JP5491906B2 - 束状フレキシブル配線 - Google Patents
束状フレキシブル配線 Download PDFInfo
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- 238000004804 winding Methods 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 13
- 230000002265 prevention Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000008054 signal transmission Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0892—Flat or ribbon cables incorporated in a cable of non-flat configuration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/051—Rolled
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Insulated Conductors (AREA)
- Manufacturing & Machinery (AREA)
Description
本発明のもう一つの目的は、折り畳み可能な構造にし、フレキシブル配線の端部の幅を小さくして回転軸の孔に通すことができる束状フレキシブル配線を提供することにある。
図1及び図2に示すように、本発明の第一実施形態による束状フレキシブル配線100は、延伸方向Iで所定長さ延伸したフレキシブル基板11を含む。
フレキシブル基板11は、第1の表面11a及び第2の表面11bを有する。
フレキシブル基板11の第1の表面11a上には、第1の導電層12及び第1の絶縁層13が順次形成されている。
第1の絶縁層13上には、遮蔽層14がさらに形成されている。
遮蔽層14は、第1の絶縁層13の表面上の所定領域を選択的に覆い、電気信号の電磁遮蔽効果を得る。
図3に示すように、両面の回路基板の構造では、フレキシブル基板11の第2の表面11bに、第2の導電層15及び第2の絶縁層16が順次形成されている。
また、両面の回路基板の構造では、信号ジャンパー構造が設けられている。
即ち、フレキシブル基板11の第1の表面11aと第2の表面11bとの間の所定位置には、貫通孔17が設けられている。
貫通孔17の内壁面には導電材料18が設けられ、フレキシブル基板11の第1の表面11a及び第2の表面11bの上に設けられた第1の導電層12及び第2の導電層15へ、信号を選択的に導通させる。
両面の回路基板は、2つの単面の回路基板を背中合わせで組み合わせた構造でもよい。
即ち、束ねセクション4には、一方の端部に第1の接続セクション2が設けられ、他方の端部に第2の接続セクション3が設けられている。
束ね線41の全部又は一部には、信号線が設けられ、第1の接続セクション2と第2の接続セクション3との間の電気信号の伝送ルートとして用いる。
束ねセクション4において、束ね線41の端部の適宜な箇所(例えば、第1の接続セクション2及び第2の接続セクション3の箇所)に、全部又は一部の切込みと、数個の切断防止孔214とを設け、フレキシブル基板11を組み立てたり使用したりするときに、束ね線41が切込みに沿って不用意に切れて損壊することを防ぐ。
図4及び図5に示すように、積層構造20は、中央領域21と、中央領域21の両側に設けられた側部積層領域22,23とを含む。
両側のうちの少なくとも1つの側部積層領域22,23は、実体又は仮想の折り線212,213に沿って折り曲げ、中央領域21に向かって重ねる。
側部積層領域22,23は、中央領域21の下方位置で重ねたり、中央領域21の一部の領域と重ねたりしてもよい。
これにより、第1の接続セクション2は、フレキシブル基板11の延伸方向Iに対する垂直方向(即ち、幅)が狭くなる。
第2の接続セクション3は、同様に中央領域31の両側に設けた側部積層領域32,33を中央領域31に重ねたり、中央領域31の一部の領域と重ねたりしてもよい。
図4は、重ねた後の構造である。
図1に示すように、本実施形態の第1の接続セクション2の中央領域21には、接続溝部211が設けられ、第2の接続セクション3の側部積層領域32の側部には、挿着端部321が設けられている。
当然、第1の接続セクション2及び第2の接続セクション3には、同じ態様の接続溝部又は挿着端部を設けてもよい。
図6に示すように、本実施形態の第1の接続セクション2の中央領域21には、接続溝部211が設けられ、第2の接続セクション3の側部積層領域32には、接続溝部311が設けられている。
