JP5318773B2 - 剥離液組成物、それを用いた樹脂層の剥離方法 - Google Patents
剥離液組成物、それを用いた樹脂層の剥離方法 Download PDFInfo
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- JP5318773B2 JP5318773B2 JP2009538171A JP2009538171A JP5318773B2 JP 5318773 B2 JP5318773 B2 JP 5318773B2 JP 2009538171 A JP2009538171 A JP 2009538171A JP 2009538171 A JP2009538171 A JP 2009538171A JP 5318773 B2 JP5318773 B2 JP 5318773B2
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- ZAQJHHRNXZUBTE-WUJLRWPWSA-N D-xylulose Chemical compound OC[C@@H](O)[C@H](O)C(=O)CO ZAQJHHRNXZUBTE-WUJLRWPWSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- 206010056474 Erythrosis Diseases 0.000 description 1
- 229930091371 Fructose Natural products 0.000 description 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- LKDRXBCSQODPBY-AMVSKUEXSA-N L-(-)-Sorbose Chemical compound OCC1(O)OC[C@H](O)[C@@H](O)[C@@H]1O LKDRXBCSQODPBY-AMVSKUEXSA-N 0.000 description 1
- WQZGKKKJIJFFOK-VSOAQEOCSA-N L-altropyranose Chemical compound OC[C@@H]1OC(O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-VSOAQEOCSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- PYMYPHUHKUWMLA-LMVFSUKVSA-N Ribose Natural products OC[C@@H](O)[C@@H](O)[C@@H](O)C=O PYMYPHUHKUWMLA-LMVFSUKVSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- HMFHBZSHGGEWLO-UHFFFAOYSA-N alpha-D-Furanose-Ribose Natural products OCC1OC(O)C(O)C1O HMFHBZSHGGEWLO-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 230000001548 androgenic effect Effects 0.000 description 1
- PYMYPHUHKUWMLA-WDCZJNDASA-N arabinose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)C=O PYMYPHUHKUWMLA-WDCZJNDASA-N 0.000 description 1
- JCXKHYLLVKZPKE-UHFFFAOYSA-N benzotriazol-1-amine Chemical compound C1=CC=C2N(N)N=NC2=C1 JCXKHYLLVKZPKE-UHFFFAOYSA-N 0.000 description 1
- 229940114055 beta-resorcylic acid Drugs 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 description 1
- 229940043276 diisopropanolamine Drugs 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- KVFVBPYVNUCWJX-UHFFFAOYSA-M ethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)C KVFVBPYVNUCWJX-UHFFFAOYSA-M 0.000 description 1
