the liquid crystal display panel 10 respectively. The formed connection terminal row 丨 1 connection is a TCP4 output wire terminal equipped with a flexible flexible circuit board for driving liquid crystal drive LS [3]. Also, the input wire terminal of Tcp4 is connected to a printed circuit board ( PCB) 13, which provides Tcp4 input signal. TCP4, which has flexibility, is tightly stored in the rack in a state bent to the lower substrate (tft array substrate 1) side of the LCD panel. 土 实施 例 1 Figure 2 shows A plan view of a flexible circuit board (TCP) assembly portion of a liquid crystal display device according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of a portion indicated by m in FIG. 2, and FIG. 4 is a liquid crystal display of the embodiment. A plan view of the TCP used by the device. In addition, the same symbols are assigned to the same or equivalent parts in the drawings. The liquid crystal display panel constituting the liquid crystal display device of this embodiment is the same as the liquid crystal display panel i 0 shown in FIG. ^, And the ends of panel wiring such as gate wiring or source wiring provided on the TFT array substrate i are at A connection terminal row 11 is formed on the outer periphery of the substrate. In this connection terminal row, through the anisotropic conductive film 2181-6647-pp; Ahddub 8 ^ 200530723 8 assembled TCP4 of the flexible circuit board. First, the modular manufacturing process for manufacturing the liquid crystal display device will be described briefly. The connection terminal row u formed on the outer periphery of the TFT array substrate 1 is pasted with non-isotropic conductive m TCP4 output wire terminal row 42 (Fig. 4) and k pieces are temporarily crimped after being aligned. Then, by using a heating fixture to heat and press the ⑻, the adhesive resin of the material-oriented conductive film 8 is thermally hardened and the resin is electrically conductive! The green particles are sandwiched between the output wire terminal row ^ of TCP4 and the connection terminal row u of the DFT array substrate 1, and mechanical bonding and electrical connection (conduction) are obtained at the same time. A person will explain Tcp4 in this embodiment in detail using FIG. 4. In the TCP 4 of the fourth embodiment, a circuit pattern 6 made of copper foil is formed on a polyimide film 5 which is a base material. The circuit pattern 6 is used for assembling liquid crystal driving for driving and for the end face 4 a facing TCP 4. A parallel arrangement is formed near and 4b, and a plurality of conductive terminals of the input conductor terminal row 41 and the output conductor 翊: row 42 are formed. The input wiring terminal row 41 is a printed circuit board worker (%). The output wiring terminal row 42 and the connection terminal row 11 of the M array substrate 1 are electrically connected. A solder resist 7 for circuit protection made of an insulating resin is applied to the surface of the circuit pattern 6 of the TCP 4. Further, in this embodiment, solder resists are applied to both ends of the output lead terminal row 42 so as to have portions overlapping the m-array substrate 1. In addition, the dotted line 1A in FIG. 4 indicates the position of the edge portion la (FIG. 3) of the TFT array substrate i, and the solder resist 7 located above the dotted line u overlaps the TFT array substrate i. That is, in this embodiment, TCP4 has a portion 2181-6647-PF overlapping with the m-array substrate 1; Ahddub 9 200530723 blade (above the