図1に示すように、本実施形態の接続セクションは、単一の束ねセクションにより、他の接続セクションに接続されており、図7に示すように、本実施形態の第2の接続セクション3は、一方の束ねセクション4の束ね線41により、第1の接続セクション2と接続され、他方の束ねセクション4aの束ね線41aにより、第1の接続セクション2aと接続されている。
このように、束状フレキシブル配線の態様は必要に応じて変えることができる。
図8に示すように、本発明の一実施形態による巻付け構造5は遮蔽層51を有する。巻付け構造5は、遮蔽材料からなる巻付け構造を含み、束ねセクション4の所定位置に巻付け、束ねセクション4の各束ね線41を束状構造にし、電磁遮蔽効果を得る。
巻付け構造5には、絶縁材料(例えば、防水テープ)を用い、遮蔽材料と絶縁材料とを組み合わせ、巻付け構造を形成してもよい。
図9に示すように、本発明の一実施形態による束状フレキシブル配線100のフレキシブル基板11の束ねセクション4の束ね線41を、回転軸構造6に通した後、回転軸構造6の2つの対応した位置に、第1の接続セクション2及び第2の接続セクション3をそれぞれ配置する。
巻付け構造5の遮蔽層51により得られる電磁遮蔽効果により、束ねセクション4の束ね線41により信号を送信する際、ルートの中を通過するときに発生する可能性がある電磁波妨害を防ぐことができる。
例えば、図12に示すように、束状フレキシブル配線は、細長いシートの遮蔽材料を斜め巻付け方向IIIで、束ねセクション4の束ね線41に螺旋状で巻付け、螺旋状の巻付け構造5aが形成されている。
細長い遮蔽材料は、導電布、銀箔、アルミ箔、銅箔、金属シートなどの電磁遮蔽効果を備える材料から選択してもよい。
従って、本発明の特許請求の範囲は、このような変更や修正を含めて広く解釈されるべきである。
2a 第1の接続セクション
3 第2の接続セクション
4 束ねセクション
4a 束ねセクション
5 巻付け構造
5a 螺旋状の巻付け構造
6 回転軸構造
11 フレキシブル基板
11a 第1の表面
11b 第2の表面
12 第1の導電層
13 第1の絶縁層
14 遮蔽層
15 第2の導電層
16 第2の絶縁層
17 貫通孔
18 導電材料
20 積層構造
21 中央領域
22 側部積層領域
23 側部積層領域
31 中央領域
32 側部積層領域
33 側部積層領域
41 束ね線
41a 束ね線
51 遮蔽層
52 絶縁外層
53 絶縁内層
54 絶縁外層
100 束状フレキシブル配線
211 接続溝部
212 折り線
213 折り線
214 切断防止孔
311 接続溝部
321 挿着端部
I 延伸方向
II 巻付け方向
III 斜め巻付け方向
Claims (6)
- 延伸方向に延伸され、第1の表面及び第2の表面を有し、前記第1の表面は第1の導電層で形成され、第1の絶縁層が前記第1の導電層上に形成され、遮蔽層が前記第1の絶縁層上に形成されたフレキシブル基板と、
前記フレキシブル基板の一方の端部に設けられた少なくとも1つの第1の接続セクションと、
前記フレキシブル基板の他方の端部に設けられた少なくとも1つの第2の接続セクションと、
前記第1の接続セクションと前記第2の接続セクションとの間に設けられ、前記フレキシブル基板の延伸方向に沿って切込みが形成された複数の束ね線を含む少なくとも1つの束ねセクションと、
前記束ねセクションの所定位置に巻付けられ、前記束ねセクションの前記束ね線のそれぞれを巻付けて束状構造に形成した少なくとも1つの巻付け構造と、を備え、
前記第1の接続セクション及び前記第2の接続セクションのうちの少なくとも1つは、積層構造を含み、前記積層構造は、前記第1の接続セクションの両側部又は一方の側部を折り線に沿って折り曲げ、前記第1の接続セクションの中央領域の少なくとも一部の領域に前記側部を重ね、
全部又は一部の前記束ね線には、前記第1の接続セクション又は前記第2の接続セクションに隣接した所定箇所に、少なくとも1つの切断防止孔が設けられ、
前記巻付け構造は、
前記束ねセクションに巻付けられた電磁遮蔽材料層と、
前記電磁遮蔽材料層の外周に巻付けられた絶縁外層と、を有することを特徴とする、束状フレキシブル配線。 - 前記フレキシブル基板の前記第2の表面には、
第2の導電層と、
前記第2の導電層上に形成された第2の絶縁層と、が形成されていることを特徴とする請求項1に記載の束状フレキシブル配線。 - 前記巻付け構造は、前記束ねセクションの所定位置に巻付けられていることを特徴とする請求項1に記載の束状フレキシブル配線。
- 延伸方向に延伸され、第1の表面及び第2の表面を有し、前記第1の表面は第1の導電層で形成され、第1の絶縁層が前記第1の導電層上に形成され、遮蔽層が前記第1の絶縁層上に形成されたフレキシブル基板と、