- FBPFZTCFMRRESA-GUCUJZIJSA-N galactitol Chemical compound OC[C@H](O)[C@@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-GUCUJZIJSA-N 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 125000002951 idosyl group Chemical class C1([C@@H](O)[C@H](O)[C@@H](O)[C@H](O1)CO)* 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- BJHIKXHVCXFQLS-PQLUHFTBSA-N keto-D-tagatose Chemical compound OC[C@@H](O)[C@H](O)[C@H](O)C(=O)CO BJHIKXHVCXFQLS-PQLUHFTBSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- DLEZVOPJBSAAGW-UHFFFAOYSA-N methyl benzotriazole-1-carboxylate Chemical compound C1=CC=C2N(C(=O)OC)N=NC2=C1 DLEZVOPJBSAAGW-UHFFFAOYSA-N 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 150000002772 monosaccharides Chemical class 0.000 description 1
- XVHLHUNZWRKZPF-UHFFFAOYSA-N n-[(4-methylbenzotriazol-1-yl)methyl]-n-propan-2-ylpropan-2-amine Chemical compound C1=CC=C2N(CN(C(C)C)C(C)C)N=NC2=C1C XVHLHUNZWRKZPF-UHFFFAOYSA-N 0.000 description 1
- RUFMRRIYNIOMBR-UHFFFAOYSA-N n-ethyl-n-[(4-methylbenzotriazol-1-yl)methyl]ethanamine Chemical compound C1=CC=C2N(CN(CC)CC)N=NC2=C1C RUFMRRIYNIOMBR-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- FIABMSNMLZUWQH-UHFFFAOYSA-N propyl 2-methoxyacetate Chemical compound CCCOC(=O)COC FIABMSNMLZUWQH-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- HEBKCHPVOIAQTA-ZXFHETKHSA-N ribitol Chemical compound OC[C@H](O)[C@H](O)[C@H](O)CO HEBKCHPVOIAQTA-ZXFHETKHSA-N 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- WYXIGTJNYDDFFH-UHFFFAOYSA-Q triazanium;borate Chemical compound [NH4+].[NH4+].[NH4+].[O-]B([O-])[O-] WYXIGTJNYDDFFH-UHFFFAOYSA-Q 0.000 description 1
- WUUHFRRPHJEEKV-UHFFFAOYSA-N tripotassium borate Chemical compound [K+].[K+].[K+].[O-]B([O-])[O-] WUUHFRRPHJEEKV-UHFFFAOYSA-N 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Detergent Compositions (AREA)
- Paints Or Removers (AREA)
Description
R2 3−aN−(R1OH)a (1)
で表される化合物である。ここでaは、1〜3の整数を表し、R1は、アルキレン基、オキサアルキレン基を表し、aが2以上の場合に、複数のR1は、互いに同一でも異なっていてもよい。アルキレン基としては、好ましくは炭素数1〜12の直鎖、分岐または環状アルキレンであり、特に炭素数1〜8の直鎖または分岐状アルキレンが好ましい。オキサアルキレン基としては、−(CH2CH2O)m−CH2CH2−(mは、1〜6、好ましくは1〜3)で表される基が好ましい。
−(CH2CH2O)m−CH2CH2−
(但し、mは、1〜6、好ましくは1〜3、特に好ましくは1)、および
−(OCH2CH2)p−
(但し、pは、1〜6、好ましくは1〜3、特に好ましくは1)
で表される基が好ましい。また、式(2)中のフェニル基は、無置換でも、例えば前述の置換基を有していてもよい。
シリコンウエハー上にポジ型フォトレジストを1μmの層厚で塗布し、90℃で1分間プレベークを行なった。これをフォトマスクを介して露光し、水酸化テトラメチルアンモニウム(TMAH)に60秒間浸漬して現像を行なった。これを100℃で2分間ポストベークを行なった。これをドライエッチング処理し、試験片とした。これを70℃の剥離液組成物に10分間浸漬し、純水で水洗した後、表面状態を走査型電子顕微鏡(SEM)で観察した。
A:残渣が確認できなかったもの、
B:残渣が僅かに確認されたもの、
C:残渣が多量に確認されたもの。
素ガラス上にネガ型感光性着色樹脂を2μmの層厚で塗布し、ホットプレートを用いて90℃で1分間プレベークした後、高圧水銀ランプを用いて200mjの露光量で露光した。これをホットプレートにより200℃で30分間で熱硬化し、試験片とした。これを70℃の剥離液組成物に10分間浸漬し、純水で水洗した後、表面状態を走査型電子顕微鏡(SEM)で観察した。
