JP5359263B2 - 電気電子部品封止用樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体 - Google Patents

電気電子部品封止用樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体 Download PDF

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JP5359263B2
JP5359263B2 JP2008332431A JP2008332431A JP5359263B2 JP 5359263 B2 JP5359263 B2 JP 5359263B2 JP 2008332431 A JP2008332431 A JP 2008332431A JP 2008332431 A JP2008332431 A JP 2008332431A JP 5359263 B2 JP5359263 B2 JP 5359263B2
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resin
resin composition
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acid
adhesion strength
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JP2010150471A (ja
JP2010150471A5 (enExample
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大樹 舩岡
光生 西田
健治 志賀
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Toyobo Co Ltd
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Toyobo Co Ltd
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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
JP2008332431A 2008-12-26 2008-12-26 電気電子部品封止用樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体 Active JP5359263B2 (ja)

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JP2008332431A JP5359263B2 (ja) 2008-12-26 2008-12-26 電気電子部品封止用樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体

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JP2008332431A JP5359263B2 (ja) 2008-12-26 2008-12-26 電気電子部品封止用樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体

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JP2010150471A5 JP2010150471A5 (enExample) 2012-02-02
JP5359263B2 true JP5359263B2 (ja) 2013-12-04

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Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI530528B (zh) * 2011-02-23 2016-04-21 東洋紡績股份有限公司 Resin composition for electrical and electronic component packaging, manufacturing method of electrical and electronic parts, and electrical and electronic component package
TWI530530B (zh) 2011-03-17 2016-04-21 東洋紡績股份有限公司 Polyester resin composition, package and method for manufacturing the same for electrical and electronic parts
CN103764756A (zh) * 2011-08-30 2014-04-30 东洋纺株式会社 电气电子零部件密封用树脂组合物、电气电子零部件密封体的制造方法和电气电子零部件密封体
JP2013112771A (ja) * 2011-11-30 2013-06-10 Toyobo Co Ltd 電気電子部品封止用樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体
JP2013112772A (ja) * 2011-11-30 2013-06-10 Toyobo Co Ltd 電気電子部品封止用樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体
WO2013179874A1 (ja) * 2012-05-28 2013-12-05 東洋紡株式会社 電気電子部品封止用樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体
JP6069714B2 (ja) * 2012-08-29 2017-02-01 東洋紡株式会社 電気電子部品封止用樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体
JP6183083B2 (ja) * 2012-09-13 2017-08-23 東洋紡株式会社 金属被覆用樹脂組成物
JP6183082B2 (ja) * 2012-09-13 2017-08-23 東洋紡株式会社 金属被覆用樹脂組成物
JP2015042722A (ja) * 2013-01-08 2015-03-05 ユニチカ株式会社 共重合ポリエステル樹脂組成物
WO2014185325A1 (ja) * 2013-05-16 2014-11-20 東洋紡株式会社 電気電子部品の封止方法及び封止体
JP7151940B1 (ja) * 2021-02-03 2022-10-12 住友ベークライト株式会社 封止用樹脂組成物および半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6274955A (ja) * 1985-09-30 1987-04-06 Unitika Ltd 封止用ポリエステル樹脂組成物
JPH078944B2 (ja) * 1985-11-12 1995-02-01 ユニチカ株式会社 封止用ポリエステル樹脂組成物
JP4277174B2 (ja) * 2003-03-06 2009-06-10 東洋紡績株式会社 樹脂組成物
JP4277175B2 (ja) * 2003-03-07 2009-06-10 東洋紡績株式会社 樹脂組成物及び接着剤
JP4752184B2 (ja) * 2004-03-10 2011-08-17 東洋紡績株式会社 樹脂組成物およびそれを用いた接着剤

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