HK1177332A1 - 各向異性導電膜及其製造方法、電子部件之間的連接方法以及連接結構體 - Google Patents

各向異性導電膜及其製造方法、電子部件之間的連接方法以及連接結構體

Info

Publication number
HK1177332A1
HK1177332A1 HK13104860.4A HK13104860A HK1177332A1 HK 1177332 A1 HK1177332 A1 HK 1177332A1 HK 13104860 A HK13104860 A HK 13104860A HK 1177332 A1 HK1177332 A1 HK 1177332A1
Authority
HK
Hong Kong
Prior art keywords
connection
production
conductive film
electronic components
same
Prior art date
Application number
HK13104860.4A
Other languages
English (en)
Inventor
小西美佐夫
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1177332A1 publication Critical patent/HK1177332A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
HK13104860.4A 2010-11-08 2013-04-22 各向異性導電膜及其製造方法、電子部件之間的連接方法以及連接結構體 HK1177332A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010250143A JP5318840B2 (ja) 2010-11-08 2010-11-08 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体
PCT/JP2011/075688 WO2012063804A1 (ja) 2010-11-08 2011-11-08 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体

Publications (1)

Publication Number Publication Date
HK1177332A1 true HK1177332A1 (zh) 2013-08-16

Family

ID=43635692

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13104860.4A HK1177332A1 (zh) 2010-11-08 2013-04-22 各向異性導電膜及其製造方法、電子部件之間的連接方法以及連接結構體

Country Status (6)

Country Link
JP (1) JP5318840B2 (zh)
KR (1) KR20130124155A (zh)
CN (1) CN102906941B (zh)
HK (1) HK1177332A1 (zh)
TW (1) TWI494956B (zh)
WO (1) WO2012063804A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6119718B2 (ja) * 2013-11-19 2017-04-26 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
JP2015135878A (ja) * 2014-01-16 2015-07-27 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法、異方性導電接着剤
EP3306621B1 (en) * 2015-08-20 2020-01-29 Murata Manufacturing Co., Ltd. Elastic conductor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128206A (en) * 1979-03-27 1980-10-03 Toray Industries Method of fabricating anisotropic conductive rubber sheet
JPH0334282U (zh) * 1989-08-11 1991-04-04
JP3034282U (ja) * 1996-08-01 1997-02-14 信越ポリマー株式会社 ヒートシールコネクター
WO1998007216A1 (fr) * 1996-08-08 1998-02-19 Nitto Denko Corporation Film conducteur anisotrope et procede de fabrication
JP3208658B2 (ja) * 1997-03-27 2001-09-17 株式会社アドバンスト・ディスプレイ 電気光学素子の製法
JP2003200279A (ja) * 2001-10-24 2003-07-15 Seiko Epson Corp 基板の電気配線切断方法及びその装置、並びに電子デバイスの製造方法及びその装置
JP4333140B2 (ja) * 2003-01-08 2009-09-16 日立化成工業株式会社 接着剤テープの製造方法
KR100953011B1 (ko) * 2002-07-30 2010-04-14 히다치 가세고교 가부시끼가이샤 접착제 테이프의 제조방법
CN101512840A (zh) * 2006-08-29 2009-08-19 日立化成工业株式会社 各向异性导电带及其制造方法以及使用其的连接结构体和电路部件的连接方法

Also Published As

Publication number Publication date
KR20130124155A (ko) 2013-11-13
CN102906941A (zh) 2013-01-30
JP2011026619A (ja) 2011-02-10
CN102906941B (zh) 2015-11-25
TW201236029A (en) 2012-09-01
TWI494956B (zh) 2015-08-01
WO2012063804A1 (ja) 2012-05-18
JP5318840B2 (ja) 2013-10-16

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