JP5343326B2 - 基板接合装置および基板接合方法 - Google Patents

基板接合装置および基板接合方法 Download PDF

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Publication number
JP5343326B2
JP5343326B2 JP2007141592A JP2007141592A JP5343326B2 JP 5343326 B2 JP5343326 B2 JP 5343326B2 JP 2007141592 A JP2007141592 A JP 2007141592A JP 2007141592 A JP2007141592 A JP 2007141592A JP 5343326 B2 JP5343326 B2 JP 5343326B2
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wafers
substrate
camera
stage
substrates
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JP2008300394A (ja
JP2008300394A5 (enExample
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正博 吉橋
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Nikon Corp
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Nikon Corp
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JP2007141592A 2007-05-29 2007-05-29 基板接合装置および基板接合方法 Active JP5343326B2 (ja)

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JP2013162400A Division JP2014003312A (ja) 2013-08-05 2013-08-05 基板接合装置および基板接合方法

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JP2008300394A JP2008300394A (ja) 2008-12-11
JP2008300394A5 JP2008300394A5 (enExample) 2011-06-02
JP5343326B2 true JP5343326B2 (ja) 2013-11-13

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5971083B2 (ja) * 2012-11-02 2016-08-17 株式会社島津製作所 基板検出装置及び基板検出方法
WO2014144533A1 (en) * 2013-03-15 2014-09-18 Applied Materials, Inc. Position and temperature monitoring of ald platen susceptor
JP6103043B2 (ja) * 2013-04-17 2017-03-29 株式会社島津製作所 基板処理システム
JP6114629B2 (ja) 2013-05-27 2017-04-12 東京エレクトロン株式会社 回転可能状態検出装置及び回転可能状態検出方法、並びにこれを用いた基板処理装置及び基板処理方法
KR102247826B1 (ko) * 2014-06-27 2021-05-03 엘지디스플레이 주식회사 표시장치용 경화 장비 및 이를 이용한 접착물질의 경화 방법
JP6362466B2 (ja) * 2014-07-24 2018-07-25 株式会社Ｓｃｒｅｅｎホールディングス 基板保持検査方法および基板処理装置
WO2017115684A1 (ja) * 2015-12-28 2017-07-06 株式会社ニコン 基板貼り合わせ装置および基板貼り合わせ方法
KR101879376B1 (ko) * 2016-05-13 2018-07-20 크루셜머신즈 주식회사 프로브핀 레이저 본딩 장치 및 방법
DE102016122486A1 (de) * 2016-11-22 2018-05-24 Snaptrack, Inc. Vorrichtung und Verfahren zur Verbindung zweier Substrate für ein elektrisches Bauelement
WO2020147964A1 (de) * 2019-01-18 2020-07-23 Ev Group E. Thallner Gmbh Messeinrichtung und verfahren zur ermittlung des verlaufs einer bondwelle
EP3968359A4 (en) * 2019-05-08 2023-01-25 Tokyo Electron Limited CONNECTION DEVICE, CONNECTION SYSTEM AND CONNECTION METHOD

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217216A (ja) * 2001-01-22 2002-08-02 Fuji Photo Film Co Ltd 部品のボンディング方法および装置
JP2003282819A (ja) * 2002-03-27 2003-10-03 Seiko Epson Corp 半導体装置の製造方法
US7442476B2 (en) * 2004-12-27 2008-10-28 Asml Netherlands B.V. Method and system for 3D alignment in wafer scale integration

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