JP5291631B2 - ガラス状炭素材料とその製造方法 - Google Patents
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Description
金型キャビティを備える金型を提供する工程と、
熱分解消失性3次元繊維メッシュ、例えば、天然繊維および/または合成繊維で形成されたメッシュであって、実質的な空隙量、例えばメッシュの全体積の少なくとも15%である空隙量を含むメッシュ(ここで、メッシュの全体積とは、メッシュの繊維量とメッシュ構造内の空隙量との合計である)を、前記金型キャビティ内に配置する工程と、
重合性前駆体樹脂材料および重合触媒を金型キャビティ内に導入し、重合性前駆体樹脂材料および重合触媒が3次元メッシュに浸透し、かつ重合を引き起こすことにより、金型キャビティ内に、3次元繊維メッシュを内包する硬質ポリマー材料を形成する工程と、
前記硬質ポリマー材料を、好ましくは不活性雰囲気下で、高温で熱分解させ、熱分解消失性3次元メッシュを取り除き、無欠陥ガラス状炭素材料を得る工程。
[0054] ガラス状炭素材料は、従来技術に従った以下の手順で作製された。
[0060] 本発明の例示的な実施形態に係るガラス状炭素材料を、以下の手順で作製した。
[0064] 本発明は、10mmを超える厚さのガラス状炭素を製造することが不可能であった従来技術における極端な寸法上の制約の無い、無欠陥特徴を有するガラス状炭素材料を提供する。本発明の製造方法は、上記値を十分に超えた厚さで、無欠陥材料を製造することを可能とする。結果として、本発明は、大型ガラス状炭素物品を製造する従来の試みを困難とさせたひび割れ、穴、欠損、および他の欠陥により達成不可能であった構造用途向けの大型ガラス状炭素体の製造を可能とする。
Claims (40)
- 無欠陥ガラス状炭素材料を製造する方法であって、
金型キャビティを備える金型を提供する工程と、
前記金型キャビティ内に、熱分解消失性3次元繊維メッシュを配置する工程と、
重合性前駆体樹脂材料および重合触媒を前記金型キャビティ内に導入する工程であって、前記重合性前駆体樹脂材料および前記重合触媒が前記3次元繊維メッシュに浸透し、かつ重合を引き起こすことにより、金型キャビティ内に、前記3次元繊維メッシュを内包する硬質ポリマー材料を形成する工程と、
前記硬質ポリマー材料を高温で熱分解させ、前記熱分解消失性3次元繊維メッシュを取り除いて、前記無欠陥ガラス状炭素材料を得る工程と、
を含み、前記ガラス状炭素材料の空隙率が0.05未満である、方法。 - 前記熱分解は、不活性ガス環境下で行われる、請求項1に記載の方法。
- 前記熱分解は、前記金型キャビティ内で行われる、請求項1に記載の方法。
- 前記熱分解は、前記硬質ポリマー材料を前記金型キャビティから取り出した後に行われる、請求項1に記載の方法。
- 前記前駆体樹脂材料は、フルフリルアルコールを含む、請求項1に記載の方法。
- 前記前駆体樹脂材料は、フルフリルアルコールと他の炭素形成材料とを含む、請求項1に記載の方法。
- 前記重合触媒は、酸塩化物を含む、請求項1に記載の方法。
- 前記3次元繊維メッシュは、0.5より大きい空隙量を有する、請求項1に記載の方法。
- 前記3次元繊維メッシュは、99.5%より大きい空隙量を有し、該空隙量は、前記3次元繊維メッシュの繊維量と該3次元繊維メッシュの構造内の空隙量との合計である全体積に対する該3次元繊維メッシュの構造内の空隙量の割合を示す、請求項1に記載の方法。
- 前記3次元繊維メッシュは、天然繊維および合成繊維のうち少なくとも一方を含む、請求項1に記載の方法。
- 前記3次元繊維メッシュは、織物構造および不織物構造のうち少なくとも一方を含む、請求項1に記載の方法。
- 前記3次元繊維メッシュの2本の隣接する繊維間の平均距離は、5mm未満である、請求項1に記載の方法。
- 前記3次元繊維メッシュの2本の隣接する繊維間の平均距離は、3mm未満である、請求項1に記載の方法。
- 前記3次元繊維メッシュの2本の隣接する繊維間の平均距離は、1mm未満である、請求項1に記載の方法。
- 前記3次元繊維メッシュの2本の隣接する繊維間の平均距離は、0.5mm未満である、請求項1に記載の方法。
- 前記3次元繊維メッシュの繊維は、その内部の複数の接点で相互結合されている、請求項1に記載の方法。
- 前記3次元繊維メッシュは、2つ以上の材料からなる繊維を含む、請求項1に記載の方法。
