JP5545803B2 - セラミックス多孔質焼結体の製造方法 - Google Patents
セラミックス多孔質焼結体の製造方法 Download PDFInfo
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- JP5545803B2 JP5545803B2 JP2009155813A JP2009155813A JP5545803B2 JP 5545803 B2 JP5545803 B2 JP 5545803B2 JP 2009155813 A JP2009155813 A JP 2009155813A JP 2009155813 A JP2009155813 A JP 2009155813A JP 5545803 B2 JP5545803 B2 JP 5545803B2
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- 239000000919 ceramic Substances 0.000 title claims description 166
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000002245 particle Substances 0.000 claims description 93
- 239000000843 powder Substances 0.000 claims description 67
- 238000005245 sintering Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 23
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 23
- 239000011521 glass Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 7
- 239000012298 atmosphere Substances 0.000 claims description 5
- 238000011049 filling Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 4
- 238000012360 testing method Methods 0.000 description 20
- 239000007789 gas Substances 0.000 description 18
- 238000005260 corrosion Methods 0.000 description 17
- 230000007797 corrosion Effects 0.000 description 17
- 239000011148 porous material Substances 0.000 description 15
- 239000006185 dispersion Substances 0.000 description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 238000005304 joining Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 229910052574 oxide ceramic Inorganic materials 0.000 description 3
- 239000011224 oxide ceramic Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 229910052596 spinel Inorganic materials 0.000 description 3
- 239000011029 spinel Substances 0.000 description 3
- 238000001694 spray drying Methods 0.000 description 3
- 238000007751 thermal spraying Methods 0.000 description 3
- 229910052727 yttrium Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 2
- 229910052692 Dysprosium Inorganic materials 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- 229910052772 Samarium Inorganic materials 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- CMIHHWBVHJVIGI-UHFFFAOYSA-N gadolinium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Gd+3].[Gd+3] CMIHHWBVHJVIGI-UHFFFAOYSA-N 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 238000003826 uniaxial pressing Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Drying Of Semiconductors (AREA)
Description
希土類元素酸化物粉末として、Y2O3(平均粒径0.5μm、純度99.9%)、Gd2O3(平均粒径0.5μm、純度99.9%)、及びYb2O3(平均粒径0.5μm、純度99.9%)を用いた。また、その他の酸化物粉末として、アルミナ粉末(0.7μm、純度99.9%)、マグネシア粉末(平均粒径0.6μm、純度99.9%)、スピネル粉末(平均粒径0.5μm、純度99.9%)、及びジルコニア粉末(平均粒径0.5μm、純度99.9%)を用いた。
得られたセラミックス粉末成形粒子を内径100mmのカーボンの成形冶具に詰め、2MPaで仮プレスし、昇温速度300℃/min、1600〜1720℃で180分、3〜20MPaの圧力をかけてホットプレス焼結を行い、φ100×20tのセラミックス多孔質焼結体を作製した。焼結は0.1MPaの窒素雰囲気とした。
圧壊強度は、微少圧縮試験機を用いて測定した。セラミックス粉末成形粒子の平均粒径については、レーザー回折式粒度分布測定装置を用いて測定した。セラミックス多孔質焼結体の気孔率は、アルキメデス法により測定した。ヤング率と曲げ強度は、セラミックス多孔質焼結体の中心部から試験片を切り出してJISR1602、1601に準拠して測定した。
セラミックス粉末成形粒子の平均粒径を3μmとした試験No.16では、焼結が過剰に進んで緻密化し、多孔質体として不適なものとなった。試験No.2〜7、10、11、13〜15、17〜22では、十分な多孔性(気孔率)及び強度を有し、プラズマ暴露後のパーティクルの発生量も極めて少なかった。
11 セラミックス多孔質焼結体
12 緻密質セラミックス
Claims (2)
- 希土類元素酸化物を含む原料粉末からセラミックス粉末成形粒子を得る工程と、
前記セラミックス粉末成形粒子を成形冶具に充填する充填工程と、
充填した前記セラミックス粉末成形粒子を一軸加圧して成形する成形工程と、
所定の雰囲気でホットプレス焼結する焼結工程と、
を含み、
前記セラミックス粉末成形粒子は、圧壊強度が5MPa以上であり、平均粒径が5μm以上であることを特徴とする半導体プラズマ処理装置用セラミックス多孔質焼結体(但し、結合材としてガラスを含まない)の製造方法。 - 前記焼結工程におけるホットプレスのプレス圧は、5MPa以上であってセラミックス粉末成形粒子の圧壊強度の2倍以下とする請求項1記載のセラミックス多孔質焼結体の製造方法。
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JP5545803B2 true JP5545803B2 (ja) | 2014-07-09 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104137248B (zh) | 2012-02-29 | 2017-03-22 | 应用材料公司 | 配置中的除污及剥除处理腔室 |
JP2015211099A (ja) * | 2014-04-25 | 2015-11-24 | 京セラ株式会社 | 真空チャック部材および真空チャック部材の製造方法。 |
US11014853B2 (en) | 2018-03-07 | 2021-05-25 | Applied Materials, Inc. | Y2O3—ZrO2 erosion resistant material for chamber components in plasma environments |
JP2020141123A (ja) * | 2019-02-27 | 2020-09-03 | Toto株式会社 | 半導体製造装置用部材および半導体製造装置用部材を備えた半導体製造装置並びにディスプレイ製造装置 |
JP2020147489A (ja) * | 2019-03-08 | 2020-09-17 | キヤノン株式会社 | 無機化合物からなる物品、および無機化合物からなる物品の製造方法 |
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JPH10259075A (ja) * | 1997-03-21 | 1998-09-29 | Nittetsu Mining Co Ltd | 造粒焼成体及びその製造方法 |
JPH11292624A (ja) * | 1998-04-02 | 1999-10-26 | Toshiba Ceramics Co Ltd | ポーラス耐火物 |
JP2000239066A (ja) * | 1999-02-22 | 2000-09-05 | Kyocera Corp | 耐食性部材およびその製造方法、並びにそれを用いたプラズマ処理装置用部材 |
JP2001130982A (ja) * | 1999-08-20 | 2001-05-15 | Ibiden Co Ltd | 半導体製造装置用セラミック板 |
JP3830382B2 (ja) * | 2001-03-14 | 2006-10-04 | 日本碍子株式会社 | セラミック焼結体およびその製造方法 |
JP2006213577A (ja) * | 2005-02-04 | 2006-08-17 | Du Pont Mitsui Fluorochem Co Ltd | 無機微粒子凝集体およびその製造方法 |
JPWO2006112392A1 (ja) * | 2005-04-18 | 2008-12-11 | 北陸成型工業株式会社 | シャワープレート及びその製造方法 |
JP2006315911A (ja) * | 2005-05-12 | 2006-11-24 | Tosoh Corp | セラミックス顆粒 |
JP5159204B2 (ja) * | 2006-10-31 | 2013-03-06 | 株式会社フジミインコーポレーテッド | 溶射用粉末、溶射皮膜の形成方法、耐プラズマ性部材、及びプラズマ処理チャンバー |
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