AU2002359433A1 - Dual cure b-stageable adhesive for die attach - Google Patents

Dual cure b-stageable adhesive for die attach

Info

Publication number
AU2002359433A1
AU2002359433A1 AU2002359433A AU2002359433A AU2002359433A1 AU 2002359433 A1 AU2002359433 A1 AU 2002359433A1 AU 2002359433 A AU2002359433 A AU 2002359433A AU 2002359433 A AU2002359433 A AU 2002359433A AU 2002359433 A1 AU2002359433 A1 AU 2002359433A1
Authority
AU
Australia
Prior art keywords
die attach
dual cure
stageable adhesive
stageable
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002359433A
Other versions
AU2002359433A8 (en
Inventor
Kevin Harris Becker
Harry Richard Kuder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Starch and Chemical Investment Holding Corp
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Publication of AU2002359433A1 publication Critical patent/AU2002359433A1/en
Publication of AU2002359433A8 publication Critical patent/AU2002359433A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/243—Two or more independent types of crosslinking for one or more polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83856—Pre-cured adhesive, i.e. B-stage adhesive
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
AU2002359433A 2001-12-14 2002-11-18 Dual cure b-stageable adhesive for die attach Abandoned AU2002359433A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/016,844 2001-12-14
US10/016,844 US20030129438A1 (en) 2001-12-14 2001-12-14 Dual cure B-stageable adhesive for die attach
PCT/US2002/037231 WO2003052016A2 (en) 2001-12-14 2002-11-18 Dual cure b-stageable adhesive for die attach

Publications (2)

Publication Number Publication Date
AU2002359433A1 true AU2002359433A1 (en) 2003-06-30
AU2002359433A8 AU2002359433A8 (en) 2003-06-30

Family

ID=21779282

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002359433A Abandoned AU2002359433A1 (en) 2001-12-14 2002-11-18 Dual cure b-stageable adhesive for die attach

Country Status (9)

