JP4657688B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP4657688B2 JP4657688B2 JP2004343938A JP2004343938A JP4657688B2 JP 4657688 B2 JP4657688 B2 JP 4657688B2 JP 2004343938 A JP2004343938 A JP 2004343938A JP 2004343938 A JP2004343938 A JP 2004343938A JP 4657688 B2 JP4657688 B2 JP 4657688B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- receiving
- cutting waste
- waste
- scraping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims description 275
- 239000002699 waste material Substances 0.000 claims description 154
- 239000002173 cutting fluid Substances 0.000 claims description 75
- 238000007790 scraping Methods 0.000 claims description 59
- 239000000758 substrate Substances 0.000 description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- 230000007246 mechanism Effects 0.000 description 19
- 239000000463 material Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 9
- 238000002507 cathodic stripping potentiometry Methods 0.000 description 7
- 238000007599 discharging Methods 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Landscapes
- Auxiliary Devices For Machine Tools (AREA)
- Dicing (AREA)
- Processing Of Solid Wastes (AREA)
Description
20 切削手段
40 チャックテーブル
68 受止搬送部材
70 受止水切部材
72 飛散防止カバー
74 貫通孔
80 切削屑処理装置
81 切削液回収容器
82 切削屑回収容器
90 掻出部材
92 弾性部材
94 支持部材
96 アーム部材
98 把手
P 切削屑
W 切削液
Claims (1)
- 被加工物を保持するチャックテーブルと,切削ブレードによって前記被加工物を切削する切削手段と,切削屑処理装置とを備えた切削装置であって:
前記切削屑処理装置は,
前記チャックテーブルに隣接して配設され,前記被加工物の切削によって飛散した切削屑及び切削に用いられる切削液を受け止め,前記切削屑及び前記切削液を端部に移動させる受止搬送部材と;
前記受止搬送部材の前記端部から落下した前記切削屑を受け止め,前記切削液を流下させる受止水切部材と;
前記受止水切部材から流下した前記切削液を回収する切削液回収容器と;
前記受止水切部材上に残存する前記切削屑を前記受止水切部材の排出端部側に手動で掻き出すための掻出部材と;
前記掻出部材によって掻き出され,前記受止水切部材の前記排出端部から落下する前記切削屑を回収する切削屑回収容器と;
を備え,
前記受止水切部材の底部には,前記切削液を流下させるための複数の貫通孔が形成されており,前記受止水切部材の底部は,前記排出端部側が上方となるように傾斜しており,
前記掻出部材は,
前記切削屑の掻き出し時に前記受止水切部材の底部と接触する弾性部材と;
前記弾性部材を支持する支持部材と;
一端が前記支持部材と連結され,他端に把手が形成されたアーム部材と;
を備え,
前記弾性部材の下辺は,前記受止水切部材の底部の形状に沿った形状を有し,前記弾性部材の幅は,樋形状を有する前記受止水切部材の内幅と略同一であることを特徴とする,切削装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004343938A JP4657688B2 (ja) | 2004-11-29 | 2004-11-29 | 切削装置 |
CN 200510127038 CN1781657A (zh) | 2004-11-29 | 2005-11-29 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004343938A JP4657688B2 (ja) | 2004-11-29 | 2004-11-29 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006150494A JP2006150494A (ja) | 2006-06-15 |
JP4657688B2 true JP4657688B2 (ja) | 2011-03-23 |
Family
ID=36629383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004343938A Active JP4657688B2 (ja) | 2004-11-29 | 2004-11-29 | 切削装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4657688B2 (ja) |
CN (1) | CN1781657A (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008140981A (ja) * | 2006-12-01 | 2008-06-19 | Disco Abrasive Syst Ltd | 加工装置 |
JP2008147344A (ja) * | 2006-12-08 | 2008-06-26 | Disco Abrasive Syst Ltd | 加工装置 |
JP2009096087A (ja) * | 2007-10-17 | 2009-05-07 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
JP5363746B2 (ja) * | 2008-02-29 | 2013-12-11 | Towa株式会社 | 切断装置及び切断方法 |
JP5779081B2 (ja) * | 2011-12-12 | 2015-09-16 | 株式会社ディスコ | 加工廃液処理装置 |
JP6440309B2 (ja) * | 2015-01-19 | 2018-12-19 | 株式会社ディスコ | 切削装置 |
JP6441704B2 (ja) * | 2015-02-10 | 2018-12-19 | 株式会社ディスコ | 切削装置 |
CN105235084B (zh) * | 2015-09-30 | 2017-07-18 | 浙江辉弘光电能源有限公司 | 一种硅片切割机用切削液去水装置 |
