JP5322480B2 - フラットパネルディスプレイガラス基板エッチング装置 - Google Patents
フラットパネルディスプレイガラス基板エッチング装置 Download PDFInfo
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- JP5322480B2 JP5322480B2 JP2008099488A JP2008099488A JP5322480B2 JP 5322480 B2 JP5322480 B2 JP 5322480B2 JP 2008099488 A JP2008099488 A JP 2008099488A JP 2008099488 A JP2008099488 A JP 2008099488A JP 5322480 B2 JP5322480 B2 JP 5322480B2
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- JP
- Japan
- Prior art keywords
- glass substrate
- etching
- flat panel
- jig
- panel display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Robotics (AREA)
- Surface Treatment Of Glass (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Weting (AREA)
Description
20 ガラス基板、
11 ガラス基板固定手段、
12 進行ライン、
13 噴射手段、
15 前面固定ピン
32 進行ライン、
54 ノズル。
Claims (5)
- フラットパネルディスプレイ用ガラス基板が多数付着するジグと、
前記ジグに具備されたガラス基板固定手段と、
前記ジグをエッチング装置の中に移送する少なくとも一つの進行ラインと、
前記ガラス基板の両側にエッチング液を噴射する噴射手段と、
前記ガラス基板を装着した前記ジグと前記噴射手段とが配置されるチャンバと、
前記チャンバに連結され、当該チャンバを揺する駆動部と、を含み、
前記ガラス基板に与えられる前記エッチング液の圧力は、0.1kg/cm2以上0.5kg/cm2未満であり、
前記噴射手段と前記ガラス基板との距離は、100mm超過150mm以下であることを特徴とするフラットパネルディスプレイ用ガラス基板のエッチング装置。 - 前記噴射手段は、前記ガラス基板に対してスイングするノズルであることを特徴とする請求項1に記載のフラットパネルディスプレイ用ガラス基板のエッチング装置。
- 前記エッチング液は、フッ酸、燐酸及び硝酸の混合液であることを特徴とする請求項1または請求項2に記載のフラットパネルディスプレイ用ガラス基板のエッチング装置。
- 前記ガラス基板固定手段は、基板のエッチング液を噴射される側の反対面である後面に設けられる後面固定ピンと、
基板のエッチング液を噴射される側である前面に設けられる回転可能な前面固定ピンと、を含むことを特徴とする請求項1〜3のいずれか1項に記載のフラットパネルディスプレイ用ガラス基板のエッチング装置。 - 前記前面固定ピンおよび前記後面固定ピンの間は、両側に設けられた磁石により脱付着可能であることを特徴とする請求項4に記載のフラットパネルディスプレイ用ガラス基板のエッチング装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070035108A KR101387711B1 (ko) | 2007-04-10 | 2007-04-10 | 평판디스플레이 유리기판 에칭장치 |
KR10-2007-0035108 | 2007-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008266135A JP2008266135A (ja) | 2008-11-06 |
JP5322480B2 true JP5322480B2 (ja) | 2013-10-23 |
Family
ID=40046155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008099488A Active JP5322480B2 (ja) | 2007-04-10 | 2008-04-07 | フラットパネルディスプレイガラス基板エッチング装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090039054A1 (ja) |
JP (1) | JP5322480B2 (ja) |
KR (1) | KR101387711B1 (ja) |
CN (1) | CN101286445B (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101353490B1 (ko) * | 2006-07-20 | 2014-01-27 | 에프엔에스테크 주식회사 | 기판 처리장치 |
KR20080009579A (ko) * | 2006-07-24 | 2008-01-29 | 삼성전자주식회사 | 식각 장치 및 방법 |
DE102007026635B4 (de) * | 2007-06-06 | 2010-07-29 | Atotech Deutschland Gmbh | Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware |
KR20090008945A (ko) * | 2007-07-19 | 2009-01-22 | 삼성전자주식회사 | 기판 식각 장치 |
KR100946215B1 (ko) * | 2009-08-17 | 2010-03-08 | 주식회사 지디 | 글라스 식각용 분사 노즐 시스템 |
JP2011197194A (ja) * | 2010-03-18 | 2011-10-06 | Tekurabo:Kk | フラットパネルディスプレイの製造方法 |
JP5383769B2 (ja) | 2011-10-13 | 2014-01-08 | 株式会社Nsc | 枚葉式化学研磨装置 |
KR101304103B1 (ko) * | 2011-10-17 | 2013-09-05 | 호서대학교 산학협력단 | 초박형 글래스판 제조 방법 |
JP5334216B2 (ja) | 2011-10-28 | 2013-11-06 | 株式会社Nsc | ガラス基板の製造方法 |
JP5317304B2 (ja) | 2012-01-31 | 2013-10-16 | 株式会社Nsc | 化学研磨装置 |
CN104321465B (zh) * | 2012-02-10 | 2017-05-03 | 迪勒公司 | 化学蚀刻不锈钢板的机器和方法 |
JP5340457B1 (ja) | 2012-06-06 | 2013-11-13 | 株式会社Nsc | 化学研磨装置 |
