JP5348531B2 - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP5348531B2
JP5348531B2 JP2009015380A JP2009015380A JP5348531B2 JP 5348531 B2 JP5348531 B2 JP 5348531B2 JP 2009015380 A JP2009015380 A JP 2009015380A JP 2009015380 A JP2009015380 A JP 2009015380A JP 5348531 B2 JP5348531 B2 JP 5348531B2
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Japan
Prior art keywords
polishing
head
polished
polishing pad
pad
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JP2009015380A
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Japanese (ja)
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JP2010172975A (ja
JP2010172975A5 (enExample
Inventor
直樹 浅田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
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Nikon Corp
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Priority to JP2009015380A priority Critical patent/JP5348531B2/ja
Publication of JP2010172975A publication Critical patent/JP2010172975A/ja
Publication of JP2010172975A5 publication Critical patent/JP2010172975A5/ja
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Publication of JP5348531B2 publication Critical patent/JP5348531B2/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2009015380A 2009-01-27 2009-01-27 研磨装置 Active JP5348531B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009015380A JP5348531B2 (ja) 2009-01-27 2009-01-27 研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009015380A JP5348531B2 (ja) 2009-01-27 2009-01-27 研磨装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013173167A Division JP2013230556A (ja) 2013-08-23 2013-08-23 研磨装置

Publications (3)

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JP2010172975A JP2010172975A (ja) 2010-08-12
JP2010172975A5 JP2010172975A5 (enExample) 2012-11-29
JP5348531B2 true JP5348531B2 (ja) 2013-11-20

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ID=42704420

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JP2009015380A Active JP5348531B2 (ja) 2009-01-27 2009-01-27 研磨装置

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JP (1) JP5348531B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101799497B1 (ko) * 2016-07-13 2017-11-20 주식회사 케이씨 화학 기계적 연마 장치
JP6544694B2 (ja) * 2017-01-12 2019-07-17 株式会社応用科学研究所 研磨装置
CN113414680B (zh) * 2021-07-12 2022-08-26 金兴利节能科技(广东)有限公司 一种宝石盖板加工工艺及专用研磨机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936070A (ja) * 1995-07-21 1997-02-07 Nippon Steel Corp 半導体ウエハの研磨装置
JPH09193003A (ja) * 1996-01-16 1997-07-29 Nippon Steel Corp 研磨装置
JPH10551A (ja) * 1996-06-07 1998-01-06 Canon Inc 化学機械研磨装置
JPH10552A (ja) * 1996-06-07 1998-01-06 Canon Inc 化学機械研磨装置
JPH11285968A (ja) * 1998-04-01 1999-10-19 Nikon Corp 研磨方法及び研磨装置
JP2000084842A (ja) * 1998-09-14 2000-03-28 Speedfam-Ipec Co Ltd 鏡面研磨方法
JP2001018169A (ja) * 1999-07-07 2001-01-23 Ebara Corp 研磨装置
JP2001239457A (ja) * 2000-02-24 2001-09-04 Ebara Corp ポリッシング装置

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JP2010172975A (ja) 2010-08-12

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