JP5326435B2 - エポキシ樹脂組成物、プリプレグ、および、繊維強化複合材料、ならびに、繊維強化複合材料の製造方法 - Google Patents

エポキシ樹脂組成物、プリプレグ、および、繊維強化複合材料、ならびに、繊維強化複合材料の製造方法 Download PDF

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Publication number
JP5326435B2
JP5326435B2 JP2008221069A JP2008221069A JP5326435B2 JP 5326435 B2 JP5326435 B2 JP 5326435B2 JP 2008221069 A JP2008221069 A JP 2008221069A JP 2008221069 A JP2008221069 A JP 2008221069A JP 5326435 B2 JP5326435 B2 JP 5326435B2
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epoxy resin
cured
resin composition
composite material
reinforced composite
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Japanese (ja)
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JP2010053278A (ja
JP2010053278A5 (enrdf_load_stackoverflow
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隆行 藤原
伸之 富岡
史郎 本田
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Toray Industries Inc
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Toray Industries Inc
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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
JP2008221069A 2008-08-29 2008-08-29 エポキシ樹脂組成物、プリプレグ、および、繊維強化複合材料、ならびに、繊維強化複合材料の製造方法 Active JP5326435B2 (ja)

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JP2008221069A JP5326435B2 (ja) 2008-08-29 2008-08-29 エポキシ樹脂組成物、プリプレグ、および、繊維強化複合材料、ならびに、繊維強化複合材料の製造方法

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JP2008221069A JP5326435B2 (ja) 2008-08-29 2008-08-29 エポキシ樹脂組成物、プリプレグ、および、繊維強化複合材料、ならびに、繊維強化複合材料の製造方法

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JP2010053278A JP2010053278A (ja) 2010-03-11
JP2010053278A5 JP2010053278A5 (enrdf_load_stackoverflow) 2011-05-19
JP5326435B2 true JP5326435B2 (ja) 2013-10-30

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2961624B1 (fr) 2010-06-16 2014-11-28 Commissariat Energie Atomique Joint d'interface solide a porosite ouverte pour crayon de combustible nucleaire et pour barre de commande nucleaire
FR2961623B1 (fr) * 2010-06-16 2013-08-30 Commissariat Energie Atomique Joint d'interface solide a porosite ouverte pour crayon de combustible nucleaire et pour barre de commande nucleaire
BR112013009345A2 (pt) * 2010-11-08 2015-04-22 Toray Industries Composição de resina epóxi, prepreg, material compósito reforçado com fibra e método de fabricação.
TWI621639B (zh) * 2013-01-07 2018-04-21 東麗股份有限公司 環氧樹脂組成物及預浸漬物
US10316159B2 (en) 2015-09-17 2019-06-11 Toray Industries, Inc. Epoxy resin composition, prepreg, and fiber reinforced material
TWI755591B (zh) 2018-04-10 2022-02-21 南韓商Ｌｇ化學股份有限公司 用於半導體封裝的樹脂組成物、使用其之預浸體及金屬包覆積層板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287130A (ja) * 1988-02-05 1989-11-17 Mitsubishi Rayon Co Ltd 複合材料用エポキシ樹脂組成物
JP3216291B2 (ja) * 1993-01-13 2001-10-09 東邦テナックス株式会社 難燃性エポキシ樹脂組成物及びプリプレグ

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