JP5357749B2 - 高周波数回路用途において有用なポリイミド系組成物を調製する方法 - Google Patents

高周波数回路用途において有用なポリイミド系組成物を調製する方法 Download PDF

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Publication number
JP5357749B2
JP5357749B2 JP2009502810A JP2009502810A JP5357749B2 JP 5357749 B2 JP5357749 B2 JP 5357749B2 JP 2009502810 A JP2009502810 A JP 2009502810A JP 2009502810 A JP2009502810 A JP 2009502810A JP 5357749 B2 JP5357749 B2 JP 5357749B2
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Prior art keywords
polyimide
dianhydride
bis
dispersant
titanate
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JP2009532521A (ja
JP2009532521A5 (https=
Inventor
カナカラジャン カーティケヤン
カナカラジャン クプサミー
ヨンガン ミン ゲアリー
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2009502810A 2006-03-31 2007-03-01 高周波数回路用途において有用なポリイミド系組成物を調製する方法 Active JP5357749B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/395,735 US20070232734A1 (en) 2006-03-31 2006-03-31 Polyimide based compositions useful in high frequency circuitry applications and methods relating thereto
US11/395,735 2006-03-31
PCT/US2007/005461 WO2007117372A1 (en) 2006-03-31 2007-03-01 Process for preparing polyimide based compositions useful in high frequency circuitry applications

Publications (3)

Publication Number Publication Date
JP2009532521A JP2009532521A (ja) 2009-09-10
JP2009532521A5 JP2009532521A5 (https=) 2010-04-22
JP5357749B2 true JP5357749B2 (ja) 2013-12-04

Family

ID=38197818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009502810A Active JP5357749B2 (ja) 2006-03-31 2007-03-01 高周波数回路用途において有用なポリイミド系組成物を調製する方法

Country Status (4)

Country Link
US (2) US20070232734A1 (https=)
EP (1) EP2001942A1 (https=)
JP (1) JP5357749B2 (https=)
WO (1) WO2007117372A1 (https=)

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CN107721189A (zh) * 2017-10-19 2018-02-23 嘉兴学院 高介电常数二氧化锆纳米晶体/聚酰亚胺复合薄膜及其制备方法

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TW201037035A (en) * 2009-04-01 2010-10-16 Microcosm Technology Co Ltd Polyimide film having sheltering property and application thereof and preparation method thereof
KR101064816B1 (ko) * 2009-04-03 2011-09-14 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판
KR101101347B1 (ko) * 2010-04-06 2012-01-02 한국세라믹기술원 무소결 ｍｉｍ 커패시터 및 그 제조 방법
JP5636224B2 (ja) * 2010-08-06 2014-12-03 三井金属鉱業株式会社 フィラー含有樹脂層付金属箔及びフィラー含有樹脂層付金属箔の製造方法
US8853723B2 (en) 2010-08-18 2014-10-07 E. I. Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
US8969909B2 (en) 2010-08-18 2015-03-03 E I Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
JP5517162B2 (ja) 2010-09-22 2014-06-11 インターナショナル・ビジネス・マシーンズ・コーポレーション 文書情報の機密ラベルを判定する方法、コンピュータ・プログラム、装置、及びシステム
TW201302858A (zh) * 2011-06-24 2013-01-16 Du Pont 有色聚醯亞胺膜及與其有關之方法
US8673462B2 (en) 2011-09-02 2014-03-18 International Business Machines Corporation Low viscosity electrostatic discharge (ESD) dissipating adhesive substantially free of agglomerates
JP5905739B2 (ja) * 2012-02-27 2016-04-20 京セラ株式会社 コンデンサ
JP2013182908A (ja) * 2012-02-29 2013-09-12 Kyocera Corp コンデンサ
JP2013189568A (ja) * 2012-03-14 2013-09-26 Du Pont-Toray Co Ltd グラファイト粉体含有高熱伝導性ポリイミドフィルム
CN103454609B (zh) * 2013-09-11 2015-10-07 国家电网公司 一种容性设备在线监测装置调试平台
WO2015048065A1 (en) 2013-09-26 2015-04-02 Polyone Corporation Preparation of imide oligomers via concurrent reactive extrusion
CN105579492B (zh) * 2013-09-26 2017-10-27 普立万公司 适用于3d打印工艺的芳族聚酰亚胺
US9326373B2 (en) * 2014-04-09 2016-04-26 Finisar Corporation Aluminum nitride substrate
CN104023505A (zh) * 2014-06-13 2014-09-03 江苏悦达新材料科技有限公司 一种高导热石墨膜的制备方法
EP3367402B1 (en) * 2015-10-21 2021-07-07 Toray Industries, Inc. Capacitor, method for manufacturing same, and wireless communication device using same
CN108912680A (zh) * 2018-06-27 2018-11-30 桂林电器科学研究院有限公司 含有钛白粉的黑色亚光聚酰亚胺薄膜及其制备方法
KR102153506B1 (ko) * 2018-07-18 2020-09-09 피아이첨단소재 주식회사 점토 입자 및 카본 블랙을 포함하는 폴리이미드 필름 및 이의 제조방법
DE102018009686A1 (de) * 2018-11-30 2020-06-04 KlEFEL GmbH Hochfrequenz-Planartransformator mit einem ultrapermittiven Dielektrikum
WO2022126647A1 (zh) * 2020-12-18 2022-06-23 清华大学 一种高温储能杂化聚醚酰亚胺介电薄膜及其制备方法与应用
CN113603887B (zh) * 2021-09-02 2023-01-17 大同共聚(西安)科技有限公司 一种钛酸钡与聚酰亚胺杂化材料的制备方法
CN113831735B (zh) * 2021-11-17 2022-09-16 桂林电器科学研究院有限公司 一种低黑度聚酰亚胺遮光膜及其制备方法
CN114213790A (zh) * 2021-12-31 2022-03-22 南京清研新材料研究院有限公司 一种光配向聚酰亚胺组合物及其制备工艺
CN114989469A (zh) * 2022-05-19 2022-09-02 乌镇实验室 一种具有高温储能性能的三层pei柔性复合薄膜及其制备方法
CN118421084B (zh) * 2024-05-08 2025-03-14 武汉大学 超分子介电聚合物材料、其制备方法及应用

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107721189A (zh) * 2017-10-19 2018-02-23 嘉兴学院 高介电常数二氧化锆纳米晶体/聚酰亚胺复合薄膜及其制备方法
CN107721189B (zh) * 2017-10-19 2019-09-27 嘉兴学院 高介电常数二氧化锆纳米晶体/聚酰亚胺复合薄膜及其制备方法

Also Published As

Publication number Publication date
WO2007117372A1 (en) 2007-10-18
JP2009532521A (ja) 2009-09-10
US20090242823A1 (en) 2009-10-01
US20070232734A1 (en) 2007-10-04
WO2007117372A9 (en) 2010-06-10
EP2001942A1 (en) 2008-12-17

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