JP5411103B2 - ダイ取付用の二段硬化b−ステージ化可能な接着剤 - Google Patents
ダイ取付用の二段硬化b−ステージ化可能な接着剤 Download PDFInfo
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- JP5411103B2 JP5411103B2 JP2010236234A JP2010236234A JP5411103B2 JP 5411103 B2 JP5411103 B2 JP 5411103B2 JP 2010236234 A JP2010236234 A JP 2010236234A JP 2010236234 A JP2010236234 A JP 2010236234A JP 5411103 B2 JP5411103 B2 JP 5411103B2
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
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- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/243—Two or more independent types of crosslinking for one or more polymers
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- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
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- H01L2224/838—Bonding techniques
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- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Description
Claims (6)
- 該第1及び第2の組成物が、照射又は熱によって独立に硬化する、請求項1に記載のB−ステージ化可能な接着剤。
- さらにイミダゾール/無水物付加物を含む、請求項1又は2に記載のB−ステージ化可能な接着剤。
- 該イミダゾール/無水物付加物が、1部の1,2,4,5−ベンゼンテトラカルボン酸無水物と4部の2−フェニル−4−メチルイミダゾールの錯体又は1部の1,2,4,5−ベンゼンテトラカルボン酸二無水物と2部の2−フェニル−4−メチルイミダゾールの錯体である、請求項3に記載のB−ステージ化可能な接着剤。
- 半導体チップを基板に取り付ける方法であって、
(i)ビスマレイミド化合物、下記式:
で表される2官能性供与体及び過酸化物触媒を含む第1の組成物;並びに
(ii)ビスフェノール型エポキシ化合物、エラストマー、フェノール性硬化剤、及びホスフィン系触媒としてのトリフェニルホスフィンを含む第2の組成物
を含むB−ステージ化可能な接着剤であって、該第1及び第2の組成物の硬化温度が30℃以上離れており、かつ該第2の組成物の硬化温度は該第1の組成物の硬化温度より高いことを特徴とするB−ステージ化可能な接着剤を基板に付着させるステップ、
該基板及び接着剤を該第1の組成物の硬化温度にまで加熱してその組成物を硬化させるステップ、
該接着剤を半導体チップと接触させるステップ、及び
該基板、接着剤及び半導体チップを該第2の組成物の硬化温度にまで加熱してその組成物を硬化させるステップ
を含む方法。 - 半導体チップ又はダイのための基板と該基板に付着されたB−ステージ化可能な接着剤を含むアセンブリであって、該B−ステージ化可能な接着剤は
(i)ビスマレイミド化合物、下記式:
で表される2官能性供与体及び過酸化物触媒を含む第1の組成物;並びに
(ii)ビスフェノール型エポキシ化合物、エラストマー、フェノール性硬化剤、及びホスフィン系触媒としてのトリフェニルホスフィンを含む第2の組成物
を含み、該第1及び第2の組成物の硬化温度は30℃以上離れており、かつ該第2の組成物の硬化温度は該第1の組成物の硬化温度より高く、そして該第1の組成物は完全に硬化しており、かつ該第2の組成物は未硬化であることを特徴とするアセンブリ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/016,844 | 2001-12-14 | ||
US10/016,844 US20030129438A1 (en) | 2001-12-14 | 2001-12-14 | Dual cure B-stageable adhesive for die attach |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003552885A Division JP2005513192A (ja) | 2001-12-14 | 2002-11-18 | ダイ取付用の二段硬化b−ステージ化可能な接着剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011063805A JP2011063805A (ja) | 2011-03-31 |
JP5411103B2 true JP5411103B2 (ja) | 2014-02-12 |
Family
ID=21779282
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003552885A Pending JP2005513192A (ja) | 2001-12-14 | 2002-11-18 | ダイ取付用の二段硬化b−ステージ化可能な接着剤 |
JP2010236234A Expired - Lifetime JP5411103B2 (ja) | 2001-12-14 | 2010-10-21 | ダイ取付用の二段硬化b−ステージ化可能な接着剤 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003552885A Pending JP2005513192A (ja) | 2001-12-14 | 2002-11-18 | ダイ取付用の二段硬化b−ステージ化可能な接着剤 |
Country Status (9)
Country | Link |
---|---|
US (2) | US20030129438A1 (ja) |
EP (1) | EP1453924A2 (ja) |
JP (2) | JP2005513192A (ja) |
KR (1) | KR100980383B1 (ja) |
CN (1) | CN1296451C (ja) |
AU (1) | AU2002359433A1 (ja) |
HK (1) | HK1072067A1 (ja) |
TW (1) | TWI229694B (ja) |
WO (1) | WO2003052016A2 (ja) |
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US20040158008A1 (en) * | 2003-02-06 | 2004-08-12 | Xiping He | Room temperature printable adhesive paste |
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KR100792950B1 (ko) * | 2007-01-19 | 2008-01-08 | 엘에스전선 주식회사 | 반도체 패키징 방법 |
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US20100113643A1 (en) * | 2007-04-09 | 2010-05-06 | Designer Molecules, Inc. | Curatives for epoxy adhesive compositions |
US8039663B2 (en) * | 2007-04-09 | 2011-10-18 | Designer Molecules, Inc. | Monomers derived from pentacyclopentadecane dimethanol |
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-
2001
- 2001-12-14 US US10/016,844 patent/US20030129438A1/en not_active Abandoned
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2002
- 2002-11-18 EP EP20020793971 patent/EP1453924A2/en not_active Withdrawn
- 2002-11-18 AU AU2002359433A patent/AU2002359433A1/en not_active Abandoned
- 2002-11-18 CN CNB028248864A patent/CN1296451C/zh not_active Expired - Lifetime
- 2002-11-18 KR KR1020047008824A patent/KR100980383B1/ko active IP Right Grant
- 2002-11-18 JP JP2003552885A patent/JP2005513192A/ja active Pending
- 2002-11-18 WO PCT/US2002/037231 patent/WO2003052016A2/en active Application Filing
- 2002-12-13 TW TW91136235A patent/TWI229694B/zh not_active IP Right Cessation
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2005
- 2005-06-13 HK HK05104927A patent/HK1072067A1/xx not_active IP Right Cessation
- 2005-06-27 US US11/168,037 patent/US20050238881A1/en not_active Abandoned
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US20030129438A1 (en) | 2003-07-10 |
KR20040070210A (ko) | 2004-08-06 |
KR100980383B1 (ko) | 2010-09-07 |
HK1072067A1 (en) | 2005-08-12 |
JP2011063805A (ja) | 2011-03-31 |
EP1453924A2 (en) | 2004-09-08 |
TW200304936A (en) | 2003-10-16 |
CN1296451C (zh) | 2007-01-24 |
WO2003052016A3 (en) | 2004-02-26 |
TWI229694B (en) | 2005-03-21 |
AU2002359433A1 (en) | 2003-06-30 |
JP2005513192A (ja) | 2005-05-12 |
US20050238881A1 (en) | 2005-10-27 |
CN1602343A (zh) | 2005-03-30 |
WO2003052016A2 (en) | 2003-06-26 |
AU2002359433A8 (en) | 2003-06-30 |
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