dotted line 丄 A in FIG. 4) has a connection terminal row 11 including the array substrate 在 in the electrical The joints of the output lead terminal rows 42 and the parts covered with the solder resist 7 are randomly connected. So, 'Thanks to TCP4, the and m array substrate (the overlapped portion has a portion covered by solder resist 7, in other words, the overlapped portion of m array substrate i and solder resist 7' can be added to the end edge of the TFT array substrate] "The contact. The rigidity (strength) of the curved part of the TCP4 of the P-knife, and the circuit pattern near it is difficult to bend. Therefore, it can prevent the buckling or disconnection of the TCP4 caused by the stress of bending the Tcp4. Also, such as As shown in FIG. 3, in the portion where the tft array substrate 丄 and the solder resist 7 overlap, the end edge u of the array substrate i does not directly contact the circuit ㈣6 (the output wire terminal row 42) of TCP4, and the circuit pattern 6 does not Injured by the substrate edge portion ia. In addition, in this embodiment, 7 pieces are overlapped at the portion where TCP4 and the TFT array substrate i overlap, so that the solder resist 7 partially covers the output wire terminal row 42 including at least both ends of the wire terminals 42a. There are a plurality of lead terminals on the end side of 42b (Fig. 4). However, the lead terminals partially covered by the anti-tanning agent 7 need not be a plurality of lead terminals, and only one lead terminal 42a, 42b covering each of the two ends may be used. Therefore, Stress is not concentrated in circuit pattern 6 of KP4 The wire terminals 42a and 42b at both ends where breakage is most likely to occur can effectively prevent the breakage. In this embodiment, the TCP4 and the TFT array substrate! The overlapping part, the solder resist 7 and the TFT array substrate! The anisotropic conductive film 8 is in contact, but is not in contact with the connection terminal row 11. However, the plurality of lead terminals partially covered by the solder resist 7 are anisotropic conductive film 8 when the TCP4 and the TFT array substrate i are crimped together. The flow is blocked by the solder resist 7, due to the anisotropic conductive film 8 2181-6647-PF; Aliddub 10 200530723 The conductive particles that are easy to occur between the wire terminals are condensed at the end of the solder resist 7 via the short of the conductive particles Λ In this short-circuit countermeasure, the wire terminals 42a at both ends and the wiring may be changed into dummy terminal wires and dummy terminals. In addition, short-circuits between the terminals can be prevented. / 、 42b, which is partially covered by the solder resist 7 All of the plurality of lead terminals may be the same. Alternatively, the combination of the same potential can be used to widen the distance between the lead terminals. As shown above, the liquid crystal display device of this embodiment is the sum of TCP4. m array basis The portion i where the board i overlaps has the access portion of the output wire terminal row 42 which is electrically connected to the connection terminal row u of the m array substrate worker and the part covered by the solder resist ", especially in this embodiment, Make the solder resist 7 partially cover the output lead terminal row 42 including the plurality of lead terminals 428, 42b at least at both ends of the lead terminals: thus "-" can prevent the stress from being concentrated on the two most likely to be broken