JP5452146B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5452146B2 JP5452146B2 JP2009216244A JP2009216244A JP5452146B2 JP 5452146 B2 JP5452146 B2 JP 5452146B2 JP 2009216244 A JP2009216244 A JP 2009216244A JP 2009216244 A JP2009216244 A JP 2009216244A JP 5452146 B2 JP5452146 B2 JP 5452146B2
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- 239000004065 semiconductor Substances 0.000 title claims description 21
- 230000015572 biosynthetic process Effects 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 9
- 239000012535 impurity Substances 0.000 description 15
- 230000015556 catabolic process Effects 0.000 description 12
- 230000005669 field effect Effects 0.000 description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 239000011574 phosphorus Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 241000293849 Cordylanthus Species 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
2、17、30 P型ウェル領域
3、31 N型ウェル領域
4、18、32 N型低濃度ソースオフセット領域
5、33 N型第1低濃度ドレインオフセット領域
6、34 N型第2低濃度ドレインオフセット領域
7、20、38 N型高濃度ソース領域
8、21、39 N型高濃度ドレイン領域
9、22 チャネル形成領域
10、23、36 ゲート酸化膜
11、24、37 ゲート電極
12、25、35 LOCOS酸化膜
13、26、40 保護酸化膜
14、27、41 ソース電極
15、28、42 ドレイン電極
19 N型低濃度ドレインLOCOSオフセット領域
100 実施例1に係る半導体装置
101 従来のNチャネルLOCOSオフセット型MOS型電界効果トランジスタ
102 実施例2に係る半導体装置
Claims (2)
- 第1導電型の半導体基板の表面に設けられた第1導電型のウェル領域と、
前記第1導電型のウェル領域に接して設けられた第2導電型のウェル領域と、
前記第1導電型のウェル領域上に設けられた第2導電型の高濃度ソース領域と、
前記高濃度ソース領域と接して設けられた第2導電型の低濃度ソースオフセット領域と、
前記第2導電型のウェル領域上に設けられた第2導電型の高濃度ドレイン領域と、
前記第2導電型のウェル領域上に前記低濃度ソースオフセット領域からチャネル形成領域分だけ離して設けられた第2導電型の第1の低濃度ドレインオフセット領域と、
前記高濃度ドレイン領域と前記第1の低濃度ドレインオフセット領域との間に両者に接して設けられた第2導電型の第2の低濃度ドレインオフセット領域と、
前記低濃度ソースオフセット領域と前記第1の低濃度ドレインオフセット領域との前記半導体基板の表面部分にそれぞれ設けられた第1および第2のLOCOS酸化膜と、
前記チャネル形成領域および前記第2の低濃度ドレインオフセット領域の前記半導体基板の表面部分に設けられたゲート酸化膜と、
前記第1のLOCOS酸化膜の一部と前記チャネル形成領域の前記ゲート酸化膜と前記第2のLOCOS酸化膜上の全てと前記第2の低濃度ドレインオフセット領域の前記ゲート酸化膜の上に設けられたゲート電極と、
前記高濃度ソース領域上に設けられたソース電極と、
前記高濃度ドレイン領域上に設けられたドレイン電極と、
前記ソース電極と前記ドレイン電極以外の部分の表面に設けられた保護酸化膜と、
を有する半導体装置。 - 第1導電型の半導体基板の表面に設けられた第1導電型のウェル領域と、
前記第1導電型のウェル領域に接して設けられた第2導電型のウェル領域と、
前記第1導電型のウェル領域上に設けられた第2導電型の高濃度ソース領域と、
前記高濃度ソース領域と接して設けられた第2導電型の低濃度ソースオフセット領域と、
前記第2導電型のウェル領域上に前記第1導電型のウェルから第1のドレインオフセット領域と更に第2のドレインオフセット領域分を隔てて設けられた第2導電型の高濃度ドレイン領域と、
前記低濃度ソースオフセット領域と前記第1のドレインオフセット領域との前記半導体基板の表面部分にそれぞれ設けられた第1および第2のLOCOS酸化膜と、
前記低濃度ソースオフセット領域と前記第1のドレインオフセット領域との間のチャネル形成領域と、
前記チャネル形成領域および前記第2の低濃度ドレインオフセット領域の前記半導体基板の表面部分に設けられたゲート酸化膜と、
前記第1のLOCOS酸化膜の一部と前記チャネル形成領域の前記ゲート酸化膜と前記第2のLOCOS酸化膜上の全てと前記第2の低濃度ドレインオフセット領域の前記ゲート酸化膜の上に設けられたゲート電極と、
前記高濃度ソース領域上に設けられたソース電極と、
前記高濃度ドレイン領域上に設けられたドレイン電極と、
前記ソース電極と前記ドレイン電極以外の部分の表面に設けられた保護酸化膜を有する半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009216244A JP5452146B2 (ja) | 2009-09-17 | 2009-09-17 | 半導体装置 |
TW099128869A TWI492381B (zh) | 2009-09-17 | 2010-08-27 | 半導體裝置 |
KR1020100090558A KR101702668B1 (ko) | 2009-09-17 | 2010-09-15 | 반도체 장치 |
US12/807,853 US8084833B2 (en) | 2009-09-17 | 2010-09-15 | Semiconductor device |
