JP5546369B2 - 蓄電デバイス用電極、その製造方法及びその接続方法 - Google Patents
蓄電デバイス用電極、その製造方法及びその接続方法 Download PDFInfo
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- JP5546369B2 JP5546369B2 JP2010145566A JP2010145566A JP5546369B2 JP 5546369 B2 JP5546369 B2 JP 5546369B2 JP 2010145566 A JP2010145566 A JP 2010145566A JP 2010145566 A JP2010145566 A JP 2010145566A JP 5546369 B2 JP5546369 B2 JP 5546369B2
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- layer
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- storage device
- anode electrode
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- 238000003860 storage Methods 0.000 title claims description 57
- 238000000034 method Methods 0.000 title claims description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007747 plating Methods 0.000 claims description 80
- 239000011701 zinc Substances 0.000 claims description 64
- 230000005611 electricity Effects 0.000 claims description 34
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 19
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 19
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 9
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910017604 nitric acid Inorganic materials 0.000 claims description 6
- 238000005238 degreasing Methods 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims 4
- 230000000052 comparative effect Effects 0.000 description 36
- 229910000679 solder Inorganic materials 0.000 description 25
- 239000003990 capacitor Substances 0.000 description 23
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 10
- 238000005304 joining Methods 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910001416 lithium ion Inorganic materials 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 5
- 229910020994 Sn-Zn Inorganic materials 0.000 description 4
- 229910009069 Sn—Zn Inorganic materials 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 2
- 229910007570 Zn-Al Inorganic materials 0.000 description 2
- 229910007567 Zn-Ni Inorganic materials 0.000 description 2
- 229910007614 Zn—Ni Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C23C18/1651—Two or more layers only obtained by electroless plating
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
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- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
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- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C25D5/44—Aluminium
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- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
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- H01G11/30—Electrodes characterised by their material