CN106091651B (zh) * | 2016-07-25 | 2018-06-29 | 宿迁陈工机械制造有限公司 | 一种铝屑风送脱水器 |
JP6876586B2 (ja) * | 2017-09-27 | 2021-05-26 | Towa株式会社 | 加工装置 |
JP7034543B2 (ja) * | 2017-10-13 | 2022-03-14 | 株式会社ディスコ | バイト切削装置 |
CN108213589A (zh) * | 2017-12-21 | 2018-06-29 | 昆山万马五金有限公司 | 一种用于五金加工切削装置 |
JP7030606B2 (ja) * | 2018-04-27 | 2022-03-07 | 株式会社ディスコ | 切削装置 |
CN110170661B (zh) * | 2019-04-23 | 2020-05-26 | 精浩精密工业(深圳)有限公司 | 一种车床工件用轴向高精度定位装置 |
JP7448348B2 (ja) * | 2019-12-16 | 2024-03-12 | ファナック株式会社 | 工作機械システム |
CN115319150A (zh) * | 2022-10-18 | 2022-11-11 | 南通世创机械有限公司 | 配电柜加工打孔装置 |
JP2024072619A (ja) * | 2022-11-16 | 2024-05-28 | Towa株式会社 | 切断装置及び切断品の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0381893U (ja) * | 1989-12-13 | 1991-08-21 | ||
JPH0417038U (ja) * | 1990-05-30 | 1992-02-12 | ||
JPH08108339A (ja) * | 1994-10-11 | 1996-04-30 | Van Tekunika:Kk | 加工屑の切削水分離装置 |
JPH10296579A (ja) * | 1997-04-24 | 1998-11-10 | Jatco Corp | 切粉払い出し装置 |
JP2002103177A (ja) * | 2000-09-27 | 2002-04-09 | Disco Abrasive Syst Ltd | 排水装置 |
JP2002130177A (ja) * | 2000-10-30 | 2002-05-09 | Ntn Corp | 磁気浮上型ポンプ |
-
2004
- 2004-11-29 JP JP2004343938A patent/JP4657688B2/ja active Active
-
2005
- 2005-11-29 CN CN 200510127038 patent/CN1781657A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0381893U (ja) * | 1989-12-13 | 1991-08-21 | ||
JPH0417038U (ja) * | 1990-05-30 | 1992-02-12 | ||
JPH08108339A (ja) * | 1994-10-11 | 1996-04-30 | Van Tekunika:Kk | 加工屑の切削水分離装置 |
JPH10296579A (ja) * | 1997-04-24 | 1998-11-10 | Jatco Corp | 切粉払い出し装置 |
JP2002103177A (ja) * | 2000-09-27 | 2002-04-09 | Disco Abrasive Syst Ltd | 排水装置 |
JP2002130177A (ja) * | 2000-10-30 | 2002-05-09 | Ntn Corp | 磁気浮上型ポンプ |
Also Published As
Publication number | Publication date |
---|---|
CN1781657A (zh) | 2006-06-07 |
JP2006150494A (ja) | 2006-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4657688B2 (ja) | 切削装置 | |
JP4754912B2 (ja) | 切削装置 | |
JP4943688B2 (ja) | 切削装置 | |
JP4868764B2 (ja) | 半導体ウエーハの電極加工装置 | |
JP2007083392A (ja) | シンギュレーション装置 | |
US6354285B1 (en) | Attachment for a dicing saw | |
JP4880267B2 (ja) | 切削装置 | |
CN115485099B (zh) | 机床的微细切屑处理装置 | |
JP2003168659A (ja) | 高圧洗浄ノズルを有するシンギュレーション装置 | |
JP2019188552A (ja) | 切削装置 | |
JP5984565B2 (ja) | 加工装置の排気ダクトアセンブリ | |
JP4769601B2 (ja) | 研削装置 | |
JP2006305646A (ja) | 工作機の加工屑及び加工液の排出装置 | |
JP4295496B2 (ja) | 蛇腹機構および蛇腹機構を備えた切断装置 | |
JP2005305563A (ja) | 切削装置 | |
JP4408332B2 (ja) | 切断機 | |
JP4656285B2 (ja) | 切削装置 | |
JP2006123030A (ja) | 高圧液噴射式切断装置 | |
JP6746208B2 (ja) | 切削装置 | |
JP4625715B2 (ja) | 切削装置 | |
JP2004273696A (ja) | 切断装置 | |
JP2008004620A (ja) | 切削装置 | |
JP2002326136A (ja) | 切粉処理用特殊カバー | |
JP2014159068A (ja) | 切削装置 | |
JP6173174B2 (ja) | 切削装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071012 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100824 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100826 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101022 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20101214 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20101222 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140107 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4657688 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140107 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |