JP5340789B2 - 電子装置及びその製造方法 - Google Patents

電子装置及びその製造方法 Download PDF

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Publication number
JP5340789B2
JP5340789B2 JP2009091956A JP2009091956A JP5340789B2 JP 5340789 B2 JP5340789 B2 JP 5340789B2 JP 2009091956 A JP2009091956 A JP 2009091956A JP 2009091956 A JP2009091956 A JP 2009091956A JP 5340789 B2 JP5340789 B2 JP 5340789B2
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semiconductor device
electrode
sealing resin
electrode pad
electronic component
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JP2009091956A
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Japanese (ja)
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JP2010245259A (ja
JP2010245259A5 (enExample
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健太 内山
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2009091956A priority Critical patent/JP5340789B2/ja
Priority to US12/753,170 priority patent/US8174109B2/en
Publication of JP2010245259A publication Critical patent/JP2010245259A/ja
Publication of JP2010245259A5 publication Critical patent/JP2010245259A5/ja
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    • H10W70/614—
    • H10W70/09—
    • H10W70/095—
    • H10W70/635—
    • H10W72/0198—
    • H10W74/016—
    • H10W74/114—
    • H10W74/117—
    • H10W90/00—
    • H10W70/093—
    • H10W70/099—
    • H10W72/073—
    • H10W72/552—
    • H10W72/874—
    • H10W72/9413—
    • H10W74/00—
    • H10W74/019—
    • H10W74/142—
    • H10W74/15—
    • H10W90/10—
    • H10W90/20—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2009091956A 2009-04-06 2009-04-06 電子装置及びその製造方法 Active JP5340789B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009091956A JP5340789B2 (ja) 2009-04-06 2009-04-06 電子装置及びその製造方法
US12/753,170 US8174109B2 (en) 2009-04-06 2010-04-02 Electronic device and method of manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009091956A JP5340789B2 (ja) 2009-04-06 2009-04-06 電子装置及びその製造方法

Publications (3)

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JP2010245259A JP2010245259A (ja) 2010-10-28
JP2010245259A5 JP2010245259A5 (enExample) 2012-05-31
JP5340789B2 true JP5340789B2 (ja) 2013-11-13

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US (1) US8174109B2 (enExample)
JP (1) JP5340789B2 (enExample)

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JP5330065B2 (ja) 2009-04-13 2013-10-30 新光電気工業株式会社 電子装置及びその製造方法
JP5732839B2 (ja) * 2010-12-13 2015-06-10 住友ベークライト株式会社 半導体素子封止体の製造方法および半導体パッケージの製造方法
JP5732838B2 (ja) * 2010-12-13 2015-06-10 住友ベークライト株式会社 半導体素子封止体の製造方法および半導体パッケージの製造方法
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JP5780228B2 (ja) * 2011-11-11 2015-09-16 住友ベークライト株式会社 半導体装置の製造方法
US8623711B2 (en) * 2011-12-15 2014-01-07 Stats Chippac Ltd. Integrated circuit packaging system with package-on-package and method of manufacture thereof
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US9768048B2 (en) * 2013-03-15 2017-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Package on-package structure
KR101999114B1 (ko) * 2013-06-03 2019-07-11 에스케이하이닉스 주식회사 반도체 패키지
US9711485B1 (en) * 2014-02-04 2017-07-18 Amkor Technology, Inc. Thin bonded interposer package
JP2015195263A (ja) * 2014-03-31 2015-11-05 マイクロン テクノロジー， インク． 半導体装置及びその製造方法
US9236355B2 (en) * 2014-04-17 2016-01-12 Apple Inc. EMI shielded wafer level fan-out pop package
US9859265B2 (en) * 2014-06-06 2018-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and methods of forming the same
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US10257937B2 (en) * 2014-07-07 2019-04-09 Infineon Technologies Austria Ag Device for electrically coupling a plurality of semiconductor device layers by a common conductive layer
US9691726B2 (en) * 2014-07-08 2017-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for forming fan-out package structure
US9601464B2 (en) 2014-07-10 2017-03-21 Apple Inc. Thermally enhanced package-on-package structure
US10109593B2 (en) 2015-07-23 2018-10-23 Apple Inc. Self shielded system in package (SiP) modules
US20170098589A1 (en) * 2015-10-05 2017-04-06 Mediatek Inc. Fan-out wafer level package structure
US9721903B2 (en) 2015-12-21 2017-08-01 Apple Inc. Vertical interconnects for self shielded system in package (SiP) modules
JP6713289B2 (ja) * 2016-01-28 2020-06-24 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP2018018936A (ja) * 2016-07-27 2018-02-01 イビデン株式会社 配線基板
US10784220B2 (en) * 2017-03-30 2020-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer
US10074604B1 (en) * 2017-04-28 2018-09-11 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated fan-out package and method of fabricating the same
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Publication number Publication date
US20100252937A1 (en) 2010-10-07
JP2010245259A (ja) 2010-10-28
US8174109B2 (en) 2012-05-08

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