JP2014042331A - プリント回路板 - Google Patents
プリント回路板 Download PDFInfo
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- JP2014042331A JP2014042331A JP2013217790A JP2013217790A JP2014042331A JP 2014042331 A JP2014042331 A JP 2014042331A JP 2013217790 A JP2013217790 A JP 2013217790A JP 2013217790 A JP2013217790 A JP 2013217790A JP 2014042331 A JP2014042331 A JP 2014042331A
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- 238000000034 method Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 4
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- 239000012141 concentrate Substances 0.000 claims 1
- MTCPZNVSDFCBBE-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl MTCPZNVSDFCBBE-UHFFFAOYSA-N 0.000 description 11
- 238000013461 design Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 230000036544 posture Effects 0.000 description 6
- 230000007935 neutral effect Effects 0.000 description 4
- MPCDNZSLJWJDNW-UHFFFAOYSA-N 1,2,3-trichloro-4-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=C(Cl)C(Cl)=CC=2)Cl)=C1 MPCDNZSLJWJDNW-UHFFFAOYSA-N 0.000 description 3
- BQENMISTWGTJIJ-UHFFFAOYSA-N 2,3,3',4,5-pentachlorobiphenyl Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C(Cl)=C(Cl)C=2)Cl)=C1 BQENMISTWGTJIJ-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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- 238000012938 design process Methods 0.000 description 1
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- 229920001690 polydopamine Polymers 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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- H—ELECTRICITY
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- H04M—TELEPHONIC COMMUNICATION
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- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49002—Electrical device making
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- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y10T29/49128—Assembling formed circuit to base
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
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Abstract
