JP5398676B2 - コイル埋設型インダクタおよびその製造方法 - Google Patents
コイル埋設型インダクタおよびその製造方法 Download PDFInfo
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- JP5398676B2 JP5398676B2 JP2010208842A JP2010208842A JP5398676B2 JP 5398676 B2 JP5398676 B2 JP 5398676B2 JP 2010208842 A JP2010208842 A JP 2010208842A JP 2010208842 A JP2010208842 A JP 2010208842A JP 5398676 B2 JP5398676 B2 JP 5398676B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 239000000919 ceramic Substances 0.000 claims description 522
- 239000002002 slurry Substances 0.000 claims description 113
- 239000000463 material Substances 0.000 claims description 62
- 239000000843 powder Substances 0.000 claims description 59
- 239000012530 fluid Substances 0.000 claims description 44
- 238000004804 winding Methods 0.000 claims description 43
- 239000002245 particle Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 32
- 238000010304 firing Methods 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 23
- 230000002093 peripheral effect Effects 0.000 claims description 22
- 238000003825 pressing Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 description 19
- 230000007547 defect Effects 0.000 description 13
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- 229910000859 α-Fe Inorganic materials 0.000 description 12
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- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
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- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 4
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- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- YIWGJFPJRAEKMK-UHFFFAOYSA-N 1-(2H-benzotriazol-5-yl)-3-methyl-8-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carbonyl]-1,3,8-triazaspiro[4.5]decane-2,4-dione Chemical compound CN1C(=O)N(c2ccc3n[nH]nc3c2)C2(CCN(CC2)C(=O)c2cnc(NCc3cccc(OC(F)(F)F)c3)nc2)C1=O YIWGJFPJRAEKMK-UHFFFAOYSA-N 0.000 description 3
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 3
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 3
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 3
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
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- 239000010949 copper Substances 0.000 description 3
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- 239000010931 gold Substances 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
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- 238000007747 plating Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- QCXNXRUTKSIZND-UHFFFAOYSA-N 6-(dimethylamino)hexan-1-ol Chemical compound CN(C)CCCCCCO QCXNXRUTKSIZND-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- KOMIMHZRQFFCOR-UHFFFAOYSA-N [Ni].[Cu].[Zn] Chemical compound [Ni].[Cu].[Zn] KOMIMHZRQFFCOR-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- ULDHMXUKGWMISQ-UHFFFAOYSA-N carvone Chemical compound CC(=C)C1CC=C(C)C(=O)C1 ULDHMXUKGWMISQ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- -1 glycerin Chemical compound 0.000 description 2
- 239000001087 glyceryl triacetate Substances 0.000 description 2
- 235000013773 glyceryl triacetate Nutrition 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 229960002622 triacetin Drugs 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000005973 Carvone Substances 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- SWRLHCAIEJHDDS-UHFFFAOYSA-N [Mn].[Cu].[Zn] Chemical compound [Mn].[Cu].[Zn] SWRLHCAIEJHDDS-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- WPKYZIPODULRBM-UHFFFAOYSA-N azane;prop-2-enoic acid Chemical compound N.OC(=O)C=C WPKYZIPODULRBM-UHFFFAOYSA-N 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 125000004185 ester group Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 150000004885 piperazines Chemical class 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
Claims (5)
- 導電性を備えたコイルと、該コイル周りの領域のうち少なくとも該コイルの内周面に沿った領域に配設された第1のセラミック焼成体と、該第1のセラミック焼成体を含む前記コイル全体を包囲するように配設された第2のセラミック焼成体と、を具備するコイル埋設型インダクタの製造方法であって、
導電性を備えたコイルを準備する工程であって、予め定められた値よりも大きい値のピッチで巻回されている巻回部分を備えたコイルを準備することを含む工程と、
該コイル周りの領域のうち少なくとも該コイルの内周面に沿った領域に予め定められた粒径のセラミック粉体を主成分とする第1のセラミックスラリーを配設し、該第1のセラミックスラリーを硬化させて第1のセラミック成形体を形成する工程と、
前記第1のセラミックスラリーを構成するセラミック粉体の粒径よりも小さい粒径のセラミック粉体を主成分とする第2のセラミックスラリーを前記第1のセラミック成形体を含む前記コイル全体を包囲するように配設する工程と、
