JP5363746B2 - 切断装置及び切断方法 - Google Patents

切断装置及び切断方法 Download PDF

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Publication number
JP5363746B2
JP5363746B2 JP2008049048A JP2008049048A JP5363746B2 JP 5363746 B2 JP5363746 B2 JP 5363746B2 JP 2008049048 A JP2008049048 A JP 2008049048A JP 2008049048 A JP2008049048 A JP 2008049048A JP 5363746 B2 JP5363746 B2 JP 5363746B2
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JP
Japan
Prior art keywords
groove
cutting
cleaning liquid
grooves
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008049048A
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English (en)
Japanese (ja)
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JP2009202311A (ja
JP2009202311A5 (enExample
Inventor
雅之 山本
秀司 中河原
陽子 中本
秀和 東
真也 中嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2008049048A priority Critical patent/JP5363746B2/ja
Priority to PCT/JP2009/000377 priority patent/WO2009107324A1/ja
Priority to TW098104290A priority patent/TWI451930B/zh
Publication of JP2009202311A publication Critical patent/JP2009202311A/ja
Publication of JP2009202311A5 publication Critical patent/JP2009202311A5/ja
Application granted granted Critical
Publication of JP5363746B2 publication Critical patent/JP5363746B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips
    • B23Q11/005—Devices for removing chips by blowing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Details Of Cutting Devices (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2008049048A 2008-02-29 2008-02-29 切断装置及び切断方法 Active JP5363746B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008049048A JP5363746B2 (ja) 2008-02-29 2008-02-29 切断装置及び切断方法
PCT/JP2009/000377 WO2009107324A1 (ja) 2008-02-29 2009-02-02 切断装置及び切断方法
TW098104290A TWI451930B (zh) 2008-02-29 2009-02-11 Cutting device and cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008049048A JP5363746B2 (ja) 2008-02-29 2008-02-29 切断装置及び切断方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012227358A Division JP2013010180A (ja) 2012-10-12 2012-10-12 切断装置及び切断方法

Publications (3)

Publication Number Publication Date
JP2009202311A JP2009202311A (ja) 2009-09-10
JP2009202311A5 JP2009202311A5 (enExample) 2011-11-04
JP5363746B2 true JP5363746B2 (ja) 2013-12-11

Family

ID=41015731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008049048A Active JP5363746B2 (ja) 2008-02-29 2008-02-29 切断装置及び切断方法

Country Status (3)

Country Link
JP (1) JP5363746B2 (enExample)
TW (1) TWI451930B (enExample)
WO (1) WO2009107324A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5709370B2 (ja) * 2009-11-26 2015-04-30 株式会社ディスコ 切削装置及び切削方法
JP5468886B2 (ja) * 2009-12-02 2014-04-09 アピックヤマダ株式会社 切断装置及び切断方法
DE102010031364A1 (de) * 2010-07-15 2012-01-19 Gebr. Schmid Gmbh & Co. Träger für einen Siliziumblock, Trägeranordnung mit einem solchen Träger und Verfahren zur Herstellung einer solchen Trägeranordnung
JP5627618B2 (ja) * 2012-02-23 2014-11-19 Ｔｏｗａ株式会社 固定治具の製造方法及び固定治具
JP5975703B2 (ja) * 2012-04-09 2016-08-23 株式会社ディスコ 切削装置
JP6143668B2 (ja) * 2013-12-28 2017-06-07 Ｔｏｗａ株式会社 電子部品製造用の切断装置及び切断方法
JP6257360B2 (ja) * 2014-02-04 2018-01-10 株式会社ディスコ ブレードカバー装置
JP6228044B2 (ja) * 2014-03-10 2017-11-08 株式会社ディスコ 板状物の加工方法
JP6338478B2 (ja) * 2014-07-18 2018-06-06 Ｔｏｗａ株式会社 切断方法及び製品の製造方法
KR20170112003A (ko) * 2016-03-30 2017-10-12 동우 화인켐 주식회사 시트형 필름 절단기
CN111266911A (zh) * 2020-03-27 2020-06-12 南京鸿发有色金属制造股份有限公司 一种用于铝型材加工的铝屑回收装置
CN115194840A (zh) * 2022-07-19 2022-10-18 内蒙合成化工研究所 一种绝热层裁剪装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6480506A (en) * 1987-09-24 1989-03-27 Hitachi Ltd Dicer
JPH01101112A (ja) * 1987-10-15 1989-04-19 Sony Corp 半導体ウエハのダイシング方法
JPH04240749A (ja) * 1991-01-25 1992-08-28 Toshiba Corp ダイシング装置
JPH0745562A (ja) * 1993-07-30 1995-02-14 Sony Corp 半導体ウェーハのダイシング方法およびその装置
JP2003309087A (ja) * 2002-04-18 2003-10-31 Towa Corp 基板の切断方法及び装置
JP2004055860A (ja) * 2002-07-22 2004-02-19 Renesas Technology Corp 半導体装置の製造方法
JP4657688B2 (ja) * 2004-11-29 2011-03-23 株式会社ディスコ 切削装置
JP4943688B2 (ja) * 2005-10-21 2012-05-30 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
JP2009202311A (ja) 2009-09-10
TWI451930B (zh) 2014-09-11
WO2009107324A1 (ja) 2009-09-03
TW201000249A (en) 2010-01-01

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