【解決手段】互いに異なるレベル及び姿勢に位置する回路にデバイス・コンポーネントを接続するための方法において、第1回路は多平面リジッド回路板上に位置してもよく、多平面リジッド回路板は、多平面リジッド回路板と共通の基板を共有し、多平面リジッド回路板の基体部から延びる少なくとも1つの可撓性部材を含みうる。可撓性部材は電力及び/又はデータを伝達するために用いられる配線と、電力及び/又はデータ配線に結合されたインタフェースとを含みうる。可撓性部材は多平面リジッド回路板の基体部上の第1回路を別のデバイス・コンポーネントに関連する第2回路に接続するようにそらされ又はねじられうる。
【選択図】図4
Description
Claims (23)
- 携帯用計算デバイスのための第1プリント回路板及び筐体を準備する工程であって、前記第1プリント回路板は、前記第1プリント回路板の基体部から延びるとともに前記第1プリント回路板と共通の基板を共有する可撓性部材を含み、前記可撓性部材は複数の配線を含み、前記可撓性部材の自由端は前記複数の配線との第1インタフェースを含む、工程と、
前記筐体の内部に前記第1プリント回路板を固定する工程と、
前記可撓性部材のうち前記複数の配線を含む側が第1留め具の面と接触するように、前記可撓性部材にわたって前記第1留め具を固定する工程と、
前記第1留め具に近接する第1線に沿って前記可撓性部材が曲がるように前記可撓性部材の前記自由端をそらせる工程と、
第2留め具を用いて前記可撓性部材の前記自由端を固定する工程であって、前記筐体内において前記第1プリント回路板の前記基体部とは異なる深さに前記自由端の端部が位置するように、前記第2留め具に近接する第2線に沿って前記可撓性部材が曲がる、工程と、
前記可撓性部材上の前記複数の配線を介して第2回路板と第1回路板との間でデータ及び電力が伝送可能なように、前記第2回路板を前記第1インタフェースに接続する工程とを有することを特徴とする製造方法。 - そらされた位置に前記可撓性部材がある場合に、前記可撓性部材に沿った応力分布を決定する工程を更に有することを特徴とする請求項1に記載の方法。
- 前記可撓性部材における前記複数の配線の互いに対する位置を決定する工程を更に有し、
前記可撓性部材に沿って厚い又は太い配線と薄い又は細い配線とが経路決定され、前記薄い又は細い配線が前記可撓性部材上に経路決定されるエリアよりも高い応力値を有するエリアにわたって前記厚い又は太い配線が前記可撓性部材上に経路決定されることを特徴とする請求項1に記載の方法。 - 前記第1プリント回路板の前記基体部は第1平面におおよそアライメントされ、前記可撓性部材の前記端部は第2平面におおよそアライメントされ、前記第2平面は前記第1面に対して傾斜していることを特徴とする請求項1に記載の方法。
- 前記第1回路板はメイン・ロジックボードであり、前記第2回路板は外部ピン・インタフェース又はSIMカードに関連することを特徴とする請求項1に記載の方法。
- 携帯用計算デバイスであって、
筐体と、
前記筐体に結合されたディスプレイと、
前記ディスプレイに結合されたプロセッサ及びメモリを含むメイン・ロジックボードと、
前記筐体内に固定された第2回路板とを備え、
前記メイン・ロジックボードは前記筐体の内部に固定され、前記メイン・ロジックボードは、前記メイン・ロジックボードと共通の基板を共有するとともに前記メイン・ロジックボードの基体部から延びる可撓性部材を含み、前記可撓性部材は複数の配線を含み、前記可撓性部材は、前記基体部から前記可撓性部材が延びる部分に近接して前記可撓性部材にわたって配置された第1留め具によって固定されるとともに、前記可撓性部材の端に近接して前記可撓性部材にわたって配置された第2留め具によって固定されることによって、前記複数の配線とのインタフェースを含む前記可撓性部材の端部が前記筐体内の第1深さレベルにある第1平面におおよそ位置し、前記基体部は前記筐体内の第2深さレベルにある第2平面におおよそ位置し、
前記第2回路板は、前記可撓性部材上の前記複数の配線を介して前記第2回路板と前記メイン・ロジックボードとの間で電力及びデータが伝達されるように、前記可撓性部材の前記端部の前記インタフェースに結合されることを特徴とする携帯用計算デバイス。 - 前記第2回路板は、多ピン外部コネクタと、SIMカードと、アンテナと、前記ディスプレイとのうちの1つに関連することを特徴とする請求項6に記載の携帯用計算デバイス。
- 前記第2平面は、前記第1平面に対して傾斜して回転していることを特徴とする請求項6に記載の携帯用計算デバイス。
- 前記複数の配線は、厚い又は太い配線と、薄い又は細い配線とを含み、前記厚い又は太い応力は前記薄い又は細い応力よりも前記可撓性部材の側縁の近くに位置することを特徴とする請求項6に記載の携帯用計算デバイス。
- 前記第1留め具又は前記第2留め具は、当該第1留め具又は当該第2留め具に近接する前記可撓性部材の曲げ半径を増やすように構成された丸みを帯びた面を含むことを特徴とする請求項6に記載の携帯用計算デバイス。
- 前記第1留め具及び前記第2留め具はこれらの2つの留め具の間にある前記可撓性部材のエリアに曲げ応力を集中させるように構成されることを特徴とする請求項6に記載の携帯用計算デバイス。
- 携帯用計算デバイスであって、
筐体と、
前記筐体に結合されたディスプレイと、
前記筐体の内部に固定された第1回路板と、
前記筐体内に固定された第2回路板とを備え、
