FR3014212B1 - Dispositif et procede de positionnement de masque de photolithographie par methode optique sans contact - Google Patents
Dispositif et procede de positionnement de masque de photolithographie par methode optique sans contactInfo
- Publication number
- FR3014212B1 FR3014212B1 FR1362065A FR1362065A FR3014212B1 FR 3014212 B1 FR3014212 B1 FR 3014212B1 FR 1362065 A FR1362065 A FR 1362065A FR 1362065 A FR1362065 A FR 1362065A FR 3014212 B1 FR3014212 B1 FR 3014212B1
- Authority
- FR
- France
- Prior art keywords
- positioning
- photolithography mask
- optical non
- contact method
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7038—Alignment for proximity or contact printer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/703—Gap setting, e.g. in proximity printer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1362065A FR3014212B1 (fr) | 2013-12-04 | 2013-12-04 | Dispositif et procede de positionnement de masque de photolithographie par methode optique sans contact |
JP2016536580A JP2016539375A (ja) | 2013-12-04 | 2014-11-28 | 非接触光学的方法を用いてフォトリソグラフィマスクを位置付けるための装置および方法 |
EP14814785.3A EP3077873B1 (fr) | 2013-12-04 | 2014-11-28 | Dispositif et procede de positionnement de masque de photolithographie par methode optique sans contact |
PCT/EP2014/076009 WO2015082363A1 (fr) | 2013-12-04 | 2014-11-28 | Dispositif et procede de positionnement de masque de photolithographie par methode optique sans contact |
US15/039,833 US9897927B2 (en) | 2013-12-04 | 2014-11-28 | Device and method for positioning a photolithography mask by a contactless optical method |
SG11201604325RA SG11201604325RA (en) | 2013-12-04 | 2014-11-28 | Device and method for positioning a photolithography mask by means of a contactless optical method |
KR1020167015942A KR20160093021A (ko) | 2013-12-04 | 2014-11-28 | 비접촉 광학 방법을 이용한 포토리소그래피 마스크를 위치시키기 위한 방법 및 장치 |
CN201480066168.0A CN105829971B (zh) | 2013-12-04 | 2014-11-28 | 用于通过无接触式光学法定位光刻掩模的装置和方法 |
TW103141887A TWI636345B (zh) | 2013-12-04 | 2014-12-03 | 藉由非接觸式光學方法用以定位光刻遮罩的裝置和方法以及用於曝光晶圓的工具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1362065A FR3014212B1 (fr) | 2013-12-04 | 2013-12-04 | Dispositif et procede de positionnement de masque de photolithographie par methode optique sans contact |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3014212A1 FR3014212A1 (fr) | 2015-06-05 |
FR3014212B1 true FR3014212B1 (fr) | 2017-05-26 |
Family
ID=50029106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1362065A Expired - Fee Related FR3014212B1 (fr) | 2013-12-04 | 2013-12-04 | Dispositif et procede de positionnement de masque de photolithographie par methode optique sans contact |
Country Status (9)
Country | Link |
---|---|
US (1) | US9897927B2 (fr) |
EP (1) | EP3077873B1 (fr) |
JP (1) | JP2016539375A (fr) |
KR (1) | KR20160093021A (fr) |
CN (1) | CN105829971B (fr) |
FR (1) | FR3014212B1 (fr) |
SG (1) | SG11201604325RA (fr) |
TW (1) | TWI636345B (fr) |
WO (1) | WO2015082363A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107208996B (zh) * | 2014-12-12 | 2020-04-07 | 沃思测量技术股份有限公司 | 用于测量工件的特征的方法和设备 |
US10473714B2 (en) * | 2017-03-06 | 2019-11-12 | Asm Technology Singapore Pte Ltd | Method and apparatus for aligning electronic components |
CN108036732B (zh) * | 2017-11-30 | 2020-05-26 | 中国科学院光电技术研究所 | 一种基于超分辨光刻的间隙检测装置 |
CN110557968A (zh) * | 2018-04-03 | 2019-12-10 | 应用材料公司 | 用于对准基板的设备、系统和方法 |
DE102018114860A1 (de) * | 2018-06-20 | 2019-12-24 | Precitec Optronik Gmbh | Vorrichtung und Verfahren zur optischen Vermessung eines Messobjekts |
FR3093560B1 (fr) * | 2019-03-05 | 2021-10-29 | Fogale Nanotech | Procédé et dispositif de mesure d’interfaces d’un élément optique |
KR102199964B1 (ko) * | 2019-04-30 | 2021-01-07 | 한양대학교 에리카산학협력단 | 근접 노광을 위한 기판 변형 장치 및 이를 이용한 근접 노광을 위한 기판 변형 방법 |
