Claims (14)
一種軟性電路板，包括：一基材，其具有一非線路區以及一線路區，其中該基材之該非線路區中具有至少一開口；多條導線，位於該基材之該線路區中；一覆蓋層，位於該線路區以覆蓋該些導線，並且暴露出該些導線的兩端；以及一加強層，位於該開口的至少一邊緣，其中該開口鄰近該基材之一側邊，且該加強層至少位於該開口與該基材之該側邊之間。
A flexible circuit board comprising: a substrate having a non-line region and a line region, wherein the non-line region of the substrate has at least one opening; a plurality of wires located in the line region of the substrate; a cover layer disposed in the line region to cover the wires and exposing both ends of the wires; and a reinforcing layer located at at least one edge of the opening, wherein the opening is adjacent to a side of the substrate, and The reinforcing layer is located at least between the opening and the side of the substrate.
如申請專利範圍第1項所述之軟性電路板，其中該加強層與該覆蓋層之材質相同。
The flexible circuit board of claim 1, wherein the reinforcing layer is made of the same material as the covering layer.
如申請專利範圍第1項所述之軟性電路板，其中該覆蓋層與該基材之材質相同。
The flexible circuit board of claim 1, wherein the cover layer is made of the same material as the substrate.
如申請專利範圍第1項所述之軟性電路板，其中該加強層與該覆蓋層是屬於同一膜層。
The flexible circuit board of claim 1, wherein the reinforcing layer and the covering layer belong to the same film layer.
一種軟性電路板的製造方法，包括：提供一基材，該基材具有一非線路區以及一線路區，且該非線路區中具有至少一開口；在該基材的該線路區中形成多條導線；在該基材之該線路區上形成一覆蓋層，其中該覆蓋層覆蓋該些導線且暴露出該些導線的兩端；以及在該基材之該開口的至少一邊緣形成一加強層，其中該開口鄰近該基材之一側邊，且該加強層至少位於該開口
與該基材之該側邊之間。
A method of manufacturing a flexible circuit board, comprising: providing a substrate having a non-line region and a line region, and having at least one opening in the non-line region; forming a plurality of strips in the line region of the substrate a wire; a cover layer is formed on the line region of the substrate, wherein the cover layer covers the wires and exposes both ends of the wires; and a reinforcing layer is formed on at least one edge of the opening of the substrate Where the opening is adjacent to a side of the substrate, and the reinforcing layer is located at least at the opening
Between the side edges of the substrate.
如申請專利範圍第5項所述之軟性電路板的製造方法，其中該加強層是在形成該覆蓋層之後所形成的。
The method of manufacturing a flexible circuit board according to claim 5, wherein the reinforcing layer is formed after the covering layer is formed.
如申請專利範圍第5項所述之軟性電路板的製造方法，其中形成該覆蓋層以及該加強層之方法包括先在該基材上形成該覆蓋層，接著在該非線路區中形成該開口，其中位於該開口之至少一邊緣之該覆蓋層即作為該加強層。
The method of manufacturing a flexible circuit board according to claim 5, wherein the method of forming the cover layer and the reinforcement layer comprises first forming the cover layer on the substrate, and then forming the opening in the non-line region. The cover layer at at least one edge of the opening serves as the reinforcement layer.
如申請專利範圍第5項所述之軟性電路板的製造方法，其中該加強層與該覆蓋層之材質相同。
The method for manufacturing a flexible circuit board according to claim 5, wherein the reinforcing layer is made of the same material as the covering layer.
如申請專利範圍第5項所述之軟性電路板的製造方法，其中該覆蓋層與該基材之材質相同。
The method of manufacturing a flexible circuit board according to claim 5, wherein the covering layer is made of the same material as the substrate.
一種顯示器，包括：一顯示面板，其中該顯示面板的側邊具有至少一凸出結構；一軟性電路板，電性連接於該顯示面板，其中該軟性電路板包括：一基材，其具有一非線路區以及一線路區，其中該基材之該非線路區中具有至少一開口，且該顯示面板之該凸出結構穿過該開口；多條導線，位於該基材之該線路區中；一覆蓋層，位於該線路區以覆蓋該些導線，並且暴露出該些導線的兩端，其中該些導線之一端與該顯示面板電性連接；以及
一加強層，位於該開口的至少一邊緣，其中該開口鄰近該基材之一側邊，且該加強層至少位於該開口與該基材之該側邊之間；一電路板，電性連接於該軟性電路板之該些導線的另一端。
A display device includes: a display panel, wherein a side of the display panel has at least one protruding structure; a flexible circuit board electrically connected to the display panel, wherein the flexible circuit board comprises: a substrate having a a non-line area and a line area, wherein the non-line area of the substrate has at least one opening, and the protruding structure of the display panel passes through the opening; a plurality of wires are located in the line area of the substrate; a cover layer disposed in the line region to cover the wires and exposing both ends of the wires, wherein one of the wires is electrically connected to the display panel;
a reinforcing layer, located at at least one edge of the opening, wherein the opening is adjacent to a side of the substrate, and the reinforcing layer is located at least between the opening and the side of the substrate; a circuit board, electrically connected The other end of the wires of the flexible circuit board.
如申請專利範圍第10項所述之顯示器，其中該加強層與該覆蓋層之材質相同。
The display of claim 10, wherein the reinforcing layer is made of the same material as the covering layer.
如申請專利範圍第10項所述之顯示器，其中該覆蓋層與該基材之材質相同。
The display of claim 10, wherein the cover layer is the same material as the substrate.
如申請專利範圍第10項所述之顯示器，其中該加強層與該覆蓋層是屬於同一膜層。
The display of claim 10, wherein the reinforcing layer and the covering layer belong to the same film layer.
如申請專利範圍第10項所述之顯示器，其中該電路板位於該顯示面板的背面，且該軟性電路板連接於該顯示面板與該電路板之間。
The display device of claim 10, wherein the circuit board is located at a rear surface of the display panel, and the flexible circuit board is connected between the display panel and the circuit board.