前記第1回路板は、前記第1回路板と一体形成されるとともに前記第1回路板の基体部から延びる可撓性部材を含み、前記可撓性部材は複数の配線を含み、前記可撓性部材は、前記基体部から前記可撓性部材が延びる部分に近接して前記可撓性部材にわたって配置された第1留め具によって固定されるとともに、前記可撓性部材の端に近接して前記可撓性部材にわたって配置された第2留め具によって固定されることによって、前記複数の配線とのインタフェースを含む前記可撓性部材の端部が前記筐体内の第1深さレベルにある第1平面におおよそ位置し、前記基体部は前記筐体内の第2深さレベルにある第2平面におおよそ位置し、
前記第2回路板は、前記可撓性部材上の前記複数の配線を介して前記第1回路板と前記第2ロジックボードとの間で電力又はデータが伝達されるように、前記可撓性部材の前記端部の前記インタフェースに結合されることを特徴とする携帯用計算デバイス。 - 前記第1平面と前記第2平面との間の距離は1mmから5mmの間であることを特徴とする請求項12に記載の携帯用計算デバイス。
- 前記第1回路板は第2可撓性部材を含むことを特徴とする請求項12に記載の携帯用計算デバイス。
- ラップトップ・コンピュータと、電話機と、ネットブック・コンピュータと、タブレット・コンピュータとのうちの1つであることを特徴とする請求項12に記載の携帯用計算デバイス。
- 前記複数の配線は10本以上の配線を含むことを特徴とする請求項12に記載の携帯用計算デバイス。
- 前記第1回路板に関連するデバイス・コンポーネントは前記可撓性部材上に配置されないことを特徴とする請求項12に記載の携帯用計算デバイス。
- 携帯用計算デバイスであって、
筐体と、
前記筐体に結合されたディスプレイと、
前記筐体の内部に固定された第1回路板と、
前記筐体内に固定された第2回路板とを備え、
前記第1回路板は、前記第1回路板と一体形成されるとともに前記第1回路板の基体部から延びる可撓性部材を含み、前記可撓性部材は複数の配線を含み、前記複数の配線は前記可撓性部材内の複数層に配置され、前記可撓性部材は、前記基体部から前記可撓性部材が延びる部分に近接して前記可撓性部材にわたって配置された第1留め具によって固定されるとともに、前記可撓性部材の端に近接して前記可撓性部材にわたって配置された第2留め具によって固定されることによって、前記複数の配線とのインタフェースを含む前記可撓性部材の端部が前記筐体内の第1深さレベルにある第1平面におおよそ位置し、前記基体部は前記筐体内の第2深さレベルにある第2平面におおよそ位置し、
前記第2回路板は、前記可撓性部材上の前記複数の配線を介して前記第1回路板と前記第2ロジックボードとの間で電力又はデータが伝達されるように、前記可撓性部材の前記端部の前記インタフェースに結合されることを特徴とする携帯用計算デバイス。 - 前記可撓性部材の曲げの結果として生じる圧縮力と引張力とが均衡する場所に近接する層に1つ以上の配線が配置されることを特徴とする請求項18に記載の携帯用計算デバイス。
- 製造方法を実行するためにプロセッサによって実行可能なコンピュータプログラムを格納する非一時的なコンピュータ可読媒体であって、
携帯用計算デバイスのための第1プリント回路板及び筐体を準備するためのコンピュータ・コードであって、前記第1プリント回路板は、前記第1プリント回路板の基体部から延びるとともに前記第1プリント回路板と共通の基板を共有する可撓性部材を含み、前記可撓性部材は複数の配線を含み、前記可撓性部材の自由端は前記複数の配線との第1インタフェースを含む、コンピュータ・コードと、
前記筐体の内部に前記第1プリント回路板を固定するためのコンピュータ・コードと、
前記可撓性部材のうち前記複数の配線を含む側が第1留め具の面と接触するように、前記可撓性部材にわたって前記第1留め具を固定するためのコンピュータ・コードと、
前記第1留め具に近接する第1線に沿って前記可撓性部材が曲がるように前記可撓性部材の前記自由端をそらせるためのコンピュータ・コードと、
第2留め具を用いて前記可撓性部材の前記自由端を固定するためのコンピュータ・コードであって、前記筐体内において前記第1プリント回路板の前記基体部とは異なる深さに前記自由端の端部が位置するように、前記第2留め具に近接する第2線に沿って前記可撓性部材が曲がる、コンピュータ・コードと、
前記可撓性部材上の前記複数の配線を介して第2回路板と第1回路板との間でデータ及び電力が伝送可能なように、前記第2回路板を前記第1インタフェースに接続するためのコンピュータ・コードとを有することを特徴とするコンピュータ可読媒体。 - そらされた位置に前記可撓性部材がある場合に、前記可撓性部材に沿った応力分布を決定する工程を更に有することを特徴とする請求項20に記載のコンピュータ可読媒体。
- 前記可撓性部材における前記複数の配線の互いに対する位置を決定する工程を更に有し、
