JP5428556B2 - 処理装置 - Google Patents

処理装置 Download PDF

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Publication number
JP5428556B2
JP5428556B2 JP2009137500A JP2009137500A JP5428556B2 JP 5428556 B2 JP5428556 B2 JP 5428556B2 JP 2009137500 A JP2009137500 A JP 2009137500A JP 2009137500 A JP2009137500 A JP 2009137500A JP 5428556 B2 JP5428556 B2 JP 5428556B2
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JP
Japan
Prior art keywords
processing
substrate
time
chamber
load lock
Prior art date
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Expired - Fee Related
Application number
JP2009137500A
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English (en)
Japanese (ja)
Other versions
JP2010283285A5 (enExample
JP2010283285A (ja
Inventor
秀樹 駒田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2009137500A priority Critical patent/JP5428556B2/ja
Priority to KR1020100031642A priority patent/KR101234099B1/ko
Priority to CN2010101887457A priority patent/CN101908469B/zh
Priority to TW099118379A priority patent/TWI483336B/zh
Publication of JP2010283285A publication Critical patent/JP2010283285A/ja
Publication of JP2010283285A5 publication Critical patent/JP2010283285A5/ja
Application granted granted Critical
Publication of JP5428556B2 publication Critical patent/JP5428556B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/42—Recording and playback systems, i.e. in which the programme is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39527—Workpiece detector, sensor mounted in, near hand, gripper
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2009137500A 2009-06-08 2009-06-08 処理装置 Expired - Fee Related JP5428556B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009137500A JP5428556B2 (ja) 2009-06-08 2009-06-08 処理装置
KR1020100031642A KR101234099B1 (ko) 2009-06-08 2010-04-07 처리 장치
CN2010101887457A CN101908469B (zh) 2009-06-08 2010-05-28 处理装置
TW099118379A TWI483336B (zh) 2009-06-08 2010-06-07 Processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009137500A JP5428556B2 (ja) 2009-06-08 2009-06-08 処理装置

Publications (3)

Publication Number Publication Date
JP2010283285A JP2010283285A (ja) 2010-12-16
JP2010283285A5 JP2010283285A5 (enExample) 2012-05-24
JP5428556B2 true JP5428556B2 (ja) 2014-02-26

Family

ID=43263892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009137500A Expired - Fee Related JP5428556B2 (ja) 2009-06-08 2009-06-08 処理装置

Country Status (4)

Country Link
JP (1) JP5428556B2 (enExample)
KR (1) KR101234099B1 (enExample)
CN (1) CN101908469B (enExample)
TW (1) TWI483336B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5987796B2 (ja) 2013-07-24 2016-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR101842121B1 (ko) 2016-08-03 2018-03-26 세메스 주식회사 기판 처리 장치 및 이의 구동 속도 제어 방법
CN115020173B (zh) * 2022-08-10 2022-10-28 江苏邑文微电子科技有限公司 电感耦合等离子体刻蚀系统及其刻蚀控制方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3362487B2 (ja) * 1993-11-18 2003-01-07 株式会社ニコン 基板搬送装置および露光装置、ならびに露光方法
JP3485990B2 (ja) * 1995-02-09 2004-01-13 東京エレクトロン株式会社 搬送方法及び搬送装置
JP3811204B2 (ja) 1995-10-27 2006-08-16 大日本スクリーン製造株式会社 基板処理装置の制御方法
JPH10284574A (ja) * 1997-03-31 1998-10-23 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置
JP2000031237A (ja) * 1998-07-09 2000-01-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003007587A (ja) * 2001-06-20 2003-01-10 Tokyo Electron Ltd 基板処理装置
JP2007194481A (ja) 2006-01-20 2007-08-02 Hitachi Kokusai Electric Inc 基板処理装置
JP4790451B2 (ja) * 2006-03-08 2011-10-12 住友精密工業株式会社 基板処理装置
JP4313824B2 (ja) * 2007-03-23 2009-08-12 東京エレクトロン株式会社 基板移載装置及び基板移載方法並びに記憶媒体
JP2009049200A (ja) * 2007-08-20 2009-03-05 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体

Also Published As

Publication number Publication date
KR20100131913A (ko) 2010-12-16
KR101234099B1 (ko) 2013-02-19
TW201117312A (en) 2011-05-16
CN101908469A (zh) 2010-12-08
JP2010283285A (ja) 2010-12-16
TWI483336B (zh) 2015-05-01
CN101908469B (zh) 2013-07-24

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