JP2010041033A5 - - Google Patents

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Publication number
JP2010041033A5
JP2010041033A5 JP2009132243A JP2009132243A JP2010041033A5 JP 2010041033 A5 JP2010041033 A5 JP 2010041033A5 JP 2009132243 A JP2009132243 A JP 2009132243A JP 2009132243 A JP2009132243 A JP 2009132243A JP 2010041033 A5 JP2010041033 A5 JP 2010041033A5
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JP
Japan
Prior art keywords
semiconductor structure
light emitting
led chip
chip device
bond pad
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JP2009132243A
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English (en)
Japanese (ja)
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JP2010041033A (ja
JP5523747B2 (ja
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Priority claimed from US12/185,031 external-priority patent/US8384115B2/en
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Publication of JP2010041033A publication Critical patent/JP2010041033A/ja
Publication of JP2010041033A5 publication Critical patent/JP2010041033A5/ja
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Publication of JP5523747B2 publication Critical patent/JP5523747B2/ja
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JP2009132243A 2008-08-01 2009-06-01 Ｌｅｄチップからの光導出を高める改良ボンドパッドのデザイン Active JP5523747B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/185,031 2008-08-01
US12/185,031 US8384115B2 (en) 2008-08-01 2008-08-01 Bond pad design for enhancing light extraction from LED chips

Publications (3)

Publication Number Publication Date
JP2010041033A JP2010041033A (ja) 2010-02-18
JP2010041033A5 true JP2010041033A5 (https=) 2012-05-17
JP5523747B2 JP5523747B2 (ja) 2014-06-18

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JP2009132243A Active JP5523747B2 (ja) 2008-08-01 2009-06-01 Ｌｅｄチップからの光導出を高める改良ボンドパッドのデザイン

Country Status (3)

Country Link
US (1) US8384115B2 (https=)
EP (1) EP2149918A1 (https=)
JP (1) JP5523747B2 (https=)

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