in the circuit pattern 6 of TCP4 The lead terminals 42a and 42b at the ends can prevent damage or disconnection of the circuit pattern 6 of the Tcp4 due to the stress when the TCP4 is bent. Therefore, according to this embodiment, the yield of the liquid crystal display device is improved, and the quality and reliability are improved. Embodiment 2 FIG. 5 is a plan view showing a flexible circuit board (TCP) assembly portion of a liquid crystal display device according to Embodiment 2 of the present invention. The same or equivalent parts in the figure are assigned the same symbols. The structure of the liquid crystal display device of the second embodiment is the same as that of the first embodiment described above except for the shape of the application area of the solder resist 7 applied on the surface of the circuit pattern 6 of the TCP 4. The TCP4 of this embodiment 2 is the same as that of the above-mentioned embodiment 1 in a part overlapping with the array substrate 1 2181-6647-PF; Ahddub 11 200530723, and having a connection terminal row 11 including a TFT array substrate} is electrically Connect to the junction part of the output terminal block 4 2
及被抗焊劑7覆蓋之部分。y ^ ^ ^ A 、 又，在本貫施例，也將抗焊劑7 塗抹成在TCP4之輸出用暮飧 导線纟而子列42兩端部具有和TFT陣 列基板1重疊之部分。桕，+丄^And the part covered by the solder resist 7. y ^ ^ ^ A. In the present embodiment, the solder resist 7 is also applied so that the output wires of TCP 4 are used, and the two ends of the sub-row 42 have portions overlapping the TFT array substrate 1.桕 ， + 丄 ^
在本貫施例，在抗焊劑7和TFT 陣列基板1重疊之部分，腺> @ ^ Γ7In the present embodiment, in the portion where the solder resist 7 and the TFT array substrate 1 overlap, the gland > @ ^ Γ7
將抗丈干劑7之端部7a形成為與丁FT 陣列基板1之端邊部1 a斜交叉。 ' 在在將係基材之聚醯亞氨薄膜5向tft陣 列基板1之背面側（下側）f曲時，應力易集中於tft陣列基 板1之端邊部1 a及抗焊齊"之端部7a，在這些部分易發生 TCP4之電路圖案6之損傷或斷線。因此，在本實施例，藉著 令抗焊劑7之端部7a和TFT陣列基板！之端邊部la斜交又， 使得防止應力集中於抗焊劑端部7a。 又，藉著抗焊劑7之端部7a和TFT陣列基板i之端邊 部la斜交叉，在TCP4和TFT陣列基板i重疊之部分，可減 少被抗焊劑7局部覆蓋之導線端子，和上述之實施例丨相 比，成為難發生導線端子間之短路之構造。 如以上所示，在本實施例2，也和上述之實施例1 一樣，. 可防止應力集中於在TCP4之電路圖案6最易發生斷線之兩 端之導線端子，可防止因將TCP4彎曲時之應力而發生之Tcp4 之電路圖案6之損傷或斷線。因而，改善液晶顯示裝置之良 率’ k南品質及可靠性。 實施例3 圖6係表示本發明之實施例3之液晶顯示裝置之軟性電 2181-6647 - PF; Ahcidub 12 200530723 路板（TCP)組裝部之平面圖。對於圖中相同或相當之部分賊 與相同之符號。ff於本實施例3之液晶顯示裝置之構造，因 除了在TCP4之電路圖案6形成面塗抹之抗谭齊"之塗抹區 域之形狀以外和上述之實施例〗一樣，省略說明。 本實施例3之TCP4和上述之實施例i及2 一樣，在和 TFT陣列基板1重疊之部分，具有包含和m陣列基板工之 連接端子列11在電氣上連接之輸出用導線端子列42之接合 部分及被抗焊劑7覆蓋之部分。但，在本實施例，將抗㈣ 7塗抹成覆蓋比TCP4之輸出用導線端子列之兩端之導線端子 更外側之TCP4端部。 在本貫施例，輸出用導線端子列之兩端之導線端子未被 抗焊劑7局部覆蓋，未直接受到保護，但是藉著在導線端子 列之兩側之聚醯亞氨薄膜5塗抹抗焊劑7，補強聚醯亞氨薄 膜5 ’剛性增加。目而，具有可防止聚醯亞氨薄帛5被Μ 陣列基板1之端邊部la縱向彎曲，防止應力集中於和補強 之部分相鄰之導線端子列兩端部之效果。 於疋，在本M施例3，也和上述之實施例丨及2 一樣， 可防止應力集中於在TCP4之電路圖案6最易發生斷線之兩 端之導線端子，可防止因將TCP4彎曲時之應力而發生之κρ4 之電路圖案6之損傷或斷線。又，因#口 TFT陣列基板】重疊 之部分之抗焊劑7未覆蓋導線端子，成為難發生導線端子間 之短路之構造。 此外，在上述之實施例卜3，在Tcp4和TFT陣列基板丄 重S之部分之抗焊劑7之塗抹區域上，舉3種例子。但，在 2181-6647-PP；Ahddub 13 200530723 本發明，抗焊劑7之塗抹區域之形狀未限定為上述之實施例 1〜3所示的。只要係至少局部覆蓋Tcp4之輸出用導線端子列 4 2之兩端之導線端子之形狀或比兩端t導線端子列更外側 之：TCP4端部之形狀’係其他的形狀也可得到和上述之實施 例1〜3大致之效果。 產業上之可應用性 本發明應用於液晶顯示#晉， 、、 只丁展置，可用於個人電腦之顯示裝 置或監視裔、電視之顯示裝置等。 發明之效果 八在本發明’在和軟性電路板之透明絕緣基板重疊之部 二’具有被電路保護用之抗烊劑覆蓋之部分，因增加包含和 透明絕緣基板之端邊部接 觸之邻刀之軟性電路板之彎曲部 之剛性（強度），本部分之電 电路圖案難發生縱向彎曲。因而， 可防止因將軟性電路板彎 曲日可之應力而發生之電路圖幸 損傷或斷線，改善液晶頬千^ ή知生之電路α案之 ’/、放置之良率’提高品質及可靠性。 【圖式簡單說明】 圖1係表示本發明之每 面 圖〇 只％例1〜3之液晶顯示面板之平 組 圖2係表示本發明之實 袭部之平面圖。The end portion 7a of the anti-drying agent 7 is formed to diagonally intersect the end edge portion 1a of the DFT array substrate 1. 