前記可撓性部材に沿って厚い又は太い配線と薄い又は細い配線とが経路決定され、前記薄い又は細い配線が前記可撓性部材上に経路決定されるエリアよりも高い応力値を有するエリアにわたって前記厚い又は太い配線が前記可撓性部材上に経路決定されることを特徴とする請求項20に記載のコンピュータ可読媒体。 - 前記第1プリント回路板の前記基体部は第1平面におおよそアライメントされ、前記可撓性部材の前記端部は第2平面におおよそアライメントされ、前記第2平面は前記第1面に対して傾斜していることを特徴とする請求項20に記載のコンピュータ可読媒体。
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US8199468B2 (en) | 2009-10-16 | 2012-06-12 | Apple Inc. | Computer housing |
US7995334B2 (en) * | 2010-01-06 | 2011-08-09 | Apple Inc. | Printed circuit board |
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2010
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- 2010-08-31 GB GB1213882.2A patent/GB2490072B/en active Active
- 2010-08-31 AU AU2010340306A patent/AU2010340306B2/en active Active
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- 2010-08-31 KR KR1020127020440A patent/KR101449220B1/ko active IP Right Grant
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- 2010-08-31 JP JP2012548000A patent/JP5547818B2/ja active Active
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- 2010-08-31 EP EP10749586.3A patent/EP2522206B1/en active Active
- 2010-08-31 KR KR1020137010013A patent/KR101283066B1/ko active IP Right Grant
- 2010-12-30 CN CN2010106131785A patent/CN102118922B/zh active Active
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KR101283066B1 (ko) | 2013-07-05 |
US20120195008A1 (en) | 2012-08-02 |
EP2775375A1 (en) | 2014-09-10 |
JP5439628B2 (ja) | 2014-03-12 |
DE112010005092T5 (de) | 2012-10-25 |
KR20130045424A (ko) | 2013-05-03 |
JP2013516786A (ja) | 2013-05-13 |
KR101449220B1 (ko) | 2014-10-08 |
EP2522206B1 (en) | 2014-07-30 |
CN201903812U (zh) | 2011-07-20 |
BR112012016803A2 (pt) | 2016-04-19 |
US8659906B2 (en) | 2014-02-25 |
AU2010340306B2 (en) | 2015-04-16 |
EP2775375B1 (en) | 2015-09-30 |
CN102118922A (zh) | 2011-07-06 |
WO2011084187A1 (en) | 2011-07-14 |
CN102118922B (zh) | 2013-09-18 |
BR112012016803B1 (pt) | 2020-02-04 |
GB2490072B (en) | 2014-08-27 |
US20110225817A1 (en) | 2011-09-22 |
GB2490072A (en) | 2012-10-17 |
US20110164371A1 (en) | 2011-07-07 |
HK1159946A1 (en) | 2012-08-03 |
KR20120115354A (ko) | 2012-10-17 |
AU2010340306A1 (en) | 2012-08-23 |
US7995334B2 (en) | 2011-08-09 |
EP2522206A1 (en) | 2012-11-14 |
US8171623B2 (en) | 2012-05-08 |
GB201213882D0 (en) | 2012-09-19 |
JP5547818B2 (ja) | 2014-07-16 |
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