JP5318840B2 - 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体 - Google Patents

異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体 Download PDF

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Publication number
JP5318840B2
JP5318840B2 JP2010250143A JP2010250143A JP5318840B2 JP 5318840 B2 JP5318840 B2 JP 5318840B2 JP 2010250143 A JP2010250143 A JP 2010250143A JP 2010250143 A JP2010250143 A JP 2010250143A JP 5318840 B2 JP5318840 B2 JP 5318840B2
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JP
Japan
Prior art keywords
containing layer
conductive film
anisotropic conductive
conductive particle
degrees
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2010250143A
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English (en)
Japanese (ja)
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JP2011026619A (ja
Inventor
美佐夫 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2010250143A priority Critical patent/JP5318840B2/ja
Publication of JP2011026619A publication Critical patent/JP2011026619A/ja
Priority to TW100140668A priority patent/TWI494956B/zh
Priority to PCT/JP2011/075688 priority patent/WO2012063804A1/ja
Priority to KR1020127032181A priority patent/KR20130124155A/ko
Priority to CN201180023154.7A priority patent/CN102906941B/zh
Priority to HK13104860.4A priority patent/HK1177332A1/zh
Application granted granted Critical
Publication of JP5318840B2 publication Critical patent/JP5318840B2/ja
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2010250143A 2010-11-08 2010-11-08 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体 Expired - Fee Related JP5318840B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2010250143A JP5318840B2 (ja) 2010-11-08 2010-11-08 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体
TW100140668A TWI494956B (zh) 2010-11-08 2011-11-08 An anisotropic conductive film, an anisotropic conductive film manufacturing method, a connection method between electronic members, and a connection structure
PCT/JP2011/075688 WO2012063804A1 (ja) 2010-11-08 2011-11-08 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体
KR1020127032181A KR20130124155A (ko) 2010-11-08 2011-11-08 이방성 도전 필름, 이방성 도전 필름의 제조 방법, 전자 부재 사이의 접속 방법 및 접속 구조체
CN201180023154.7A CN102906941B (zh) 2010-11-08 2011-11-08 各向异性导电膜及其制造方法、电子部件之间的连接方法以及连接结构体
HK13104860.4A HK1177332A1 (zh) 2010-11-08 2013-04-22 各向異性導電膜及其製造方法、電子部件之間的連接方法以及連接結構體

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010250143A JP5318840B2 (ja) 2010-11-08 2010-11-08 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体

Publications (2)

Publication Number Publication Date
JP2011026619A JP2011026619A (ja) 2011-02-10
JP5318840B2 true JP5318840B2 (ja) 2013-10-16

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JP2010250143A Expired - Fee Related JP5318840B2 (ja) 2010-11-08 2010-11-08 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体

Country Status (6)

Country Link
JP (1) JP5318840B2 (zh)
KR (1) KR20130124155A (zh)
CN (1) CN102906941B (zh)
HK (1) HK1177332A1 (zh)
TW (1) TWI494956B (zh)
WO (1) WO2012063804A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6119718B2 (ja) * 2013-11-19 2017-04-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
JP2015135878A (ja) * 2014-01-16 2015-07-27 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法、異方性導電接着剤
JP6324746B2 (ja) * 2014-02-03 2018-05-16 デクセリアルズ株式会社 接続体、接続体の製造方法、電子機器
CN107851490B (zh) * 2015-08-20 2019-08-20 株式会社村田制作所 弹性导电体
JP7511420B2 (ja) 2020-09-11 2024-07-05 信越ポリマー株式会社 自己融着テープ携行体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128206A (en) * 1979-03-27 1980-10-03 Toray Industries Method of fabricating anisotropic conductive rubber sheet
JPH0334282U (zh) * 1989-08-11 1991-04-04
JP3034282U (ja) * 1996-08-01 1997-02-14 信越ポリマー株式会社 ヒートシールコネクター
DE69738298T2 (de) * 1996-08-08 2008-09-18 Nitto Denko Corp., Ibaraki Anisotropische, leitende folie und ihr herstellungsverfahren
JP3208658B2 (ja) * 1997-03-27 2001-09-17 株式会社アドバンスト・ディスプレイ 電気光学素子の製法
JP2003200279A (ja) * 2001-10-24 2003-07-15 Seiko Epson Corp 基板の電気配線切断方法及びその装置、並びに電子デバイスの製造方法及びその装置
JP4333140B2 (ja) * 2003-01-08 2009-09-16 日立化成工業株式会社 接着剤テープの製造方法
TW200823137A (en) * 2002-07-30 2008-06-01 Hitachi Chemical Co Ltd Joining structure and adhesive material reel
CN101512840A (zh) * 2006-08-29 2009-08-19 日立化成工业株式会社 各向异性导电带及其制造方法以及使用其的连接结构体和电路部件的连接方法

Also Published As

Publication number Publication date
KR20130124155A (ko) 2013-11-13
CN102906941A (zh) 2013-01-30
WO2012063804A1 (ja) 2012-05-18
TWI494956B (zh) 2015-08-01
TW201236029A (en) 2012-09-01
HK1177332A1 (zh) 2013-08-16
JP2011026619A (ja) 2011-02-10
CN102906941B (zh) 2015-11-25

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