CN201010286410.9A CN102024851B (zh) | 2009-09-17 | 2010-09-17 | 半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009216244A JP5452146B2 (ja) | 2009-09-17 | 2009-09-17 | 半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011066245A JP2011066245A (ja) | 2011-03-31 |
JP2011066245A5 JP2011066245A5 (ja) | 2012-08-30 |
JP5452146B2 true JP5452146B2 (ja) | 2014-03-26 |
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ID=43729648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009216244A Expired - Fee Related JP5452146B2 (ja) | 2009-09-17 | 2009-09-17 | 半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8084833B2 (ja) |
JP (1) | JP5452146B2 (ja) |
KR (1) | KR101702668B1 (ja) |
CN (1) | CN102024851B (ja) |
TW (1) | TWI492381B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8492866B1 (en) * | 2012-01-09 | 2013-07-23 | International Business Machines Corporation | Isolated Zener diode |
JP6077291B2 (ja) * | 2012-12-10 | 2017-02-08 | エスアイアイ・セミコンダクタ株式会社 | 不揮発性メモリ回路 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08241985A (ja) * | 1995-03-06 | 1996-09-17 | Nippon Motorola Ltd | Ld−mosトランジスタ |
JPH1126766A (ja) | 1997-06-27 | 1999-01-29 | New Japan Radio Co Ltd | Mos型電界効果トランジスタおよびその製造方法 |
JPH11224945A (ja) * | 1998-02-05 | 1999-08-17 | Matsushita Electron Corp | 半導体装置 |
JP3442009B2 (ja) * | 1999-09-24 | 2003-09-02 | 松下電器産業株式会社 | 高耐圧mosトランジスタの構造 |
JP3350014B2 (ja) * | 2000-01-31 | 2002-11-25 | 松下電器産業株式会社 | 半導体装置 |
US6306700B1 (en) * | 2000-08-07 | 2001-10-23 | United Microelectronics Corp. | Method for forming high voltage devices compatible with low voltages devices on semiconductor substrate |
US6730962B2 (en) * | 2001-12-07 | 2004-05-04 | Texas Instruments Incorporated | Method of manufacturing and structure of semiconductor device with field oxide structure |
JP2004281527A (ja) * | 2003-03-13 | 2004-10-07 | Toshiba Microelectronics Corp | 半導体装置 |
JP2004342767A (ja) * | 2003-05-14 | 2004-12-02 | Sharp Corp | 半導体記憶装置及び半導体装置、並びに携帯電子機器 |
JP4711636B2 (ja) * | 2004-03-12 | 2011-06-29 | パナソニック株式会社 | 半導体装置の製造方法 |
JP2009038068A (ja) * | 2007-07-31 | 2009-02-19 | Nec Electronics Corp | 半導体装置およびその製造方法 |
-
2009
- 2009-09-17 JP JP2009216244A patent/JP5452146B2/ja not_active Expired - Fee Related
-
2010
- 2010-08-27 TW TW099128869A patent/TWI492381B/zh not_active IP Right Cessation
- 2010-09-15 KR KR1020100090558A patent/KR101702668B1/ko active IP Right Grant
- 2010-09-15 US US12/807,853 patent/US8084833B2/en not_active Expired - Fee Related
- 2010-09-17 CN CN201010286410.9A patent/CN102024851B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20110030379A (ko) | 2011-03-23 |
TW201130133A (en) | 2011-09-01 |
KR101702668B1 (ko) | 2017-02-03 |
CN102024851A (zh) | 2011-04-20 |
TWI492381B (zh) | 2015-07-11 |
JP2011066245A (ja) | 2011-03-31 |
US20110062516A1 (en) | 2011-03-17 |
CN102024851B (zh) | 2014-09-03 |
US8084833B2 (en) | 2011-12-27 |
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