JP5400328B2 - 駆動ｉｃ基板に放熱層をビルトインする方法及び構造 - Google Patents

駆動ｉｃ基板に放熱層をビルトインする方法及び構造 Download PDF

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JP5400328B2
JP5400328B2 JP2008209071A JP2008209071A JP5400328B2 JP 5400328 B2 JP5400328 B2 JP 5400328B2 JP 2008209071 A JP2008209071 A JP 2008209071A JP 2008209071 A JP2008209071 A JP 2008209071A JP 5400328 B2 JP5400328 B2 JP 5400328B2
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家輝 伍
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Description

本発明はチップ・オン・フィルム（ＣＯＦ）に関し、特に駆動ＩＣ基板に放熱層をビルトインする方法及び構造に関する。
近年、液晶（ＬＣＤ）スクリーンは携帯電話、ＰＤＡ、ノートブックパソコンなど各種の電子製品に広範囲に利用されている。表示スクリーンの大型化に伴って、軽量・薄型の液晶表示装置はＣＲＴ（陰極線管）など従来の表示装置に取って代わり、表示分野でますます重要な役割を果たすようになる。
液晶の大型化につれ、駆動ＩＣのチャネル数と動作周波数は実質的に増加する。しかし、駆動ＩＣと動作周波数の増加に伴って、駆動ＩＣの過熱により装置の性能と寿命は減少する。したがって、液晶表示装置でＩＣの放熱を改善し、ＩＣの過熱を低減させる方法と装置が望まれている。
本発明の目的のひとつは、前記問題を解決するために、駆動ＩＣ基板に放熱層をビルトインする方法及び構造を提供して放熱を改善することにある。
本発明のこれらの及び他の目的は種々の図面中に示された以下の好ましい実施例の詳細な記述を理解した後当業者にとって疑いなく明らかとなる。
本発明の一実施例では、ＣＯＦ（チップ・オン・フィルム）構造を開示する。ＣＯＦ構造はフレキシブル回路基板とチップとを含む。フレキシブル回路基板は、ポリイミド層と異方性伝熱層（ＡＣＬ）を備えるフレキシブルベース膜と伝導層とを含む。伝導層はフレキシブルベース膜の上に配置される。伝導層とＡＣＬは前記ポリイミド層により分離される。チップはインターコネクタを介して伝導層に実装される。
かかる装置の特徴を詳述するために、具体的な実施例を挙げ、図を参照して以下に説明する。
図１を参照する。図１、は本発明の一実施例に従ったチップ・オン・フィルム（ＣＯＦ）構造１００を示す断面図である。図１に示すように、ＣＯＦ構造１００は、チップ１１０及びフレキシブル回路基板１２０（即ち基板）を含む。フレキシブル回路基板１２０は、伝導層１３０及びフレキシブルベース膜１４０を備える。フレキシブルベース膜１４０は、ポリイミド層１４２及び異方性伝導膜（ＡＣＬ）１４４を備える。伝導層１３０は、ポリイミド層１４２の上に形成されており、伝導層１３０及びＡＣＬ１４４はポリイミド層１４２により分離されている。チップ１１０はそのインターコネクタ１１１及び伝導層１３０とのボンディングにより、フレキシブル回路基板１２０に実装されている。ＣＯＦ構造１００の詳しい説明は以下のとおりである。本説明は理解の明瞭さのみを目的とし、本発明を限定するものとして捉えるべきではない。
このＣＯＦ構造１００では、ＡＣＬ１４４はポリイミド（ＰＩ）及び異方性伝熱粒子で製作され、ポリイミド層１４２とＡＣＬ１４４との間の表面に実質的に垂直な方向に伝導性にする。例えば、ＡＣＬ１４４は図１に示す方向Ｚに伝導性にする。