前記第1のセラミック成形体および前記第2のセラミックスラリーを焼成してそれぞれ第1のセラミック焼成体および第2のセラミック焼成体を形成する工程と、
を具備し、
前記第1のセラミックスラリーを構成するセラミック粉体の粒径よりも小さい粒径のセラミック粉体を主成分とする第3のセラミックスラリーを硬化させてプレート状の2枚のセラミック成形体を作成する工程と、
前記第2のセラミックスラリーを前記第1のセラミック成形体を含む前記コイル全体を包囲するように配設する工程の後であり且つ前記第1のセラミック焼成体および第2のセラミック焼成体を形成する工程の前に、前記第1のセラミック成形体および前記第2のセラミックスラリーと共に前記コイルを前記プレート状の2枚のセラミック成形体の間に配置し、前記第1のセラミック成形体および前記第2のセラミックスラリーと共に前記コイルをその中心軸線に対して平行な方向にその巻回部分間のピッチが前記予め定められた値になるまで前記プレート状の2枚のセラミック成形体によって押圧する工程と、
をさらに具備し、
前記第1のセラミック焼成体および第2のセラミック焼成体を形成する工程が、前記プレート状の2枚のセラミック成形体を焼成して第3のセラミック焼成体を形成する工程を含む、
コイル埋設型インダクタの製造方法。 - 前記コイルの内周面に沿った領域に第1のセラミックスラリーを配設する工程において、前記第1のセラミックスラリーが前記コイルの内周面によって画成される領域全体に配設される請求項1に記載のコイル埋設型インダクタの製造方法。
- 流動性のある材料を前記第2のセラミック焼成体の外壁面上に塗布する工程をさらに具備し、前記第2のセラミック焼成体の気孔率が前記流動性のある材料を該第2のセラミック焼成体の内部に浸透させない気孔率となる粒径のセラミック粉体を主成分とするセラミックスラリーが前記第2のセラミックスラリーとして使用される請求項1または請求項2に記載のコイル埋設型インダクタの製造方法。
- 流動性のある材料を前記第3のセラミック焼成体の外壁面上に塗布する工程をさらに具備し、前記第3のセラミック焼成体の気孔率が前記第2のセラミック焼成体の気孔率と等しくなる粒径のセラミック粉体を主成分とするセラミックスラリーが前記プレート状の2枚のセラミック成形体を形成するために使用される請求項3に記載のコイル埋設型インダクタの製造方法。
- 前記コイルの横断面形状が略矩形である請求項1〜4のいずれか1つに記載のコイル埋設型インダクタの製造方法。
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US12/884,461 US20110121930A1 (en) | 2009-09-24 | 2010-09-17 | Coil-buried type inductor and a method for manufacturing the same |
JP2010208842A JP5398676B2 (ja) | 2009-09-24 | 2010-09-17 | コイル埋設型インダクタおよびその製造方法 |
EP10251615A EP2302647A1 (en) | 2009-09-24 | 2010-09-20 | A coil-buried inductor and a method for manufacturing the same |
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US8512628B2 (en) * | 2009-01-22 | 2013-08-20 | Ngk Insulators, Ltd. | Method for manufacturing a fired ceramic body including a metallic wire inside |
DE102011082046A1 (de) * | 2011-09-02 | 2013-03-07 | Schmidhauser Ag | Transformator und zugehöriges Herstellungsverfahren |
US20150116950A1 (en) * | 2013-10-29 | 2015-04-30 | Samsung Electro-Mechanics Co., Ltd. | Coil component, manufacturing method thereof, coil component-embedded substrate, and voltage adjustment module having the same |
DE102014106851A1 (de) | 2014-05-15 | 2015-11-19 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Elektrische Maschine, Spulenpaket für eine elektrische Maschine und Verfahren zum Herstellen desselben |
DE102014218638A1 (de) * | 2014-09-17 | 2016-03-31 | Siemens Aktiengesellschaft | Herstellen eines Bauteils mit einem Keramikpulverkörper |
JP6565315B2 (ja) * | 2015-05-14 | 2019-08-28 | Tdk株式会社 | コイル部品 |
JP7150579B2 (ja) * | 2018-11-29 | 2022-10-11 | 太陽誘電株式会社 | インダクタンス素子及び電子機器 |
DE102019211439A1 (de) * | 2019-07-31 | 2021-02-04 | Würth Elektronik eiSos Gmbh & Co. KG | Verfahren zur Herstellung eines induktiven Bauteils sowie induktives Bauteil |
JP7480614B2 (ja) | 2020-07-20 | 2024-05-10 | 株式会社村田製作所 | コイル部品の製造方法 |
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US5062197A (en) * | 1988-12-27 | 1991-11-05 | General Electric Company | Dual-permeability core structure for use in high-frequency magnetic components |
US5476728A (en) * | 1992-03-31 | 1995-12-19 | Tdk Corporation | Composite multilayer parts |
JP3251370B2 (ja) * | 1992-03-31 | 2002-01-28 | ティーディーケイ株式会社 | 複合積層部品用非磁性フェライトおよび複合積層部品とその製造方法 |
JP3072455B2 (ja) * | 1994-09-09 | 2000-07-31 | 太陽誘電株式会社 | チップ形インダクタの製造方法 |
TW362222B (en) * | 1995-11-27 | 1999-06-21 | Matsushita Electric Ind Co Ltd | Coiled component and its production method |
US6344271B1 (en) * | 1998-11-06 | 2002-02-05 | Nanoenergy Corporation | Materials and products using nanostructured non-stoichiometric substances |
JPH1140408A (ja) * | 1997-07-18 | 1999-02-12 | Tdk Corp | インダクタンス素子用コア及びその製造方法 |
JP3248463B2 (ja) * | 1997-08-25 | 2002-01-21 | 株式会社村田製作所 | インダクタ及びその製造方法 |
JP3332069B2 (ja) * | 1997-08-25 | 2002-10-07 | 株式会社村田製作所 | インダクタ及びその製造方法 |
JP2001185421A (ja) * | 1998-12-28 | 2001-07-06 | Matsushita Electric Ind Co Ltd | 磁性素子およびその製造方法 |
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JP3449350B2 (ja) * | 2000-11-09 | 2003-09-22 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法及び積層セラミック電子部品 |
JP3654251B2 (ja) * | 2002-01-22 | 2005-06-02 | 松下電器産業株式会社 | コイル部品 |
JP4178004B2 (ja) * | 2002-06-17 | 2008-11-12 | アルプス電気株式会社 | 磁気素子及びインダクタ及びトランス |
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