JP7034543B2 - バイト切削装置 - Google Patents
バイト切削装置 Download PDFInfo
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- JP7034543B2 JP7034543B2 JP2017199538A JP2017199538A JP7034543B2 JP 7034543 B2 JP7034543 B2 JP 7034543B2 JP 2017199538 A JP2017199538 A JP 2017199538A JP 2017199538 A JP2017199538 A JP 2017199538A JP 7034543 B2 JP7034543 B2 JP 7034543B2
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- cleaning liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
- B28D7/046—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Description
4 基台
4a,4b 開口
6 支持構造
8 搬送ユニット
10a,10b カセット
12 センタリング機構
14 搬入ユニット
16 X軸移動テーブル
18a テーブルカバー
18b 防塵防滴カバー
20 チャックテーブル
22 Z軸移動ユニット
24 Z軸ガイドレール
26 Z軸移動プレート
28 Z軸ボールネジ
30 Z軸パルスモータ
32 バイト切削ユニット
34 スピンドルハウジング
36 スピンドル
38 バイトホイール
40 切り刃(バイト)
42 搬出ユニット
44 洗浄ユニット
46 操作パネル
52 カバー
52a 加工室
54 洗浄ノズル
56 排出管
56a 一端
56b 他端
58 回収層
60 捕獲部材
62 台車
64 ダクト
66 吸引ユニット
68 吸引源
70 第1吸引路
72 分離機
72a 分離室
74 障壁(邪魔板)
76 第2吸引路
78 扉
80 開閉機構
11 被加工物
13 ウェーハ
15 封止層
17 保護部材
21 洗浄液(液体)
23 加工屑
25 混合物
Claims (2)
- 被加工物を保持する保持面を有するチャックテーブルと、
切り刃を有し該保持面に垂直な回転軸の下端に装着されるバイトホイールを回転させて該チャックテーブルに保持された被加工物を上面側から切削するバイト切削ユニットと、
該チャックテーブルに保持された被加工物の上面側に洗浄液を供給する洗浄ノズルと、
該チャックテーブルと該バイトホイールと該洗浄ノズルとを収容する加工室から該洗浄液と加工屑とを含む雰囲気を吸引して排出する吸引ユニットと、
該加工室内で落下する該洗浄液及び該加工屑を該加工室外に排出する排出管と、
該排出管を通じて該加工室外に排出される該洗浄液及び該加工屑を受け入れ、該加工屑を捕獲するネット状の捕獲部材と、
該吸引ユニット及び該排出管に対して該捕獲部材を移動させることができるように支持する台車と、を備え、
該吸引ユニットは、
一端側が該加工室に接続される第1吸引路と、
該第1吸引路の他端側に接続され、該加工室から排出される該雰囲気から該洗浄液及び該加工屑を分離する分離室と、
一端側が該分離室に接続され、他端側が吸引源に接続される第2吸引路と、
該分離室の底部に設けられ、該分離室で分離された該洗浄液及び該加工屑を上部に溜めることのできる扉と、
該扉を開閉することにより、該扉の該上部に溜まった該洗浄液及び該加工屑を落下させて該分離室外に排出する開閉機構と、を含み、
該開閉機構は、該扉を所定のタイミングで開閉することにより、該所定のタイミングを除く期間において、該分離室の底部から該第2吸引路への該分離室外の雰囲気の流入を制限し、
該捕獲部材は、該排出管を通じて該加工室外に排出される該洗浄液及び該加工屑とともに、該扉から落下して該分離室外に排出される該洗浄液及び該加工屑を受け入れることを特徴とするバイト切削装置。 - 該捕獲部材を通過した該洗浄液が溜まる底を有する回収層を更に備え、
該捕獲部材は、該回収層の該底から所定の高さの位置に設けられており、該回収層とともに該台車に支持されていることを特徴とする請求項1に記載のバイト切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017199538A JP7034543B2 (ja) | 2017-10-13 | 2017-10-13 | バイト切削装置 |
KR1020180119045A KR102580973B1 (ko) | 2017-10-13 | 2018-10-05 | 바이트 절삭 장치 |
TW107135334A TWI766110B (zh) | 2017-10-13 | 2018-10-08 | 切削刀具切削裝置 |
CN201811176879.XA CN109664414B (zh) | 2017-10-13 | 2018-10-10 | 刀具切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017199538A JP7034543B2 (ja) | 2017-10-13 | 2017-10-13 | バイト切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019072786A JP2019072786A (ja) | 2019-05-16 |
JP7034543B2 true JP7034543B2 (ja) | 2022-03-14 |
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Application Number | Title | Priority Date | Filing Date |