'When the polyimide film 5 as the base material is bent toward the back side (lower side) of the tft array substrate 1, the stress tends to be concentrated on the end portion 1a of the tft array substrate 1 and the solder resistance is all together " The end portion 7a is susceptible to damage or disconnection of the circuit pattern 6 of the TCP 4 in these portions. Therefore, in this embodiment, by making the end portion 7a of the solder resist 7 and the TFT array substrate! The end edge la is slanted again, so that stress is prevented from being concentrated on the solder resist end 7a. In addition, the end portion 7a of the solder resist 7 and the end edge la of the TFT array substrate i diagonally intersect, and at the portion where TCP4 and the TFT array substrate i overlap, the wire terminals partially covered by the solder resist 7 can be reduced, and the above In comparison with the embodiment, a structure in which a short circuit between lead terminals is less likely to occur. As shown above, this embodiment 2 is also the same as the above-mentioned embodiment 1. It can prevent stress from being concentrated on the wire terminals at both ends of the circuit pattern 6 of the TCP 4 which is most prone to disconnection, and can prevent the TCP 4 from being bent. Damage or disconnection of the circuit pattern 6 of Tcp4 that occurs due to the stress at the time. Therefore, the quality and reliability of the liquid crystal display device are improved. Embodiment 3 FIG. 6 is a plan view showing a flexible electric of a liquid crystal display device according to Embodiment 3 of the present invention 2181-6647-PF; Ahcidub 12 200530723 circuit board (TCP) assembly portion. For the same or equivalent parts of the figure, the same symbols are used. ff The structure of the liquid crystal display device in this embodiment 3 is the same as that of the above-mentioned embodiment except for the shape of the smear-resistant area of Tan Qi ", which is surface-painted on the circuit pattern 6 of TCP4, and the description is omitted. The TCP4 of this embodiment 3 is the same as the above-mentioned embodiments i and 2. In a portion overlapping with the TFT array substrate 1, the TCP4 includes an output wire terminal array 42 which is electrically connected to the connection terminal array 11 of the m array substrate. The joint portion and the portion covered with the solder resist 7. However, in this embodiment, the anti-scratch 7 is applied so as to cover the outer ends of the TCP4 than the wire terminals at both ends of the output wire terminal row of the TCP4. In this embodiment, the lead terminals at both ends of the output lead terminal row are not partially covered by the solder resist 7 and are not directly protected, but the solder resist is applied by the polyimide film 5 on both sides of the lead terminal row. 7. Reinforced polyimide film has 5 'rigidity increase. For this reason, it is possible to prevent the polyimide film 5 from being bent longitudinally by the end edge la of the M array substrate 1 and prevent the stress from being concentrated on both ends of the lead terminal row adjacent to the reinforcing portion. Yu Yan, in this M embodiment 3, as in the above-mentioned embodiments 丨 and 2, it can prevent stress from being concentrated on the wire terminals at the ends of the circuit pattern 6 of the TCP4 that are most prone to disconnection, and can prevent the TCP4 from being bent. The circuit pattern 6 of κρ4 is damaged or broken due to the stress at the time. In addition, since the # 7 TFT array substrate] overlapped with the solder resist 7 does not cover the lead terminals, it has a structure in which a short circuit between the lead terminals is difficult to occur. In addition, in the above-mentioned Embodiment 3, three examples are given on the application area of the solder resist 7 of the Tcp4 and the TFT array substrate weight S. However, in 2181-6647-PP; Ahddub 13 200530723 in the present invention, the shape of the application area of the solder resist 7 is not limited to those shown in the above-mentioned Examples 1 to 3. As long as the shape of the wire terminals at least at both ends of the output wire terminal row 42 of Tcp4 is at least partially or outside of the wire terminal row at both ends: the shape of the TCP4 end portion is other shapes and can be obtained as described above. The effects of Examples 1 to 3 are approximate. Industrial Applicability The present invention is applied to a liquid crystal display device, and can be used for a display device of a personal computer or a monitor device of a television, a display device of a television, and the like. The eighth effect of the present invention is that in the present invention, the portion "overlapping with the transparent insulating substrate of the flexible circuit board 2" has a portion covered with an anti-lubricant for circuit protection, because the adjacent knife which is in contact with the end edge portion of the transparent insulating substrate is added. The rigidity (strength) of the bent part of the flexible circuit board is difficult for the electrical circuit pattern in this part to bend longitudinally. Therefore, it is possible to prevent damage or disconnection of the circuit diagram caused by the stress caused by bending the flexible circuit board, and improve the quality and reliability of the liquid crystal display circuit circuit case. [Brief Description of the Drawings] Fig. 1 is a plan view showing the liquid crystal display panel of each of the examples 1 to 3 of the present invention. Fig. 2 is a plan view showing an attack portion of the present invention.
施例1之液晶顯示裝置之TCP 圖3係表示本發明之 貫施例1之液晶顯示裝置之TCP組 2l8l-6647>PP；Ahddub 14 200530723 I部之平面圖。 圖4係表示在本發明之實施例1之液晶顯示裝置使用 TCP之平面圖。 圖5係表示本發明之實施例2之液晶顯示裝置之Tcp 裝部之平面圖。 圖6係表示本發明之實施例3之液晶顯示襄置之Tcp 之 組 組 裝部之平面圖。 【主要元件符號說明】 1〜TFT陣列基板； 2〜相向電極基板； 4〜TCP ; 5〜聚醯亞氨； 7〜抗焊劑； 8〜非等向性導電膜； 11〜連接端子列； 1 3〜印刷電路板； 4 2〜輸出用導線端子列； la〜端邊部； 3〜驅動用LSI ; 4a、4b〜端面； 6〜電路圖案； 7a〜端部； 1 0〜液晶顯示面板； 1 2〜偏光板； 4卜輸入用導線端子列； 42a、42b〜兩端之導線端子列 2181-6647-PF；Ahddub 15TCP of the liquid crystal display device of Embodiment 1 FIG. 3 is a plan view showing the TCP group 2118-6647 >PP; Ahddub 14 200530723 of Part I of the liquid crystal display device of Embodiment 1 of the present invention. Fig. 4 is a plan view showing the use of TCP in the liquid crystal display device according to the first embodiment of the present invention. 5 is a plan view showing a Tcp mounting portion of a liquid crystal display device according to a second embodiment of the present invention. Fig. 6 is a plan view showing an assembly portion of a Tcp set for a liquid crystal display according to a third embodiment of the present invention. [Description of main component symbols] 1 ~ TFT array substrate; 2 ~ opposing electrode substrate; 4 ~ TCP; 5 ~ polyimide; 7 ~ soldering flux; 8 ~ anisotropic conductive film; 11 ~ connection terminal row; 1 3 ~ printed circuit board; 4 2 ~ output wire terminal row; la ~ end portion; 3 ~ drive LSI; 4a, 4b ~ end surface; 6 ~ circuit pattern; 7a ~ end portion; 10 ~ liquid crystal display panel; 1 2 ~ polarizing plate; 4b input wire terminal row; 42a, 42b ~ two end wire terminal row 2181-6647-PF; Ahddub 15