EP3800505A1 (fr) * | 2019-10-03 | 2021-04-07 | ASML Netherlands B.V. | Système de mesure et procédé de caractérisation d'un dispositif de placement de motif |
US11852464B2 (en) * | 2021-12-20 | 2023-12-26 | Mloptic Corp. | Chromatic confocal sensor with imaging capability for 6-axis spatial allocation calibration |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57204547A (en) * | 1981-06-12 | 1982-12-15 | Hitachi Ltd | Exposing method |
US4636626A (en) * | 1983-01-14 | 1987-01-13 | Nippon Kogaku K.K. | Apparatus for aligning mask and wafer used in semiconductor circuit element fabrication |
DE69013790T2 (de) * | 1989-08-04 | 1995-05-04 | Canon Kk | Verfahren und Vorrichtung zur Positionsbestimmung. |
US5808742A (en) * | 1995-05-31 | 1998-09-15 | Massachusetts Institute Of Technology | Optical alignment apparatus having multiple parallel alignment marks |
JP2004165723A (ja) * | 2002-11-08 | 2004-06-10 | Olympus Corp | 電子撮像装置 |
US7650029B2 (en) * | 2004-11-23 | 2010-01-19 | Hewlett-Packard Development Company, L.P. | Multiple layer alignment sensing |
US7800761B2 (en) * | 2006-04-12 | 2010-09-21 | Massachusetts Institute Of Technology | Infrared interferometric-spatial-phase imaging using backside wafer marks |
US7535646B2 (en) * | 2006-11-17 | 2009-05-19 | Eastman Kodak Company | Light emitting device with microlens array |
NL1036683A1 (nl) * | 2008-04-14 | 2009-10-15 | Asml Netherlands Bv | Focus sensor, inspection apparatus, lithographic apparatus and control system. |
JP2011164503A (ja) * | 2010-02-15 | 2011-08-25 | Hitachi Displays Ltd | 表示装置 |
JP5736672B2 (ja) * | 2010-06-03 | 2015-06-17 | 株式会社ニコン | 光学部品及び分光測光装置 |
JP5424267B2 (ja) * | 2010-08-06 | 2014-02-26 | 株式会社ブイ・テクノロジー | マイクロレンズ露光装置 |
US8419233B2 (en) * | 2011-05-10 | 2013-04-16 | Applied Lighting Company | Lampshade structure for LED lamps |
US9760020B2 (en) * | 2012-11-21 | 2017-09-12 | Kla-Tencor Corporation | In-situ metrology |
-
2013
- 2013-12-04 FR FR1362065A patent/FR3014212B1/fr not_active Expired - Fee Related
-
2014
- 2014-11-28 US US15/039,833 patent/US9897927B2/en active Active
- 2014-11-28 WO PCT/EP2014/076009 patent/WO2015082363A1/fr active Application Filing
- 2014-11-28 EP EP14814785.3A patent/EP3077873B1/fr not_active Not-in-force
- 2014-11-28 KR KR1020167015942A patent/KR20160093021A/ko not_active Application Discontinuation
- 2014-11-28 SG SG11201604325RA patent/SG11201604325RA/en unknown
- 2014-11-28 JP JP2016536580A patent/JP2016539375A/ja active Pending
- 2014-11-28 CN CN201480066168.0A patent/CN105829971B/zh not_active Expired - Fee Related
- 2014-12-03 TW TW103141887A patent/TWI636345B/zh active
Also Published As
Publication number | Publication date |
---|---|
FR3014212A1 (fr) | 2015-06-05 |
JP2016539375A (ja) | 2016-12-15 |
CN105829971B (zh) | 2017-09-08 |
TWI636345B (zh) | 2018-09-21 |
WO2015082363A1 (fr) | 2015-06-11 |
US9897927B2 (en) | 2018-02-20 |
US20160377995A1 (en) | 2016-12-29 |
CN105829971A (zh) | 2016-08-03 |
KR20160093021A (ko) | 2016-08-05 |
SG11201604325RA (en) | 2016-07-28 |
EP3077873B1 (fr) | 2018-02-14 |
EP3077873A1 (fr) | 2016-10-12 |
TW201527908A (zh) | 2015-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 3 |
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PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
Year of fee payment: 5 |
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TP | Transmission of property |
Owner name: UNITY SEMICONDUCTOR, FR Effective date: 20180316 |
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PLFP | Fee payment |
Year of fee payment: 7 |
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PLFP | Fee payment |
Year of fee payment: 8 |
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PLFP | Fee payment |
Year of fee payment: 9 |
|
ST | Notification of lapse |
Effective date: 20230808 |