Country Link
US (2) US20030129438A1 (en)
EP (1) EP1453924A2 (en)
JP (2) JP2005513192A (en)
KR (1) KR100980383B1 (en)
CN (1) CN1296451C (en)
AU (1) AU2002359433A1 (en)
HK (1) HK1072067A1 (en)
TW (1) TWI229694B (en)
WO (1) WO2003052016A2 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030129438A1 (en) * 2001-12-14 2003-07-10 Becker Kevin Harris Dual cure B-stageable adhesive for die attach
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
US20040158008A1 (en) * 2003-02-06 2004-08-12 Xiping He Room temperature printable adhesive paste
WO2010019832A2 (en) 2008-08-13 2010-02-18 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US7884174B2 (en) * 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US20050208700A1 (en) * 2004-03-19 2005-09-22 Chippac, Inc. Die to substrate attach using printed adhesive
US7875688B2 (en) * 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
KR20070085199A (en) * 2004-06-04 2007-08-27 디자이너 몰레큘스 인코퍼레이티드 Free-radical curable polyesters and methods for use thereof
WO2007029504A1 (en) 2005-09-02 2007-03-15 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and die bonding material comprising the composition
US8043534B2 (en) 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) * 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
JP5233091B2 (en) * 2006-08-01 2013-07-10 住友ベークライト株式会社 Liquid resin composition and semiconductor device produced using liquid resin composition
US20080121845A1 (en) * 2006-08-11 2008-05-29 General Electric Company Oxetane composition, associated method and article
US20080039608A1 (en) * 2006-08-11 2008-02-14 General Electric Company Oxetane composition, associated method and article
US20080039542A1 (en) * 2006-08-11 2008-02-14 General Electric Company Composition and associated method
US20080039560A1 (en) * 2006-08-11 2008-02-14 General Electric Company Syneretic composition, associated method and article
US7422707B2 (en) * 2007-01-10 2008-09-09 National Starch And Chemical Investment Holding Corporation Highly conductive composition for wafer coating
KR100792950B1 (en) * 2007-01-19 2008-01-08 엘에스전선 주식회사 Method of packaging semi-conductor
US20080262191A1 (en) * 2007-01-26 2008-10-23 Mizori Farhad G Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
US20100113643A1 (en) * 2007-04-09 2010-05-06 Designer Molecules, Inc. Curatives for epoxy adhesive compositions
US8039663B2 (en) * 2007-04-09 2011-10-18 Designer Molecules, Inc. Monomers derived from pentacyclopentadecane dimethanol
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
US8063161B2 (en) * 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US8308892B2 (en) * 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US8008419B2 (en) 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
KR101617600B1 (en) * 2010-06-08 2016-05-02 헨켈 아이피 앤드 홀딩 게엠베하 Coating adhesives onto dicing before grinding and micro-fabricated wafers
JP2013533338A (en) * 2010-06-08 2013-08-22 ヘンケル コーポレイション Dual cure adhesive
WO2012106223A2 (en) 2011-02-01 2012-08-09 Henkel Corporation Pre-cut wafer applied underfill film on dicing tape
EP2671249A4 (en) 2011-02-01 2015-10-07 Henkel IP & Holding GmbH Pre- cut wafer applied underfill film
US20130026660A1 (en) * 2011-07-29 2013-01-31 Namics Corporation Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
KR101375297B1 (en) 2011-12-22 2014-03-17 제일모직주식회사 Adhesive composition for semiconductor, adhesive film comprising the same
US10106643B2 (en) * 2015-03-31 2018-10-23 3M Innovative Properties Company Dual-cure nanostructure transfer film
EP3632964B1 (en) * 2018-10-03 2022-09-28 3M Innovative Properties Company Curable precursor of a structural adhesive composition
EP3719089A1 (en) * 2019-04-02 2020-10-07 3M Innovative Properties Company Process of manufacturing a curable precursor of a structural adhesive composition
EP3719088A1 (en) * 2019-04-02 2020-10-07 3M Innovative Properties Company Curable precursor of a structural adhesive composition
CN112280509B (en) * 2020-09-14 2023-07-25 深圳市安伯斯科技有限公司 Single-component epoxy resin packaging transparent adhesive tape and application thereof

