JP5504149B2 - 多層配線基板 - Google Patents

多層配線基板 Download PDF

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Publication number
JP5504149B2
JP5504149B2 JP2010285410A JP2010285410A JP5504149B2 JP 5504149 B2 JP5504149 B2 JP 5504149B2 JP 2010285410 A JP2010285410 A JP 2010285410A JP 2010285410 A JP2010285410 A JP 2010285410A JP 5504149 B2 JP5504149 B2 JP 5504149B2
Authority
JP
Japan
Prior art keywords
main surface
terminal
wiring board
multilayer wiring
surface side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010285410A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011155251A (ja
JP2011155251A5 (ko
Inventor
真之介 前田
哲夫 鈴木
篤彦 杉本
達也 伊藤
琢也 半戸
訓 平野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Spark Plug Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2010285410A priority Critical patent/JP5504149B2/ja
Publication of JP2011155251A publication Critical patent/JP2011155251A/ja
Publication of JP2011155251A5 publication Critical patent/JP2011155251A5/ja
Application granted granted Critical
Publication of JP5504149B2 publication Critical patent/JP5504149B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2010285410A 2009-12-28 2010-12-22 多層配線基板 Expired - Fee Related JP5504149B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010285410A JP5504149B2 (ja) 2009-12-28 2010-12-22 多層配線基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009296912 2009-12-28
JP2009296912 2009-12-28
JP2010285410A JP5504149B2 (ja) 2009-12-28 2010-12-22 多層配線基板

Publications (3)

Publication Number Publication Date
JP2011155251A JP2011155251A (ja) 2011-08-11
JP2011155251A5 JP2011155251A5 (ko) 2013-06-27
JP5504149B2 true JP5504149B2 (ja) 2014-05-28

Family

ID=44175926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010285410A Expired - Fee Related JP5504149B2 (ja) 2009-12-28 2010-12-22 多層配線基板

Country Status (5)

Country Link
US (1) US8581388B2 (ko)
JP (1) JP5504149B2 (ko)
KR (1) KR101323541B1 (ko)
CN (1) CN102111951B (ko)
TW (1) TWI449480B (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5566720B2 (ja) * 2010-02-16 2014-08-06 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP6166879B2 (ja) * 2011-09-06 2017-07-19 株式会社 大昌電子 片面プリント配線板およびその製造方法
JP2013135080A (ja) * 2011-12-26 2013-07-08 Ngk Spark Plug Co Ltd 多層配線基板の製造方法
JP6110084B2 (ja) * 2012-07-06 2017-04-05 株式会社 大昌電子 プリント配線板およびその製造方法
KR20150002492A (ko) * 2013-06-28 2015-01-07 쿄세라 서킷 솔루션즈 가부시키가이샤 배선 기판
WO2016143117A1 (ja) * 2015-03-12 2016-09-15 三井金属鉱業株式会社 キャリア付き金属箔及び配線基板の製造方法
US10015876B2 (en) * 2015-03-31 2018-07-03 Tanazawa Hakkosha Co., Ltd. Printed board and method for manufacturing same
CN106550532A (zh) * 2015-09-17 2017-03-29 奥特斯(中国)有限公司 用于制造部件载体的包括低流动性材料的保护结构
DE112016004812T5 (de) * 2015-10-22 2018-08-16 Asahi Glass Company, Limited Verfahren zur Herstellung eines Verdrahtungssubstrats
JP2016105512A (ja) * 2016-03-01 2016-06-09 京セラサーキットソリューションズ株式会社 配線基板の製造方法
CN111554641A (zh) * 2020-05-11 2020-08-18 上海天马微电子有限公司 半导体封装件及其制作方法
WO2022170162A1 (en) * 2021-02-05 2022-08-11 Qorvo Us, Inc. Electronic device comprising a single dielectric layer for solder mask and cavity and method for fabricating the same
KR102649163B1 (ko) * 2021-03-09 2024-03-20 미쓰비시덴키 가부시키가이샤 회로 기판

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4899265B2 (ja) 2000-11-16 2012-03-21 凸版印刷株式会社 多層配線基板及びその製造方法、並びにレーザードリル装置
JP2002290022A (ja) * 2001-03-27 2002-10-04 Kyocera Corp 配線基板およびその製造方法ならびに電子装置
JP2003133711A (ja) 2001-10-23 2003-05-09 Matsushita Electric Ind Co Ltd プリント配線板とその製造方法および電子部品の実装方法
JP3811680B2 (ja) * 2003-01-29 2006-08-23 富士通株式会社 配線基板の製造方法
JP4460341B2 (ja) * 2004-04-09 2010-05-12 日本特殊陶業株式会社 配線基板およびその製造方法
JP4334005B2 (ja) 2005-12-07 2009-09-16 新光電気工業株式会社 配線基板の製造方法及び電子部品実装構造体の製造方法
TWI295550B (en) * 2005-12-20 2008-04-01 Phoenix Prec Technology Corp Structure of circuit board and method for fabricating the same
JP2007173622A (ja) * 2005-12-22 2007-07-05 Kyocer Slc Technologies Corp 配線基板の製造方法
JP5324051B2 (ja) * 2007-03-29 2013-10-23 新光電気工業株式会社 配線基板の製造方法及び半導体装置の製造方法及び配線基板
JP4881211B2 (ja) * 2007-04-13 2012-02-22 新光電気工業株式会社 配線基板の製造方法及び半導体装置の製造方法及び配線基板
JP5101169B2 (ja) * 2007-05-30 2012-12-19 新光電気工業株式会社 配線基板とその製造方法
JP5179920B2 (ja) 2008-03-28 2013-04-10 日本特殊陶業株式会社 多層配線基板
JP5203108B2 (ja) * 2008-09-12 2013-06-05 新光電気工業株式会社 配線基板及びその製造方法
JP5566720B2 (ja) * 2010-02-16 2014-08-06 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP5623308B2 (ja) * 2010-02-26 2014-11-12 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP2011181542A (ja) * 2010-02-26 2011-09-15 Ngk Spark Plug Co Ltd 多層配線基板及びその製造方法
JP2012094662A (ja) * 2010-10-26 2012-05-17 Ngk Spark Plug Co Ltd 多層配線基板の製造方法

Also Published As

Publication number Publication date
US20110156272A1 (en) 2011-06-30
US8581388B2 (en) 2013-11-12
CN102111951A (zh) 2011-06-29
KR20110076805A (ko) 2011-07-06
JP2011155251A (ja) 2011-08-11
KR101323541B1 (ko) 2013-10-29
CN102111951B (zh) 2014-09-17
TWI449480B (zh) 2014-08-11
TW201134329A (en) 2011-10-01

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