JP5424267B2 - マイクロレンズ露光装置 - Google Patents

マイクロレンズ露光装置 Download PDF

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Publication number
JP5424267B2
JP5424267B2 JP2010177873A JP2010177873A JP5424267B2 JP 5424267 B2 JP5424267 B2 JP 5424267B2 JP 2010177873 A JP2010177873 A JP 2010177873A JP 2010177873 A JP2010177873 A JP 2010177873A JP 5424267 B2 JP5424267 B2 JP 5424267B2
Authority
JP
Japan
Prior art keywords
microlens
inspection
mask
light
microlens array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010177873A
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English (en)
Japanese (ja)
Other versions
JP2012038927A (ja
JP2012038927A5 (enExample
Inventor
通伸 水村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
V Technology Co Ltd
Original Assignee
V Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2010177873A priority Critical patent/JP5424267B2/ja
Application filed by V Technology Co Ltd filed Critical V Technology Co Ltd
Priority to KR1020137005682A priority patent/KR101820999B1/ko
Priority to PCT/JP2011/066217 priority patent/WO2012017808A1/ja
Priority to CN201180038786.0A priority patent/CN103026458B/zh
Priority to US13/813,130 priority patent/US9429852B2/en
Priority to TW100127437A priority patent/TWI529498B/zh
Publication of JP2012038927A publication Critical patent/JP2012038927A/ja
Publication of JP2012038927A5 publication Critical patent/JP2012038927A5/ja
Application granted granted Critical
Publication of JP5424267B2 publication Critical patent/JP5424267B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703—Gap setting, e.g. in proximity printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2010177873A 2010-08-06 2010-08-06 マイクロレンズ露光装置 Expired - Fee Related JP5424267B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2010177873A JP5424267B2 (ja) 2010-08-06 2010-08-06 マイクロレンズ露光装置
PCT/JP2011/066217 WO2012017808A1 (ja) 2010-08-06 2011-07-15 マイクロレンズ露光装置
CN201180038786.0A CN103026458B (zh) 2010-08-06 2011-07-15 微透镜曝光装置
US13/813,130 US9429852B2 (en) 2010-08-06 2011-07-15 Microlens exposure system
KR1020137005682A KR101820999B1 (ko) 2010-08-06 2011-07-15 마이크로 렌즈 노광 장치
TW100127437A TWI529498B (zh) 2010-08-06 2011-08-02 微透鏡曝光裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010177873A JP5424267B2 (ja) 2010-08-06 2010-08-06 マイクロレンズ露光装置

Publications (3)

Publication Number Publication Date
JP2012038927A JP2012038927A (ja) 2012-02-23
JP2012038927A5 JP2012038927A5 (enExample) 2012-04-05
JP5424267B2 true JP5424267B2 (ja) 2014-02-26

Family

ID=45559315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010177873A Expired - Fee Related JP5424267B2 (ja) 2010-08-06 2010-08-06 マイクロレンズ露光装置

Country Status (6)

Country Link
US (1) US9429852B2 (enExample)
JP (1) JP5424267B2 (enExample)
KR (1) KR101820999B1 (enExample)
CN (1) CN103026458B (enExample)
TW (1) TWI529498B (enExample)
WO (1) WO2012017808A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5376379B2 (ja) * 2010-08-30 2013-12-25 株式会社ブイ・テクノロジー マイクロレンズアレイを使用した露光装置及び光学部材
FR3014212B1 (fr) * 2013-12-04 2017-05-26 Fogale Nanotech Dispositif et procede de positionnement de masque de photolithographie par methode optique sans contact
CN104865801B (zh) * 2015-06-01 2017-03-01 京东方科技集团股份有限公司 曝光装置
KR102609838B1 (ko) * 2015-08-28 2023-12-06 에이엠에스-오스람 아시아 퍼시픽 피티이. 리미티드 광을 변환하기 위한 조명 모듈들
JPWO2017170392A1 (ja) * 2016-03-30 2019-03-07 株式会社ニコン 光学装置
CN107843966B (zh) * 2016-09-18 2021-05-04 中芯国际集成电路制造(上海)有限公司 用于装配微透镜阵列组件的方法和系统
WO2018110114A1 (ja) 2016-12-12 2018-06-21 国立研究開発法人産業技術総合研究所 マーカとマーカの製造方法
US10270032B2 (en) * 2017-09-13 2019-04-23 Int Tech Co., Ltd. Light source and a manufacturing method therewith
CN109062001B (zh) * 2018-08-27 2022-04-08 京东方科技集团股份有限公司 一种掩膜版
JP7082927B2 (ja) * 2018-08-27 2022-06-09 株式会社Ｓｃｒｅｅｎホールディングス 露光装置
CN115207262B (zh) * 2022-08-02 2025-12-02 深圳市华星光电半导体显示技术有限公司 显示面板的制备方法以及显示装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH697814B1 (de) * 2001-01-26 2009-02-27 Tecan Trading Ag Optisches System und Verfahren zum Anregen und Messen von Fluoreszenz an oder in mit Fluoreszenzfarbstoffen behandelten Proben.
US4767171A (en) * 1986-03-27 1988-08-30 Siemens Aktiengesellschaft Transmission and reception module for a bidirectional communication network
JPH0243511A (ja) * 1988-08-04 1990-02-14 Fuji Electric Co Ltd イメージセンサ対の光学系との位置合わせ方法
JPH0320733A (ja) * 1989-06-16 1991-01-29 Matsushita Electron Corp ホトマスク
JP3555230B2 (ja) 1994-05-18 2004-08-18 株式会社ニコン 投影露光装置
JP3374875B2 (ja) * 1994-06-21 2003-02-10 三菱電機株式会社 半導体写真製版装置及びそれを用いて形成された微細パターン
JP2002006208A (ja) 2000-06-23 2002-01-09 Asahi Optical Co Ltd 自動焦点検出機構を備えたデジタルスチルカメラ
KR100877708B1 (ko) * 2001-03-29 2009-01-07 다이니폰 인사츠 가부시키가이샤 패턴 형성체의 제조 방법 및 그것에 사용하는 포토마스크
JP2007003829A (ja) * 2005-06-23 2007-01-11 Fujifilm Holdings Corp 画像露光装置
JP2009302400A (ja) 2008-06-16 2009-12-24 Canon Inc 露光装置及びデバイス製造方法
JP5381029B2 (ja) 2008-11-10 2014-01-08 ウシオ電機株式会社 露光装置
WO2013021985A1 (ja) * 2011-08-10 2013-02-14 株式会社ブイ・テクノロジー 露光装置用のアライメント装置及びアライメントマーク

Also Published As

Publication number Publication date
KR101820999B1 (ko) 2018-01-22
CN103026458B (zh) 2015-11-25
WO2012017808A1 (ja) 2012-02-09
TWI529498B (zh) 2016-04-11
JP2012038927A (ja) 2012-02-23
TW201234117A (en) 2012-08-16
US20130141704A1 (en) 2013-06-06
KR20140002612A (ko) 2014-01-08
US9429852B2 (en) 2016-08-30
CN103026458A (zh) 2013-04-03

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