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS535920B2 (en) * 1974-06-03 1978-03-02
US4401499A (en) * 1980-06-09 1983-08-30 Sumitomo Bakelite Company Limited Crosslinked resin of epoxy compound and isocyanate and process for producing same
JPS61237436A (en) * 1985-04-15 1986-10-22 Toshiba Chem Corp Manufacture of semiconductor element
US5082880A (en) * 1988-09-12 1992-01-21 Mitsui Toatsu Chemicals, Inc. Semiconductor sealing composition containing epoxy resin and polymaleimide
US5208188A (en) * 1989-10-02 1993-05-04 Advanced Micro Devices, Inc. Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
US5261156A (en) * 1991-02-28 1993-11-16 Semiconductor Energy Laboratory Co., Ltd. Method of electrically connecting an integrated circuit to an electric device
DE4130329A1 (en) * 1991-09-12 1993-03-18 Bayer Ag HEAT-CURABLE REACTION RESIN MIXTURES, A METHOD FOR THE PRODUCTION THEREOF AND THE USE FOR THE PRODUCTION OF PRESSING MATERIALS AND MOLDED BODIES
US5728633A (en) * 1992-01-23 1998-03-17 Jacobs; Richard L. Interpenetrating network compositions and structures
US5510633A (en) * 1994-06-08 1996-04-23 Xerox Corporation Porous silicon light emitting diode arrays and method of fabrication
US5579573A (en) * 1994-10-11 1996-12-03 Ford Motor Company Method for fabricating an undercoated chip electrically interconnected to a substrate
US5494981A (en) * 1995-03-03 1996-02-27 Minnesota Mining And Manufacturing Company Epoxy-cyanate ester compositions that form interpenetrating networks via a Bronsted acid
KR100235082B1 (en) * 1995-04-04 1999-12-15 우찌가사끼 이사오 Adhesive, adhesive film and adhesive-backed metal foil
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Process for producing multilayer printed circuit board
US5654081A (en) * 1995-07-05 1997-08-05 Ford Motor Company Integrated circuit assembly with polymeric underfill body
JP2891184B2 (en) * 1996-06-13 1999-05-17 日本電気株式会社 Semiconductor device and manufacturing method thereof
US5756405A (en) * 1996-09-10 1998-05-26 International Business Machines Corporation Technique for forming resin-impregnated fiberglass sheets
JPH10231354A (en) * 1997-02-19 1998-09-02 Nagase Chiba Kk Epoxy resin composition, thermosetting resin film and method for forming cured resin film on substrate
JPH1129748A (en) * 1997-05-12 1999-02-02 Fujitsu Ltd Adhesive, adhesion, and mounted substrate board assembly
KR20010015728A (en) * 1997-10-23 2001-02-26 베르너 훽스트, 지크프리트 포트호프 Hardener for anhydride group-containing polymers
JP3184485B2 (en) * 1997-11-06 2001-07-09 三井金属鉱業株式会社 Resin composition for copper clad laminate, copper foil with resin, multilayer copper clad laminate and multilayer printed wiring board
US6194490B1 (en) * 1998-02-27 2001-02-27 Vantico, Inc. Curable composition comprising epoxidized natural oils
US6228678B1 (en) * 1998-04-27 2001-05-08 Fry's Metals, Inc. Flip chip with integrated mask and underfill
JP4098403B2 (en) * 1998-06-01 2008-06-11 富士通株式会社 Adhesive, bonding method, and assembly of mounting substrate
US6281314B1 (en) * 1998-07-02 2001-08-28 National Starch And Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards
US6057381A (en) * 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
US6063828A (en) * 1998-07-02 2000-05-16 National Starch And Chemical Investment Holding Corporation Underfill encapsulant compositions for use in electronic devices
JP2000248053A (en) * 1999-03-02 2000-09-12 Tosoh Corp Liquid epoxy resin composition
US6331446B1 (en) * 1999-03-03 2001-12-18 Intel Corporation Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state
JP2001015551A (en) * 1999-06-29 2001-01-19 Toshiba Corp Semiconductor device and its manufacture
JP3601443B2 (en) * 1999-11-30 2004-12-15 日立化成工業株式会社 Adhesive film, method of manufacturing the same, wiring board for mounting semiconductor, and semiconductor device
JP3562465B2 (en) * 1999-11-30 2004-09-08 日立化成工業株式会社 Adhesive composition, adhesive film and wiring board for mounting semiconductor
US20030069331A1 (en) * 2000-02-15 2003-04-10 Inada Teiichi Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device
JP2001323246A (en) * 2000-03-07 2001-11-22 Sony Chem Corp Adhesive for connecting electrode and bonding method using the adhesive
US6833629B2 (en) * 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
US20030129438A1 (en) * 2001-12-14 2003-07-10 Becker Kevin Harris Dual cure B-stageable adhesive for die attach

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US20030129438A1 (en) 2003-07-10
KR20040070210A (en) 2004-08-06
KR100980383B1 (en) 2010-09-07
HK1072067A1 (en) 2005-08-12
JP2011063805A (en) 2011-03-31
EP1453924A2 (en) 2004-09-08
JP5411103B2 (en) 2014-02-12
TW200304936A (en) 2003-10-16
CN1296451C (en) 2007-01-24
WO2003052016A3 (en) 2004-02-26
TWI229694B (en) 2005-03-21
JP2005513192A (en) 2005-05-12
US20050238881A1 (en) 2005-10-27
CN1602343A (en) 2005-03-30
WO2003052016A2 (en) 2003-06-26
AU2002359433A8 (en) 2003-06-30

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