- 前記3次元繊維メッシュは、10〜0.0001g/cm−3の範囲の密度を有する、請求項1に記載の方法。
- 前記3次元繊維メッシュは、1〜0.001mmの範囲の平均直径を有する繊維を含む、請求項1に記載の方法。
- 前記3次元繊維メッシュは、前記重合性前駆体樹脂および重合触媒が前記金型キャビティ内に導入される前の前記金型キャビティに形状が適合する、請求項1に記載の方法。
- 前記高温は、400℃より高い、請求項1に記載の方法。
- 前記前駆体樹脂材料は、0.01〜90重量パーセントのフィラー材をさらに含む、請求項1に記載の方法。
- 前記フィラー材は、黒鉛粉末、黒鉛繊維、炭素粉末、カーボンナノチューブ、金属繊維、金属粉末、金属合金繊維、金属合金粉末、半導体繊維、半導体粉末、半導体金属合金、半導体金属粉末、絶縁体材料、ケイ素青銅合金、銅合金、石英、ケイ素、アルミナ、シリカ、モリブデン、硫化モリブデン、亜鉛、硫化亜鉛、無金属フタロシアニン、銅、ニッケル、鋼、クロム、クロムめっき鋼、および、これらの組み合わせから成る群から選択される材料を含む、請求項22に記載の方法。
- 無欠陥ガラス状炭素材料を製造する方法であって、
熱分解消失性3次元繊維メッシュに重合性樹脂を浸透させる工程と、
前記重合性樹脂を硬化させる工程と、
前記メッシュを含む硬化樹脂を熱分解させ、前記メッシュを蒸発させて取り除き、前記硬化樹脂をガラス化させて前記無欠陥ガラス状炭素材料を得る工程と、
を含み、前記熱分解消失性3次元繊維メッシュの量が、得られるガラス状炭素材料の空隙率が0.05未満となるように選択される、方法。 - 請求項1〜24いずれか1項に記載の方法により製造された無欠陥ガラス状炭素材料。
- 3次元(x、y、z)寸法を有する無欠陥ガラス状炭素材料であって、x、y、z寸法の各々が12mmを超え、該ガラス状炭素材料の空隙率が0.05未満である、ガラス状炭素材料。
- 前記x、y、z寸法の各々が、15mmを超える、請求項26に記載のガラス状炭素材料。
- 前記x、y、z寸法の各々が、20mmを超える、請求項26に記載のガラス状炭素材料。
- 前記x、y、z寸法の各々が、40mmを超える、請求項26に記載のガラス状炭素材料。
- 前記x、y、z寸法の各々が100mmを超え、かつ、前記ガラス状炭素材料は補強材料または補強要素を含まない、請求項26に記載のガラス状炭素材料。
- 当該材料内に内部通路ネットワークを含み、当該材料内の隣接する通路間の平均距離は、5mm未満である、請求項26に記載のガラス状炭素材料。
- 当該材料内に内部通路ネットワークを含み、当該材料の隣接する通路間の平均距離は、3mm未満である、請求項26に記載のガラス状炭素材料。
- 当該材料内に内部通路ネットワークを含み、当該材料の隣接する通路間の平均距離は、1mm未満である、請求項26に記載のガラス状炭素材料。
- 当該材料内に内部通路ネットワークを含み、当該材料内の隣接する通路間の平均距離は、0.5mm未満である、請求項26に記載のガラス状炭素材料。
- 当該材料内に内部通路ネットワークを含み、前記内部通路ネットワークは、前記ガラス状炭素材料の全体積のうち0.5未満の体積分率を占める、請求項26に記載のガラス状炭素材料。
- 当該材料内に内部通路ネットワークを含み、前記内部通路ネットワークは、前記ガラス状炭素材料の全体積のうち0.01未満の体積分率を占める、請求項26に記載のガラス状炭素材料。
- 当該材料内に内部通路ネットワークを含み、前記内部通路ネットワークは、0.001〜1mmの範囲の平均直径を有する、請求項26に記載のガラス状炭素材料。
- フィラーを含む、請求項26に記載のガラス状炭素材料。
- 前記フィラーは、黒鉛粉末、黒鉛繊維、炭素粉末、カーボンナノチューブ、金属繊維、金属粉末、金属合金繊維、金属合金粉末、半導体繊維、半導体粉末、半導体金属合金、半導体金属粉末、絶縁体材料、ケイ素青銅合金、銅合金、石英、ケイ素、アルミナ、シリカ、モリブデン、硫化モリブデン、亜鉛、硫化亜鉛、無金属フタロシアニン、銅、ニッケル、鋼、クロム、クロムめっき鋼、および、これらの組み合わせから成る群から選択される材料を含む、請求項38に記載のガラス状炭素材料。
- 請求項26に記載のガラス状炭素材料を含むガラス状炭素物品であって、前記物品は、シール材、ブレーキライニング、電気モータブラシ、および、支持部材から成る群から選択される、ガラス状炭素物品。
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