JP5523747B2 - Ledチップからの光導出を高める改良ボンドパッドのデザイン - Google Patents

Ledチップからの光導出を高める改良ボンドパッドのデザイン Download PDF

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Publication number
JP5523747B2
JP5523747B2 JP2009132243A JP2009132243A JP5523747B2 JP 5523747 B2 JP5523747 B2 JP 5523747B2 JP 2009132243 A JP2009132243 A JP 2009132243A JP 2009132243 A JP2009132243 A JP 2009132243A JP 5523747 B2 JP5523747 B2 JP 5523747B2
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semiconductor structure
bond pad
light emitting
led chip
type layer
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JP2010041033A5 (https=
JP2010041033A (ja
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ティン リー
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Wolfspeed Inc
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Cree Inc
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates

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  • Led Devices (AREA)
JP2009132243A 2008-08-01 2009-06-01 Ledチップからの光導出を高める改良ボンドパッドのデザイン Active JP5523747B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/185,031 2008-08-01
US12/185,031 US8384115B2 (en) 2008-08-01 2008-08-01 Bond pad design for enhancing light extraction from LED chips

Publications (3)

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JP2010041033A JP2010041033A (ja) 2010-02-18
JP2010041033A5 JP2010041033A5 (https=) 2012-05-17
JP5523747B2 true JP5523747B2 (ja) 2014-06-18

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JP2009132243A Active JP5523747B2 (ja) 2008-08-01 2009-06-01 Ledチップからの光導出を高める改良ボンドパッドのデザイン

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US (1) US8384115B2 (https=)
EP (1) EP2149918A1 (https=)
JP (1) JP5523747B2 (https=)

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EP2149918A1 (en) 2010-02-03
US20100025719A1 (en) 2010-02-04
US8384115B2 (en) 2013-02-26
JP2010041033A (ja) 2010-02-18

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