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JP2017199538A Active JP7034543B2 (ja) | 2017-10-13 | 2017-10-13 | バイト切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7034543B2 (ja) |
KR (1) | KR102580973B1 (ja) |
CN (1) | CN109664414B (ja) |
TW (1) | TWI766110B (ja) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003025181A (ja) | 2001-07-10 | 2003-01-29 | Olympus Optical Co Ltd | 加工機の排気機構 |
JP2004001118A (ja) | 2002-05-31 | 2004-01-08 | Disco Abrasive Syst Ltd | 粉塵処理装置および粉塵処理装置を装備した加工機 |
CN201524935U (zh) | 2009-11-11 | 2010-07-14 | 乳源东阳光精箔有限公司 | 一种金属屑回收器及其排料机 |
WO2011121853A1 (ja) | 2010-03-31 | 2011-10-06 | 株式会社仲田コーティング | 廃棄物回収装置を備えた機械加工装置及び被加工物の機械加工方法 |
CN202061472U (zh) | 2010-11-24 | 2011-12-07 | 王清富 | 一种气液屑分离装置 |
JP2014018942A (ja) | 2012-07-23 | 2014-02-03 | Disco Abrasive Syst Ltd | バイト切削装置 |
JP2014034069A (ja) | 2012-08-07 | 2014-02-24 | Disco Abrasive Syst Ltd | 加工装置の排気ダクト |
JP2014087744A (ja) | 2012-10-30 | 2014-05-15 | Nikuni Corp | 濾過装置 |
JP2014233796A (ja) | 2013-06-03 | 2014-12-15 | 株式会社ディスコ | 加工装置 |
WO2017130710A1 (ja) | 2016-01-29 | 2017-08-03 | 株式会社フジキン | 加工用液の回収システムおよび回収方法 |
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-
2017
- 2017-10-13 JP JP2017199538A patent/JP7034543B2/ja active Active
-
2018
- 2018-10-05 KR KR1020180119045A patent/KR102580973B1/ko active IP Right Grant
- 2018-10-08 TW TW107135334A patent/TWI766110B/zh active
- 2018-10-10 CN CN201811176879.XA patent/CN109664414B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003025181A (ja) | 2001-07-10 | 2003-01-29 | Olympus Optical Co Ltd | 加工機の排気機構 |
JP2004001118A (ja) | 2002-05-31 | 2004-01-08 | Disco Abrasive Syst Ltd | 粉塵処理装置および粉塵処理装置を装備した加工機 |
CN201524935U (zh) | 2009-11-11 | 2010-07-14 | 乳源东阳光精箔有限公司 | 一种金属屑回收器及其排料机 |
WO2011121853A1 (ja) | 2010-03-31 | 2011-10-06 | 株式会社仲田コーティング | 廃棄物回収装置を備えた機械加工装置及び被加工物の機械加工方法 |
CN202061472U (zh) | 2010-11-24 | 2011-12-07 | 王清富 | 一种气液屑分离装置 |
JP2014018942A (ja) | 2012-07-23 | 2014-02-03 | Disco Abrasive Syst Ltd | バイト切削装置 |
JP2014034069A (ja) | 2012-08-07 | 2014-02-24 | Disco Abrasive Syst Ltd | 加工装置の排気ダクト |
JP2014087744A (ja) | 2012-10-30 | 2014-05-15 | Nikuni Corp | 濾過装置 |
JP2014233796A (ja) | 2013-06-03 | 2014-12-15 | 株式会社ディスコ | 加工装置 |
WO2017130710A1 (ja) | 2016-01-29 | 2017-08-03 | 株式会社フジキン | 加工用液の回収システムおよび回収方法 |
Also Published As
Publication number | Publication date |
---|---|
CN109664414B (zh) | 2022-12-16 |
CN109664414A (zh) | 2019-04-23 |
TW201914736A (zh) | 2019-04-16 |
KR102580973B1 (ko) | 2023-09-20 |
KR20190041916A (ko) | 2019-04-23 |
TWI766110B (zh) | 2022-06-01 |
JP2019072786A (ja) | 2019-05-16 |
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