前記フレキシブル基板の一方の端部に設けられた少なくとも1つの第1の接続セクションと、
前記フレキシブル基板の他方の端部に設けられた少なくとも1つの第2の接続セクションと、
前記第1の接続セクションと前記第2の接続セクションとの間に設けられ、前記フレキシブル基板の延伸方向に沿って切込みが形成された複数の束ね線を含む少なくとも1つの束ねセクションと、
前記束ねセクションの所定位置に巻付け、前記束ねセクションの前記束ね線のそれぞれを巻付け、束状構造を形成する少なくとも1つの巻付け構造と、を備え、
前記巻付け構造は、前記束ねセクションの前記所定位置に、巻付け方向で巻付けられたシート状体を有し、
全部又は一部の前記束ね線には、前記第1の接続セクション又は前記第2の接続セクションに隣接した所定箇所に、少なくとも1つの切断防止孔が設けられ、
前記巻付け構造は、
前記束ねセクションに巻付けられた電磁遮蔽材料層と、
前記電磁遮蔽材料層の外周に巻付けられた絶縁外層と、を有することを特徴とする束状フレキシブル配線。 - 前記フレキシブル基板の前記第2の表面には、
第2の導電層と、
前記第2の導電層に形成された第2の絶縁層と、が形成されていることを特徴とする請求項4に記載の束状フレキシブル配線。 - 前記巻付け構造は、前記束ねセクションの所定位置に巻付けられていることを特徴とする請求項4に記載の束状フレキシブル配線。
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Application Number | Priority Date | Filing Date | Title |
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TW098131522 | 2009-09-18 | ||
TW098131522A TWI543209B (zh) | 2009-09-18 | 2009-09-18 | Bundled soft circuit cable |
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JP2011066379A JP2011066379A (ja) | 2011-03-31 |
JP2011066379A5 JP2011066379A5 (ja) | 2013-04-04 |
JP5491906B2 true JP5491906B2 (ja) | 2014-05-14 |
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US (4) | US20110067903A1 (ja) |
JP (1) | JP5491906B2 (ja) |
KR (1) | KR101664241B1 (ja) |
TW (1) | TWI543209B (ja) |
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2009
- 2009-09-18 TW TW098131522A patent/TWI543209B/zh active
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2010
- 2010-03-01 JP JP2010044117A patent/JP5491906B2/ja active Active
- 2010-03-23 US US12/729,677 patent/US20110067903A1/en not_active Abandoned
- 2010-04-02 KR KR1020100030311A patent/KR101664241B1/ko active IP Right Grant
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TWI543209B (zh) | 2016-07-21 |
US20110067903A1 (en) | 2011-03-24 |
US20120325528A1 (en) | 2012-12-27 |
KR20110031074A (ko) | 2011-03-24 |
US20120325526A1 (en) | 2012-12-27 |
US20120325527A1 (en) | 2012-12-27 |
TW201112276A (en) | 2011-04-01 |
US8872032B2 (en) | 2014-10-28 |
KR101664241B1 (ko) | 2016-10-10 |
JP2011066379A (ja) | 2011-03-31 |
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