JP5518133B2 (ja) | 2012-06-14 | 2014-06-11 | 株式会社Nsc | 化学研磨装置 |
CN102786227B (zh) * | 2012-07-27 | 2015-12-16 | 京东方科技集团股份有限公司 | 一种玻璃面板支撑装置及玻璃面板减薄设备 |
CN102941627B (zh) * | 2012-11-15 | 2015-04-08 | 江西赛维Ldk太阳能高科技有限公司 | 一种微孔平板的应用方法、及微孔玻璃的制备方法 |
US9736956B2 (en) * | 2013-03-12 | 2017-08-15 | Samsung Electronics Co., Ltd. | Electronic device having display module |
CN103774147B (zh) * | 2013-12-30 | 2017-02-22 | 天津市德中技术发展有限公司 | 一种喷头组在蚀刻区做往复运动的蚀刻方法及装置 |
KR101673417B1 (ko) * | 2015-07-14 | 2016-11-07 | 에스피텍 주식회사 | 두께 편차를 최소화한 초박형 유리의 제조방법 |
TWI725112B (zh) | 2016-01-29 | 2021-04-21 | 美商康寧公司 | 用於薄化玻璃的方法 |
WO2018020531A1 (ja) * | 2016-07-27 | 2018-02-01 | 株式会社 電硝エンジニアリング | ガラス基板の研磨方法および研磨装置 |
WO2018138836A1 (ja) * | 2017-01-26 | 2018-08-02 | 株式会社 電硝エンジニアリング | ディスプレイ用電子基板の製造方法、ディスプレイ用電子基板の研磨方法および研磨装置 |
CN110272210A (zh) * | 2018-03-16 | 2019-09-24 | 康宁股份有限公司 | 产生防眩光表面的方法和设备 |
CN109879600B (zh) * | 2019-04-24 | 2024-05-07 | 合肥伟仕泰克电子材料有限公司 | 一种玻璃减薄治具 |
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US6630052B1 (en) * | 1996-06-26 | 2003-10-07 | Lg. Philips Lcd Co., Ltd. | Apparatus for etching glass substrate |
KR0180850B1 (ko) * | 1996-06-26 | 1999-03-20 | 구자홍 | 유리기판 에칭장치 |
JPH10110281A (ja) * | 1996-10-03 | 1998-04-28 | Asahi Denka Kogyo Kk | 金属酸化物薄膜のエッチング方法 |
KR19980046071U (ko) * | 1996-12-27 | 1998-09-25 | 김연혁 | 인쇄회로기판의 에칭액 분사장치 |
JP3395696B2 (ja) * | 1999-03-15 | 2003-04-14 | 日本電気株式会社 | ウェハ処理装置およびウェハ処理方法 |
KR20010021299A (ko) * | 1999-08-14 | 2001-03-15 | 조셉 제이. 스위니 | 스크루버에서의 후면부 에칭 |
US6673195B2 (en) * | 2001-03-30 | 2004-01-06 | Industrial Technologies Research Institute | Apparatus and method for etching glass panels |
JP2005239546A (ja) * | 2001-04-12 | 2005-09-08 | Nishiyama Stainless Chem Kk | ガラス基板の化学加工方法 |
JP2005247687A (ja) * | 2001-04-12 | 2005-09-15 | Nishiyama Stainless Chem Kk | ガラス基板の化学加工方法 |
JP3980941B2 (ja) * | 2002-06-04 | 2007-09-26 | 東京エレクトロン株式会社 | 基板処理装置 |
JP3665323B2 (ja) | 2002-11-22 | 2005-06-29 | 西山ステンレスケミカル株式会社 | フラットパネルディスプレイ用ガラス基板及びその製造方法 |
US7611758B2 (en) * | 2003-11-06 | 2009-11-03 | Tokyo Electron Limited | Method of improving post-develop photoresist profile on a deposited dielectric film |
KR100630809B1 (ko) * | 2004-06-03 | 2006-10-02 | 송기훈 | 평판 디스플레이용 유리기판의 외면삭감장치 |
KR101353490B1 (ko) * | 2006-07-20 | 2014-01-27 | 에프엔에스테크 주식회사 | 기판 처리장치 |
JP4215170B2 (ja) * | 2007-01-25 | 2009-01-28 | 株式会社テスコム | ガラスパネル削減平坦化方法及びガラスパネル削減平坦化装置 |
KR20090008945A (ko) * | 2007-07-19 | 2009-01-22 | 삼성전자주식회사 | 기판 식각 장치 |
-
2007
- 2007-04-10 KR KR1020070035108A patent/KR101387711B1/ko active IP Right Grant
-
2008
- 2008-04-07 JP JP2008099488A patent/JP5322480B2/ja active Active
- 2008-04-10 US US12/100,793 patent/US20090039054A1/en not_active Abandoned
- 2008-04-10 CN CN2008100921862A patent/CN101286445B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR101387711B1 (ko) | 2014-04-23 |
CN101286445B (zh) | 2011-07-06 |
CN101286445A (zh) | 2008-10-15 |
JP2008266135A (ja) | 2008-11-06 |
US20090039054A1 (en) | 2009-02-12 |
KR20080091957A (ko) | 2008-10-15 |
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