JP5482051B2 - 半導体基板の製造方法 - Google Patents

半導体基板の製造方法 Download PDF

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Publication number
JP5482051B2
JP5482051B2 JP2009219387A JP2009219387A JP5482051B2 JP 5482051 B2 JP5482051 B2 JP 5482051B2 JP 2009219387 A JP2009219387 A JP 2009219387A JP 2009219387 A JP2009219387 A JP 2009219387A JP 5482051 B2 JP5482051 B2 JP 5482051B2
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carbon layer
silicon
carbon
single crystal
substrate
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JP2011071219A (ja
JP2011071219A5 (enExample
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浩行 島田
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Seiko Epson Corp
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Seiko Epson Corp
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JP2009219387A 2009-09-24 2009-09-24 半導体基板の製造方法 Expired - Fee Related JP5482051B2 (ja)

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JP2009219387A JP5482051B2 (ja) 2009-09-24 2009-09-24 半導体基板の製造方法

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JP2009219387A JP5482051B2 (ja) 2009-09-24 2009-09-24 半導体基板の製造方法

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JP2011071219A JP2011071219A (ja) 2011-04-07
JP2011071219A5 JP2011071219A5 (enExample) 2012-10-04
JP5482051B2 true JP5482051B2 (ja) 2014-04-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904106A (zh) * 2019-02-28 2019-06-18 云谷（固安）科技有限公司 柔性显示面板及柔性显示面板的制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7259615B2 (ja) * 2019-07-24 2023-04-18 株式会社Sumco ヘテロエピタキシャルウェーハの製造方法
CN118176329A (zh) * 2021-10-06 2024-06-11 信越半导体株式会社 异质外延膜的制作方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
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JPH06157190A (ja) * 1992-11-20 1994-06-03 Matsushita Electric Ind Co Ltd 炭化珪素薄膜の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904106A (zh) * 2019-02-28 2019-06-18 云谷（固安）科技有限公司 柔性显示面板及柔性显示面板的制备方法
CN109904106B (zh) * 2019-02-28 2021-12-14 云谷（固安）科技有限公司 柔性显示面板及柔性显示面板的制备方法

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