図２を参照する。図２は本発明の実施例１に従った駆動ＩＣに放熱層をビルトインする方法を示すフローチャートである。本方法はいわゆるＣＯＦの銅めっき型に統合することができる。同方法の段階については以下に説明する。
ステップＳ２００：ポリイミド層を設ける。
ステップＳ２１０：異方性伝熱粒子をポリイミド層の表面に積層して熱圧プロセスでＡＣＬを形成し、ＡＣＬをポリイミド層とＡＣＬとの間の表面に実質的に垂直な方向に伝導性にするようにさせる。
ステップＳ２２０：ポリイミド層の反対面に伝導層を形成する。
ステップＳ２３０：伝導層の上にパターンを形成し、インターコネクタを介してチップを伝導層に実装する。
図３を参照する。図３は本発明の実施例２に従った駆動ＩＣに放熱層をビルトインする方法を示すフローチャートである。本方法はいわゆるＣＯＦのＰＩキャスティング型に統合することができる。同方法の段階については以下に説明する。
ステップＳ３００：伝導層を設ける。
ステップＳ３１０：伝導層の上にコーティングプロセスでポリイミド層を形成する。
ステップＳ３２０：ポリイミド層の表面上に異方性伝熱粒子を混合し、硬化プロセスで元フレキシブルベース膜を形成する。
ステップＳ３３０：元フレキシブルベース膜に磁場を加えてＡＣＬを形成する。
ステップＳ３４０：伝導層の上にパターンを形成し、インターコネクタを介してチップを伝導層に実装する。
本発明による駆動ＩＣ基板に放熱層をビルトインする方法は、当業者が図２と図３に示すフローチャートを参照すれば理解できるので、簡潔にするためここで詳しい説明を省略する。また、注意すべきは、実質的に同じ結果が得られる限り、図２と図３の段階は必ずしも図示の順序で実行する必要はない。
本発明の実施例に従ったＣＯＦ構造１００では、フレキシブルベース膜１４０はポリイミド層１４２だけでなく、ＡＣＬ１４４も含む。ＡＣＬ１４４は熱を伝導する良好な能力を持つのでチップ１１０の発熱を放散し、放熱を改善することができる。また、本発明の実施例に従ったＣＯＦ構造の製作方法はＣＯＦメーカーにとってフレキシブルベース膜の原材料を置き換えるだけからなるので、効率的な生産方法である。なお、ＡＣＬ（放熱層）の厚さは機械的信頼性試験の制限と関連の放熱要求に応じて制御することができる。
以上は本発明に好ましい実施例であって、本発明の実施の範囲を限定するものではない。よって、当業者のなし得る修正、もしくは変更であって、本発明の精神の下においてなされ、本発明に対して均等の効果を有するものは、いずれも本発明の特許請求の範囲に属するものとする。
本発明の一実施例によるＣＯＦ構造の断面図である。 本発明の実施例１による駆動ＩＣ基板に放熱層をビルトインする方法のフローチャートである。 本発明の実施例２による駆動ＩＣ基板に放熱層をビルトインする方法のフローチャートである。

Claims (2)

  1. 駆動ＩＣ基板に放熱層をビルトインする方法であって：
    フレキシブルベース膜と伝導層を含むフレキシブル回路基板を設ける段階と、
    インターコネクタチップを介してチップを前記伝導層に実装する段階と、を含み、
    前記フレキシブルベース膜はポリイミド層と異方性伝熱層（ＡＣＬ）を備え、
    前記伝導層と前記ＡＣＬは前記ポリイミド層により分離され、
    前記フレキシブル回路基板を設ける段階は：
    前記ポリイミド層を設ける段階；
    異方性伝熱粒子を前記ポリイミド層の表面に積層して熱圧プロセスで前記ＡＣＬを形成し、前記ＡＣＬを前記ポリイミド層と前記ＡＣＬとの間の表面と実質的に垂直な方向に沿って伝導性にする段階；及び
    前記ポリイミド層の他面に前記伝導層を形成する段階を含む、方法。
  2. 前記ＡＣＬはポリイミド（ＰＩ）と前記異方性伝熱粒子からなる、請求項１に記載の方法。
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