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Description
[蓄電デバイス100の構成例]
まずは、本発明に係る蓄電デバイス100の構成例について説明する。図1に示すように、蓄電デバイス100は、Alからなる陽極リード電極(以下、「Al陽極電極10」という)、Alの異種金属であるCuからなる陰極リード電極(以下、「Cu陰極電極30」という)及びセパレータ40で構成される。
図2に示すように、めっき層20は、Alからなる接続端子部10a上にZn層21、Ni層22、Sn層23がめっきで形成される。なお、Zn層21は、Zn合金層でも良いし、Sn層23はSn合金層でも良い。例えば、Zn合金層とは、Zn-Ni合金、Zn-Fe合金、Zn-Al合金等であり、Sn合金層とは、Sn-Bi合金、Sn-Ag合金、Sn-Cu合金等である。
次に、蓄電デバイス100の接続例について説明する。図3に示すように、蓄電デバイス100を直列接続する場合、接続端子部10aと接続端子部30aとをめっき層20及びはんだ50を介して接続させる。はんだ50は、接続端子部10aのAlとははんだ付けし難いが、Cuの接続端子部30a及びめっき層20とははんだ付けが容易である。因みに、はんだ50は、鉛入りはんだでも良いし、Sn-Ag-CuやSn-Znで構成される鉛フリーはんだでも良い。
長さ70mm、幅50mm、厚み0.2mmの大きさの接続端子部10aを、有機溶剤を用いて浸漬脱脂を行う。
脱脂された接続端子部10aを水洗、アルカリエッチング後、酸溶液(エッチング液)に浸漬して表面を荒らす。この工程によりAlからなる接続端子部10aとZn層21との密着が良好になる。
エッチング処理した接続端子部10aを、ZnO、Zn、NaOH等を水で溶解したジンケート浴に浸漬して、Znめっき(Zn層21)を形成する。
Znめっきした接続端子部10aに付着したジンケート液を流すために水洗し、その後、接続端子部10aを硝酸に浸漬して、ジンケート(Zn等)を剥離する。
再度、ジンケート浴に接続端子部10aを浸漬して、Znめっきを形成し、水洗後、硝酸に浸漬して、ジンケート(Zn等)を剥離する。
なお、上述のZnめっきの代わりにZn-Ni合金めっきを形成する場合には、ジンケート浴にZnCl2、NiCl2等を添加したジンケート浴を使用する。
Znめっきが形成された接続端子部10aを、NiSO4・6H2O、NaH2PO2等を水に溶かした無電解Niめっき浴に300秒程度浸漬してNiめっき(Ni層22)を形成し、水洗する。なお、Niめっきは、無電解めっきに限定されず、電解めっきであっても構わない。
Niめっきが形成された接続端子部10aを、Na2SO3・3H2O、Sn、NaOH2等を水に溶かしたアルカリ性酸性Snめっき浴の中に20分程度浸漬してSnめっき(Sn層23)を形成し、水洗する。その後、乾燥することで、めっき層20が完成する。
Claims (7)
- Alからなる陽極電極と当該Alとは異種金属の陰極電極とを備えて負荷駆動用のモータで発生した電気エネルギーを短時間に充放電可能な蓄電デバイスに用いるAl陽極電極であって、
前記Al陽極電極は、
一端に延在した接合端子部のAl上にめっき形成されジンケート処理されたZn層又はZn合金層と、
前記Zn層又はZn合金層上にめっき形成されたNi層と、
前記Ni層上にめっき形成されたSn層又はSn合金層とを有することを特徴とする蓄電デバイス用電極。 - 前記Al陽極電極とCuからなる陰極電極とで作製した接合サンプルに対して、雰囲気温度85℃、湿度85%、100Aの電流でON/OFFを12万回繰り返し、その前後の前記接合サンプルの抵抗値を四端子法で測定したとき、
前記接合サンプルは、
初期の抵抗値に対してその増加分が70μΩ以下となる特性を有することを特徴とする請求項1に記載の蓄電デバイス用電極。 - 前記Zn層又はZn合金層は、
0.05〜0.1μmの厚みを有することを特徴とする請求項1に記載の蓄電デバイス用電極。 - 前記Ni層は、
1〜3μmの厚みを有することを特徴とする請求項1に記載の蓄電デバイス用電極。 - 前記Sn層又はSn合金層は、
5〜15μmの厚みを有することを特徴とする請求項1に記載の蓄電デバイス用電極。 - Alからなる陽極電極と当該Alとは異種金属の陰極電極とを備えて負荷駆動用のモータで発生した電気エネルギーを短時間に充放電可能な蓄電デバイスに用いるAl陽極電極の製造方法であって、
Al陽極電極の一端に延在した接合端子部となる表面を有機溶剤で脱脂する脱脂工程と、
前記脱脂工程で脱脂された前記陽極電極の表面をエッチング液でエッチングするエッチング工程と、
前記エッチング工程でエッチングされた前記陽極電極の表面にジンケート液でZnめっきを形成後、硝酸によりジンケートを剥離する処理を2回繰り返すZnめっき工程と、
前記Znめっき工程で形成されたZnめっきの表面にNiめっき液でNiめっきを形成するNiめっき工程と、
前記Niめっき工程で形成されたNiめっきの表面にSnめっき液でSnめっきを形成するSnめっき工程とを有することを特徴とする蓄電デバイス用電極の製造方法。 - Alからなる陽極電極と当該Alとは異種金属の陰極電極とを備えて負荷駆動用のモータで発生した電気エネルギーを短時間に充放電可能な蓄電デバイスに用いるAl陽極電極の接続方法であって、
一端に延在した接合端子部のAl上にジンケート液でZnめっきを形成後、硝酸によりジンケートを剥離する処理を2回繰り返すZnめっき工程により形成されたZn層又はZn合金層と、前記Zn層又はZn合金層上にめっき形成されたNi層と、前記Ni層上にめっき形成されたSn層又はSn合金層とを有するAl陽極電極と、Cuからなる陰極電極とをはんだを用いてはんだ付け接続することを特徴とする蓄電デバイス用電極の接続方法。
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