A:残渣が確認できなかったもの、
B:残渣が僅かに確認されたもの、
C:残渣が多量に確認されたもの。
AlおよびCuが、それぞれ1μmの膜厚で成膜されたシリコン基板を、70℃の剥離液組成物に30分間浸漬し、イソプロピルアルコール(IPA)および純水の順にリンスを行い、処理前後の膜厚から腐食速度を算出し、SEMにより表面状態の観察も行なった。
A:腐食速度が1nm/分より小さいもの、
B:腐食速度が1nm/分以上で10nm/分より小さいもの、
C:腐食速度が10nm/分以上、またはSEMにて腐食が観察されたもの。
表1に示す組成により剥離液組成物を作製し、剥離試験および腐食試験を行なった。なお、表中のMEAはモノエタノールアミンを、MIPAはモノイソプロパノールアミンを、TEAはトリエタノールアミンをBAはベンジルアルコールを、FAはフェネチルアルコールを、NMPはN−メチルピロリドンを、DMSOはジメチルスルホキシド、TMAHは水酸化テトラメチルアンモニウムを表す。また、括弧内の数字は、剥離液組成物全体に対する質量%である。
表3に示す組成により剥離液組成物を調製した以外は、実施例1と同様にして剥離液組成物を作製し、剥離試験および腐食性試験を行なった。評価結果を表4に示す。
Claims (16)
- 樹脂層を剥離するために使用され、
アルカノールアミン類、芳香族アルコール類および防食剤の組み合わせを含み、前記芳香族アルコール類が、炭素数1〜4のアルキル基、炭素数1〜4のアルコキシ基、ハロゲンおよびNO 2 から選ばれる置換基を有していてもよいフェニル基と、アルコール性OH基とを有する化合物であることを特徴とする剥離液組成物。 - 式(2)中のフェニル基が無置換であることを特徴とする請求項2記載の剥離液組成物。
- さらに水を含むことを特徴とする請求項1〜3のいずれか1項に記載の剥離液組成物。
- 前記水の含有量が、15重量%以上であることを特徴とする請求項4記載の剥離液組成物。
- 前記アルカノールアミン類は、モノエタノールアミン、イソプロパノールアミン、ジエタノールアミン、トリエタノールアミンおよび2−(2−アミノエトキシ)エタノールからなる群より選ばれる少なくとも1種類を含む請求項1〜5のいずれか1項に記載の剥離液組成物。
- 前記芳香族アルコール類は、ベンジルアルコールおよびフェネチルアルコールからなる群より選ばれる少なくとも1種類を含む請求項1〜6のいずれか1項に記載の剥離液組成物。
- 前記防食剤は、ベンゾトリアゾール系化合物、芳香族ヒドロキシ化合物、メルカプト基含有化合物、糖類、ホウ酸およびその塩、ケイ酸塩からなる群より選ばれる少なくとも1種類を含む請求項1〜7のいずれか1項に記載の剥離液組成物。
- 前記アルカノールアミン類の前記剥離液組成物に占める割合は5〜70質量%であり、
前記芳香族アルコール類の前記剥離液組成物に占める割合は5〜80質量%であり、
前記防食剤の前記剥離液組成物に占める割合は0.01〜10質量%であり、
前記水の前記剥離液組成物に占める割合は0〜60質量%である請求項1〜8のいずれか1項に記載の剥離液組成物。 - 前記樹脂層は、カラーフィルター層、フォトレジスト層およびオーバーコート層、樹脂スペーサー層、配向膜層からなる群より選ばれる少なくとも1種類の層を含む請求項1〜9のいずれか1項に記載の剥離液組成物。
- 前記樹脂層は、金属類を含む部材上に形成された層である請求項1〜10のいずれか1項に記載の剥離液組成物。
- 前記金属は、CuおよびAlの少なくとも一方を含む金属である請求項11記載の剥離液組成物。
- 前記部材は、配線、反射膜および遮光層からなる群より選ばれる請求項11記載の剥離液組成物。
- 前記樹脂層は、ポジ型またはネガ型フォトレジスト層である請求項10記載の剥離液組成物。
- 請求項1〜14のいずれか1項に記載の剥離液組成物を樹脂層に接触させる工程を有する樹脂層の剥離方法。
- 請求項15の剥離方法を1工程として有する製造方法により製造された製造物。
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JP2012018982A (ja) * | 2010-07-06 | 2012-01-26 | Tosoh Corp | レジスト剥離剤及びそれを用いた剥離法 |
KR101089211B1 (ko) * | 2010-12-02 | 2011-12-02 | 엘티씨 (주) | 1차 알칸올 아민을 포함하는 lcd 제조용 포토레지스트 박리액 조성물 |
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KR20100077023A (ko) | 2010-07-06 |
JPWO2009051237A1 (ja) | 2011-03-03 |
CN101878452A (zh) | 2010-11-03 |
CN101878452B (zh) | 2015-01-07 |
KR101286777B1 (ko) | 2013-07-17 |
WO2009051237A1 (ja) | 2009-04-23 |
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